Thick film conductor compositions

Claim 3

firing the patterned conductor layer in a nonoxidizing atmosphere to effect volatilization of the organic medium, decomposition of the copper oxide and sintering of the inorganic binder; 3. applying to the substrate and the fired conductor layer a patterned layer of thick film resistor paste comprising an admixture of finely divided particles of resistance material and inorganic binder dispersed in organic medium; and 4. firing the patterned resistor layer in a nonoxidizing atmosphere to effect volatilization of the organic medium and sintering of the inorganic

Claim 4

firing the patterned conductor layer in a nonoxidizing atmosphere to effect volatilization of the organic medium, decomposition of the copper oxide and sintering of the inorganic binder; 3. applying to the substrate and the fired conductor layer a patterned layer of thick film resistor paste comprising an admixture of finely divided particles of resistance material and inorganic binder dispersed in organic medium; and 4. firing the patterned resistor layer in a nonoxidizing atmosphere to effect volatilization of the organic medium and sintering of the inorganic

Claim 5

binder. 2. A method of making multilayer interconnection package comprising the sequential steps of: 1. applying to a ceramic substrate a patterned layer of a thick film conductor composition comprising a mixture of finely divided particles of: a. 85-98.8% wt. conductive material consisting essentially of 28-100% wt. copper and 72-0% wt. noble metal; b. 10-1% wt. inorganic binder having a softening point below 800° C.; and c. 5-0.2% wt. of a noncuprous material selected from the group consisting of tungsten, molybdenum, rhenium and alloys and mixtures thereof dispersed in organic medium, the composition being further characterized in that: (1) the copper particles have a maximum size below 10 μm and an average size of 2-4 μm; and (2) the noncuprous metal particles have a maximum size below 5 μm and an average size of 0.2-3 μm.

Claim 6

binder. 2. A method of making multilayer interconnection package comprising the sequential steps of: 1. applying to a ceramic substrate a patterned layer of a thick film conductor composition comprising a mixture of finely divided particles of: a. 85-98.8% wt. conductive material consisting essentially of 28-100% wt. copper and 72-0% wt. noble metal; b. 10-1% wt. inorganic binder having a softening point below 800° C.; and c. 5-0.2% wt. of a noncuprous material selected from the group consisting of tungsten, molybdenum, rhenium and alloys and mixtures thereof dispersed in organic medium, the composition being further characterized in that: (1) the copper particles have a maximum size below 10 μm and an average size of 2-4 μm; and (2) the noncuprous metal particles have a maximum size below 5 μm and an average size of 0.2-3 μm.

Claim 7

firing the patterned conductor layer in a nonoxidizing atmosphere to effect volatilization of the organic medium, decomposition of the copper oxide and sintering of the inorganic binder; 3. applying to the substrate and the fired conductor layer a patterned layer of thick film dielectric paste comprising an admixture of finely divided particles of dielectric solids and inorganic binder dispersed in organic medium, the patterned layer having vias communicating with the underlying conductive layer; 4. firing the patterned dielectric layer in a nonoxidizing atmosphere to effect volatization of the organic medium and sintering of the inorganic binder; 5. applying over the fired dielectric layer a patterned layer of, and filling the vias with, the conductor composition of claim 11; 6. firing the patterned conductor layer and the filled vias in a nonoxidizing atmosphere to effect volatilization of the organic medium, decomposition of the copper oxide and sintering of the inorganic binder; and 7. repeating the sequence of steps 3 to 6.