US4540533A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of encapsulating electronic components by extrusion of plastic material
Assignee: US Philips Corp
•
Filing: 1983-10-26
•
Granted: 1985-09-10
•
Expires: 2003-10-26
Abstract
Abstract Encapsulation of electronic components. Method of encapsulating bare electronic components (11) present in the form of a continuous strip (12) and intended to be provided with envelopes (13, 14) of a defined form made of at least one plastic material (15), characterized in that by extrusion by means of an extrusion head (16) the plastic material (15) is given the profile desired for the said envelopes (13, 14), while the bare electronic components are continuously inserted and immobilized in the said profile, and in that in a final operation common sections of extruded plastic material (15) and of a strip (12) of components are cut so that the bare electronic components (11) thus provided with their envelopes (13, 14) are mutually separated. Application in the manufacture of display elements.
Inventors
- 👤 Diran-Robert Sahakian
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 16:09
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10H; H10H20/00; H10H20/80; H10H20/85; H10H20/852; H10H20/855; H10H20/856; H10H20/882
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
184 words
A method of encapsulating bare electronic components present in the form of a continuous strip in which the said components are aligned in a first direction, the bare electronic components being intended to be provided with envelopes of a defined profile obtained by extrusion, in a direction parallel to the said first direction, of at least one plastic material by means of an extrusion head, characterized in that the method of encapsulation is carried out for components with rigid connection wires extending in a second direction substantially at right angles to the first direction in which the components are aligned, in that the bare electronic components (11) are continuously inserted and immobilized in the envelopes of said profile so that the encapsulation is limited to the components (11) excluding the rigid connection wires, and in that in a final operation common sections of plastic material (15) extruded from said extrusion head, in which the aligned components are inserted and immobilized and of the continous strip (12), are cut so that the bare electronic components (11) provided with their envelopes (13, 14) are mutually separated.
Claim 2
Independent Claim
184 words
A method of encapsulating bare electronic components present in the form of a continuous strip in which the said components are aligned in a first direction, the bare electronic components being intended to be provided with envelopes of a defined profile obtained by extrusion, in a direction parallel to the said first direction, of at least one plastic material by means of an extrusion head, characterized in that the method of encapsulation is carried out for components with rigid connection wires extending in a second direction substantially at right angles to the first direction in which the components are aligned, in that the bare electronic components (11) are continuously inserted and immobilized in the envelopes of said profile so that the encapsulation is limited to the components (11) excluding the rigid connection wires, and in that in a final operation common sections of plastic material (15) extruded from said extrusion head, in which the aligned components are inserted and immobilized and of the continous strip (12), are cut so that the bare electronic components (11) provided with their envelopes (13, 14) are mutually separated.
Claim 3
Dependent Claim
84 words
A method of encapsulation as claimed in claim 1, characterized in that, the plastic material (15) leaving the extrusion head (16) is given a profile comprising a groove (17), in that at the outlet of the extrusion head the said groove is filled continuously with a polymerizable filler resin (30), and in that then the bare electronic components (11) are inserted into the groove (17), after which the said polymerizable filler resin (30) is polymerized so as to immobilize the components in the groove.
Claim 4
Dependent Claim
42 words
A method of encapsulation as claimed in claim 2, characterized in that, before being inserted into the groove (17), the bare electronic components (11) are cured in a polymerizable curing resin, and in that the said polymerizable curing resin (31) is polymerized.
Claim 5
Dependent Claim
23 words
A method of encapsulation as claimed in of claim 2, characterized in that the said polymerizable filler resin (30) is a photopolymerizable resin.
Claim 6
Dependent Claim
59 words
A method of encapsulation as claimed in claim 1, characterized in that the bare electronic components (11) are continuously inserted into the profile of the plastic material (15) by directly introducing the said strip (12) of components into the extrusion head (16), the immobilization of the said components (11) being obtained by enveloping them in the plastic material itself.
Claim 7
Dependent Claim
42 words
A method of encapsulation as claimed in claim 5, characterized in that, before being introduced into the extrusion head (16), the bare electronic components (11) are cured in a polymerizable curing resin, after which the said polymerizable curing resin (31) is polymerized.
Claim 8
Dependent Claim
22 words
A method of encapsulation as claimed in claim 3, characterized in that the said polymerizable curing resin (31) is a photopolymerizable resin.
Claim 9
Dependent Claim
60 words
A method of encapsulation as claimed in claim 6, characterized in that at the outlet of the extrusion head (16) the plastic material (15), which is then in the plasto-elastic state, is caused to pass into a tool (23) provided with two rotatable coplanar heads (20, 21) which give the plastic material the ultimate desired form of the envelope (13).
Claim 10
Dependent Claim
34 words
A method of encapsulation as claimed in claim 8, characterized in that the said tool (23) further comprises a third forming head (24) at right angles to the two rotatable coplanar heads (20, 21).
Claim 11
Dependent Claim
50 words
A method of encapsulation as claimed in claim 1, characterized in that, for manufacturing display elements light-emitting diodes are used as bare electronic components (11), the said envelopes (13, 14) are obtained by simultaneously extruding a first transparent plastic material (25) and a second plastic material (26) comprising diffusing pigments.
Claim 12
Dependent Claim
31 words
A method of encapsulation as claimed in claim 5, characterized in that, for encapsulating bare electronic circuits (11), the said electronic circuits are pre-enveloped by polymerization of a protecting resin (22).
Claim 13
Dependent Claim
54 words
A method of encapsulation as claimed in claim 1, characterized in that, the bare electronic components (11) being light-emitting diodes, the said envelopes (13) are obtained by simultaneously extruding a first transparent plastic material (35) and a second opaque plastic material (36) disposed laterally on either side of the said first transparent plastic material.
Claim 14
Dependent Claim
46 words
A method as claimed in claim 12, characterized in that a third plastic material (37) comprising diffusing pigments is extruded simultaneously with the said first plastic material (35) and the said second plastic material (36) so as to constitute the bottom end of the envelopes (13).
Claim 15
Dependent Claim
25 words
A method as claimed in claim 12, characterized in that the second opaque plastic material (36) is a transparent plastic material doped with titanium oxide.
Claim 16
Dependent Claim
22 words
A method of encapsulation as claimed in claim 3, characterized in that the said polymerizable filler resin (30) is a photopolymerizable resin.
Claim 17
Dependent Claim
22 words
A method of encapsulation as claimed in claim 4, characterized in that the said polymerizable curing resin (31) is a photopolymerizable resin.
Claim 18
Dependent Claim
59 words
A method of encapsulation as claimed in claim 7, characterized in that the outlet of the extrusion head (16), the plastic material (15), which is then in the plasto-elastic state, is caused to pass into a tool (23) provided with two rotatable coplanar heads (20, 21) which give the plastic material the ultimate desired form of the envelopes (13).
Claim 19
Dependent Claim
51 words
A method of encapsulation as claimed in claim 2, characterized in that for manufacturing display elements light-emitting diodes are used as bare electronic element components (11), the said envelopes (13, 14) are obtained by simultaneously extruding a first transparent plastic material (25) and a second plastic material (26) comprising diffusing pigments.
Claim 20
Dependent Claim
30 words
A method of encapsulation as claimed in claim 6, characterized in that for encapsulating bare electronic circuits (11), said electronic circuits are pre-enveloped by polymerization of a protecting resin (22).
Claim 21
Dependent Claim
27 words
A method of encapsulation as claimed in claim 13, characterized in that the second opaque plastic material (36) is a transparent plastic material doped with titanium oxide.
References Cited (Backward Citations)
US2513421A
Cited
US2963747A
Cited
GB960097A
Cited
US3499816A
Cited
US3845552A
Cited
US4148856A
Cited
US4045867A
Cited
US4042654A
Cited
US4073835A
Cited
US4264549A
Cited
US4321425A
Cited
US4294782A
Cited
US4330929A
Cited
JPS56117625A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-09-09 | 1989-03-11 | 1989-09-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-09-09 | 1993-03-11 | 1993-09-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-09-09 | 1997-03-11 | 1997-09-10 | $7700.00 | Window Closed / Lapsed |