US4535219A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Interfacial blister bonding for microinterconnections
Assignee: Xerox Corp
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Filing: 1982-10-12
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Granted: 1985-08-13
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Expires: 2002-10-12
Abstract
Abstract A method for producing microinterconnections including the steps of providing a first support member bearing electrical circuit elements including first electrical contacts and first electrical traces, providing a second support member bearing electrical circuit elements including second electrical contacts and second electrical traces, placing the second support member in face-to-face spaced and aligned relationship with respect to the first support member, and applying energy to the first support member for moving portions thereof underlying ones of the first contacts toward and into intimacy with aligned ones of the second contacts.
Inventors
- 👤 John W. Sliwa, Jr.
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 10:07
CPC Classifications
H; H10; H10W; H10W99/00; B; B23; B23K; B23K26/00; B23K26/20; B23K26/206; B23K26/21; B23K26/24; B23K26/244; H10W72/00; H10W72/071; H10W72/072; H10W72/07221; H10W72/07227; H10W72/07231; H10W72/07236; H10W72/20; H10W72/251; H10W72/252; H10W72/50; H10W72/531; H10W72/536; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
132 words
A method for producing microinterconnections characterized by including the following steps, providing a first support member bearing electrical circuit elements including first electrical contact means and first electrical trace means, providing a second support member bearing electrical circuit elements including second electrical contact means and second electrical trace means, placing said second support member in face-to-face spaced relationship with respect to said first support member, aligning said second contact means with said first contact means, and applying energy to said first support member for moving portions of said first support member, bearing ones of said first contact means, toward and into intimacy with aligned ones of said second contact means, and for heating said ones of said first contact means to bond aligned ones of said first and second electrical contact means.
Claim 2
Independent Claim
132 words
A method for producing microinterconnections characterized by including the following steps, providing a first support member bearing electrical circuit elements including first electrical contact means and first electrical trace means, providing a second support member bearing electrical circuit elements including second electrical contact means and second electrical trace means, placing said second support member in face-to-face spaced relationship with respect to said first support member, aligning said second contact means with said first contact means, and applying energy to said first support member for moving portions of said first support member, bearing ones of said first contact means, toward and into intimacy with aligned ones of said second contact means, and for heating said ones of said first contact means to bond aligned ones of said first and second electrical contact means.
Claim 3
Dependent Claim
32 words
The method for producing microinterconnections as defined in claim 1 characterized in that said step of applying energy is effected by directing laser illumination at predetermined ones of said first contact means.
Claim 4
Dependent Claim
24 words
The method for producing microinterconnections as defined in claim 1 characterized by applying energy in a blanket manner for moving said first contact means.
Claim 5
Dependent Claim
23 words
The method for producing microinterconnections as defined in claim 3 characterized in that said step of applying energy is effected by conductive heating.
Claim 6
Dependent Claim
23 words
The method of producing microinterconnections as defined in claim 3 characterized in that said step of applying energy is effected by convective heating.
Claim 7
Dependent Claim
23 words
The method for producing microinterconnections as defined in claim 3 characterized in that said step of applying energy is effected by radiant heating.
Claim 8
Dependent Claim
32 words
The method for producing microinterconnections as defined in claim 1 characterized in that said step of applying energy moves portions of said first electrical trace means away from said first support member.
Claim 9
Dependent Claim
75 words
A support member for microinterconnections characterized by including substrate means, electrical circuit means supported upon said substrate means, said circuit means including movable electrical contact means connected to and interconnected by electrical trace means, and selectively deformable means positioned intermediate said substrate and said electrical circuit means, whereby portions of said electrical circuit means may be selectively moved away from said substrate means in response to the application of energy to said selectively deformable means.
Claim 10
Dependent Claim
75 words
A support member for microinterconnections characterized by including substrate means, electrical circuit means supported upon said substrate means, said circuit means including movable electrical contact means connected to and interconnected by electrical trace means, and selectively deformable means positioned intermediate said substrate and said electrical circuit means, whereby portions of said electrical circuit means may be selectively moved away from said substrate means in response to the application of energy to said selectively deformable means.
Claim 11
Dependent Claim
21 words
The support member for microinterconnections as defined in claim 8 characterized in that said selectively deformable means includes a propellant layer.
Claim 12
Dependent Claim
18 words
The support member for microinterconnections as defined in claim 9 characterized in that said propellant layer is patterned.
Claim 13
Dependent Claim
26 words
The support member for microinterconnections as defined in claim 9 characterized in that said propellant layer will expand in response to the application of energy thereto.
Claim 14
Dependent Claim
28 words
The support member for microinterconnections as defined in claim 7 characterized in that said propellant layer will generate a gas in response to the application of energy thereto.
Claim 15
Dependent Claim
27 words
The support member for microinterconnections as defined in claim 8 characterized in that said selectively deformable means includes a propellant layer and an additional energy absorbing layer.
Claim 16
Dependent Claim
39 words
The support member for microinterconnections as defined in claim 8 characterized in that said selectively deformable means includes a propellant layer sandwiched between a reflector layer and a thermally insulating layer, wherein the insulating layer is adjacent said substrate.
Claim 17
Dependent Claim
26 words
The support member for microinterconnections as defined in claim 8 characterized in that said selectively deformable means includes a propellant layer and an overlying diaphragm layer.
Claim 18
Dependent Claim
31 words
The support member for microinterconnections as defined in claim 8 characterized in that said substrate means is optically transparent so that laser energy will pass therethrough into said selectively deformable means.
Claim 19
Dependent Claim
69 words
The support member for microinterconnections as defined in claim 8 characterized by including a masking layer interposed between said substrate means and said selectively deformable means, said masking layer having openings therein adjacent those portions of said electrical circuit means which are desired to be moved away from said substrate means in response to the application of energy to said deformable means in a pattern determined by said mask.
Claim 20
Dependent Claim
21 words
The support member for microinterconnections as defined in claim 8 characterized by including solder means overlying said movable electrical contact means.
Claim 21
Dependent Claim
27 words
The support member for microinterconnections as defined in claim 8 characterized in that said electrical trace means includes stress relieving means adjacent said movable electrical contact means.
Claim 22
Dependent Claim
31 words
The support member for microinterconnections as defined in claim 8 characterized by including spacer means supported upon said substrate means, said spacer means being provided for locating a mating microinterconnection member.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-08-12 | 1989-02-11 | 1989-08-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-08-12 | 1993-02-11 | 1993-08-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-08-12 | 1997-02-11 | 1997-08-13 | $7700.00 | Window Closed / Lapsed |