Solder resistant photopolymer composition
Abstract
Abstract THIS INVENTION RELATES TO A HEAT AND SOLDER RESISTANT SOLID PHOTOPOLYMER COMPOSITION WHICH CAN BE IMAGED AND DEVELOPED AND A PROCESS OF USING SAME. THE SOLDER RESISTANT PHOTOCURABLE COMPOSITION CONSISTS ESSENTIALLY OF A SOLID DIALLYL PHTHALATE PREPOLYMER, I.E. POLY-(DIALLY ORTHOPHTHALATE) AND A LIQUID POLYENE AND POLYTHIOL. THE SOLID COMPOSITION WHEN APPLIED TO A PRINTED CIRCUIT BOARD AND CURED IMAGEWISE IN THE PRESENCE OF A FREE RADICAL GENERATOR PERMITS PASSAGE OF THE BOARD THROUGH A BATH OF MOLTEN SOLDER TO SECURE ELECTRICAL COMPONENTS, THERETO WHEN THE FREE RADICAL GENERATOR IS ACTINIC RADIATION. E.G., UV LIGHT, A CURING RATE ACCELERATOR, E.G., BENZOPHENON IS USUALLY ADDED TO THE COMPOSITION.
Inventors
- 👤 H Kloczewski
- 👤 W Schaeffer
Bibliographic Details
Claims Analysis
Total Claims: 0References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-07-15 | 1978-01-14 | 1978-07-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-07-15 | 1982-01-14 | 1982-07-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-07-15 | 1986-01-14 | 1986-07-16 | $7700.00 | Window Closed / Lapsed |