Abstract The photocathode is of the type which comprises a photo-emissive layer consisting of at least an active layer of the P-type, a solid support for said semiconductor of a material which is transparent to radiation, a layer having a bonding glass for the photo-emissive layer on the support. The invention is characterized in that the support comprises two parts situated one on top of the other and which are bonded together, namely a thick second part (thickness for example 5 mm) of a type of glass having properties of thermal expansion which are substantially identical to those of the bonding glass and a part in the form of a disk-shaped first part (thickness for example 1 mm) of a material having softening and transition points which are much higher than those of the bonding glass and of the glass of the thick part.
A photocathode comprising a transparent support bonded by a glass bonding layer to a semiconductor structure comprising a chemical passivating layer on an optical adaptation layer on an electrical passivating layer on a photoemissive layer, the transparent support acting as the window of a tube envelope, wherein the improvement comprises the support being in two parts bonded together as follows: a first part connected to the glass bonding layer and thereby to the chemical passivating layer of the semiconductor structure, this first part comprising a glass having softening and transition temperatures which are higher than those of the glass bonding layer, and a second part for connection to the tube envelope, said second part comprising a glass having softening and transition temperatures and properties of thermal expansion substantially equal to those of the glass bonding layer.
Claim 2
Dependent Claim
136 words
A photocathode comprising a transparent support bonded by a glass bonding layer to a semiconductor structure comprising a chemical passivating layer on an optical adaptation layer on an electrical passivating layer on a photoemissive layer, the transparent support acting as the window of a tube envelope, wherein the improvement comprises the support being in two parts bonded together as follows: a first part connected to the glass bonding layer and thereby to the chemical passivating layer of the semiconductor structure, this first part comprising a glass having softening and transition temperatures which are higher than those of the glass bonding layer, and a second part for connection to the tube envelope, said second part comprising a glass having softening and transition temperatures and properties of thermal expansion substantially equal to those of the glass bonding layer.
Claim 3
Dependent Claim
22 words
A photocathode as claimed in claim 1, wherein the glass bonding layer has a softening temperature between 600° C. and 700° C.