US3845552A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making an encapsulated assembly
Assignee: VARO-QUALITY SEMICONDUCTOR Inc
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Filing: 1973-04-23
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Granted: 1974-11-05
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Expires: 1993-04-23
Abstract
Abstract The illustrated embodiment of the present invention is directed to an electronic component which has the discrete electronic element connected in series with interconnecting wires and the two are encapsulated. The electronic element and interconnecting wires are fastened together by connecting joint means to form a series of such components and interconnecting wires. This series of components is fed through an encapsulating die structure which receives encapsulating material therein so that the entire series of components, including the interconnecting wires and connecting joint means, are encapsulated. The electronic elements are diodes and therefore can form high voltage rectifier assemblies which have a plurality of such diodes connected in series to form voltage divider networks having an increased reverse voltage rating. This enables the diode assemblies to be used as high voltage rectifiers in television receivers or the like.
Inventors
No inventors recorded.
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 04:39
CPC Classifications
H; H10; H10W; H10W90/00; B; B29; B29C; B29C48/00; B29C48/15; B29C48/03; B29C48/05; B29C48/06; B29C48/13; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49169; Y10T29/49171; Y10T29/49174; Y10T29/49176
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
162 words
A method of making encapsulated electronic components comprising the steps of: selecting an electronic component including a central body of given, uniform cross-sectional size and shape and a pair of lead wires respectively extending axially from the opposite ends of said body; selecting interconnecting wire members having a cross-sectional size and shape closely corresponding to the cross-sectional size and shape of said central body; joining a said interconnecting wire member substantially end-to-end with each of said lead wires closely adjacent the central body corresponding respectively therewith to produce a serially connected assembly of substantially uniform, cross-sectional size and shape; temporarily locating said assembly in an encapsulation die having a central body portion of substantially uniform internal corss-section; and, during the residence of said assembly in said die, forming a quantity of encapsulating material of substantially uniform thickness over the exterior of said assembly in intimate contact therewith, whereby to provide an encapsulated electronic unit of substantially uniform cross-sectional size throughout its length.
Claim 2
Independent Claim
162 words
A method of making encapsulated electronic components comprising the steps of: selecting an electronic component including a central body of given, uniform cross-sectional size and shape and a pair of lead wires respectively extending axially from the opposite ends of said body; selecting interconnecting wire members having a cross-sectional size and shape closely corresponding to the cross-sectional size and shape of said central body; joining a said interconnecting wire member substantially end-to-end with each of said lead wires closely adjacent the central body corresponding respectively therewith to produce a serially connected assembly of substantially uniform, cross-sectional size and shape; temporarily locating said assembly in an encapsulation die having a central body portion of substantially uniform internal corss-section; and, during the residence of said assembly in said die, forming a quantity of encapsulating material of substantially uniform thickness over the exterior of said assembly in intimate contact therewith, whereby to provide an encapsulated electronic unit of substantially uniform cross-sectional size throughout its length.
Claim 3
Dependent Claim
17 words
A method according to claim 1 wherein said central body and said interconnecting wire members are cylindrical.
Claim 4
Dependent Claim
66 words
A method according to claim 1 wherein the forming of said encapsulating covering is applied by passing said assembly through an extruding die which has an entrance portion to receive said assembly, an intermediate portion to receive encapsulating material and transmit said assembly, and an exit portion for passing said assembly; and wherein the encapsulating material is introduced into said intermediate portion in a semi-fluid state.
Claim 5
Dependent Claim
18 words
A method according to claim 3 wherein said assembly is passed through said die at relatively high speed.
Claim 6
Dependent Claim
26 words
A method according to claim 1 wherein said assembly comprises additional ones of said electronic components and said interconnecting members joined into a serially connected chain.
Claim 7
Dependent Claim
66 words
A method according to claim 5 wherein the forming of said encapsulating covering is applied by passing said assembly through an extruding die which has an entrance portion to receive said assembly, an intermediate portion to receive encapsulating material and transmit said assembly; and an exit portion for passing said assembly; and wherein the encapsulating material is introduced into said intermediate portion in a semi-fluid state.
Claim 8
Dependent Claim
18 words
A method according to claim 6 wherein said assembly is passed through said die at relatively high speed.
Claim 9
Dependent Claim
16 words
A method according to claim 1 wherein said electronic component is a solid state electronic component.
Claim 10
Dependent Claim
38 words
A method according to claim 1 wherein said encapsulating material is applied to said assembly in an encapsulating die and wherein said assembly is introduced into and removed from said die in a relatively short period of time.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-11-04 | 1978-05-06 | 1978-11-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-11-04 | 1982-05-06 | 1982-11-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-11-04 | 1986-05-06 | 1986-11-05 | $7700.00 | Window Closed / Lapsed |