Antistatic films

Claim 2

A composite structure comprising: (a) a substrate, and (b) a cured film on at least one surface of said substrate, said film comprising the cured reaction product of 1 to 95 weight percent of a hydrolyzate of a hydroxyorganosilane and 5 to 99 weight percent of an aqueous solvent, said hydroxyorganosilane having the general formula: R.sup.1 --Si(OR.sup.2).sub.3 wherein R 1 is a di-hydroxy- or polyhydroxy-substituted organic group selected from: (1) alkyl groups containing from 2 to about 8 carbon atoms and substituted by 2 to 7 hydroxy groups, with any single carbon atom having at most one hydroxy group attached; (2) alkyl groups and cyclic alkyl groups having 2 to 20 carbon atoms, which carbon chain may be interrupted by one or more oxygen atoms and containing at least two hydroxyl groups per 8 carbon atoms with any single carbon atom having at most one hydroxy group attached; (3) aralkyl or alkaryl groups containing 7 to 10 carbon atoms, said aralkyl or alkaryl group having 2 to 8 hydroxy groups, with any single carbon atom having at most one hydroxy group attached; (4) alkenyl groups containing 4 to 8 carbon atoms and 2 to 5 hydroxy groups with any single carbon atom having at most one hydroxy group attached; (5) cyclic or alkyl-substituted cyclic groups having 3 to 8 carbon atoms and substituted by 2 to 7 hydroxy groups, with any single carbon atom having at most one hydroxy group attached; and (6) those groups selected from the group consisting of epoxy, ketal, acetal and ester which, on exhaustive hydrolysis, provide the aforementioned dihydroxy or polyhydroxyalkyl groups, and R 2 is selected from (1) hydrogen, and (2) any organic group such that the --Si(OR 2 ) 3 moiety is hydrolyzable.

Claim 3

A process for preparing a conductive composite structure comprising the steps of: (a) providing a substrate (b) coating said substrate on at least one surface with a composition comprising the reaction product of (1) 1 to 95 weight percent of a hydrolyzate of an organosilane and 5 to 99 weight percent of an aqueous solvent, said organosilane having the general formula: R.sup.1 Si(OR.sup.2).sub.3 wherein R 1 is a hydroxy or polyhydroxy-substituted organic group selected from: (a) alkyl groups containing from 2 to about 8 carbon atoms and substituted by 1 to 7 hydroxy groups, with any single carbon atom having at most one hydroxy group attached; (b) alkyl groups and cyclic alkyl groups having up to 20 carbon atoms, which carbon chain may be interrupted by one or more oxygen atoms and containing at least one hydroxyl group per 8 carbon atoms with any single carbon atom having at most one hydroxy group attached; (c) aralkyl or alkaryl groups containing 7 to 10 carbon atoms, said aralkyl or alkaryl group having 1 to 8 hydroxy groups, with any single carbon atom having at most one hydroxy group attached; (d) alkenyl groups containing up to 8 carbon atoms and 1 to 5 hydroxy groups with any single carbon atom having at most one hydroxy group attached; (e) cyclic or alkyl-substituted cyclic groups having 3 to 8 carbon atoms and substituted by 1 to 7 hydroxy groups, with any single carbon atom having at most one hydroxy group attached; and (f) those groups selected from the group consisting of epoxy, ketal, acetal and ester which, on exhaustive hydrolysis, provide the aforementioned hydroxy or polyhydroxyalkyl groups, and R 2 is selected from: (a) hydrogen, and (b) any organic group such that the --Si(OR 2 ) 3 moiety is hydrolyzable; and (2) 0.001 to 50 weight percent of a silanol-sulfonate compound having the general formula ##STR13## wherein Q is selected from hydroxyl, alkyl groups containing from 1 to about 4 l carbon atoms and alkoxy groups containing from 1 to 4 carbon atoms; X is an organic linking group containing up to 10 carbon atoms; Y is an organic or inorganic cation; r is equal to the valence of Y; and n is 1 or 2; with proviso that the mole ratio of silanol-sulfonate compound to organosilane is less than 5 to 1; and (c) curing said coating composition in situ with at least one curing means selected from heat and radiation.

Claim 4

A process for preparing a conductive composite structure comprising the steps of: (a) providing a substrate (b) coating said substrate on at least one surface with a composition comprising the reaction product of (1) 1 to 95 weight percent of a hydrolyzate of an organosilane and 5 to 99 weight percent of an aqueous solvent, said organosilane having the general formula: R.sup.1 Si(OR.sup.2).sub.3 wherein R 1 is a hydroxy or polyhydroxy-substituted organic group selected from: (a) alkyl groups containing from 2 to about 8 carbon atoms and substituted by 1 to 7 hydroxy groups, with any single carbon atom having at most one hydroxy group attached; (b) alkyl groups and cyclic alkyl groups having up to 20 carbon atoms, which carbon chain may be interrupted by one or more oxygen atoms and containing at least one hydroxyl group per 8 carbon atoms with any single carbon atom having at most one hydroxy group attached; (c) aralkyl or alkaryl groups containing 7 to 10 carbon atoms, said aralkyl or alkaryl group having 1 to 8 hydroxy groups, with any single carbon atom having at most one hydroxy group attached; (d) alkenyl groups containing up to 8 carbon atoms and 1 to 5 hydroxy groups with any single carbon atom having at most one hydroxy group attached; (e) cyclic or alkyl-substituted cyclic groups having 3 to 8 carbon atoms and substituted by 1 to 7 hydroxy groups, with any single carbon atom having at most one hydroxy group attached; and (f) those groups selected from the group consisting of epoxy, ketal, acetal and ester which, on exhaustive hydrolysis, provide the aforementioned hydroxy or polyhydroxyalkyl groups, and R 2 is selected from: (a) hydrogen, and (b) any organic group such that the --Si(OR 2 ) 3 moiety is hydrolyzable; and (2) 0.001 to 50 weight percent of a silanol-sulfonate compound having the general formula ##STR13## wherein Q is selected from hydroxyl, alkyl groups containing from 1 to about 4 l carbon atoms and alkoxy groups containing from 1 to 4 carbon atoms; X is an organic linking group containing up to 10 carbon atoms; Y is an organic or inorganic cation; r is equal to the valence of Y; and n is 1 or 2; with proviso that the mole ratio of silanol-sulfonate compound to organosilane is less than 5 to 1; and (c) curing said coating composition in situ with at least one curing means selected from heat and radiation.

Claim 5

A process for preparing a conductive composite structure comprising the steps of: (a) providing a substrate; (b) coating said substrate on at least one surface with a composition comprising the reaction product of (1) 1 to 95 weight percent of a hydrolyzate of an organosilane and 5 to 99 weight percent of an aqueous solvent, said organosilane having the general formula: R.sup.1 Si(OR.sup.2).sub.3 ps wherein R 1 is a dihydroxy or polyhydroxy-substituted organic group selected from: (a) alkyl groups containing from 2 to about 8 carbon atoms and substituted by 1 to 7 hydroxy groups, with any single carbon atom having at most one hydroxy group attached; (b) alkyl groups and cyclic alkyl groups having up to 20 carbon atoms, which carbon chain may be interrupted by one or more oxygen atoms and containing at least one hydroxyl group per 8 carbon atoms with any single carbon atom having at most one hydroxy group attached; (c) aralkyl or alkaryl groups containing 7 to 10 carbon atoms, said aralkyl or alkaryl group having 1 to 8 hydroxy groups, with any single carbon atom having at most one hydroxy group attached; (d) alkenyl groups containing up to 8 carbon atoms and 1 to 5 hydroxy groups with any single carbon atom having at most one hydroxy group attached; (e) cyclic or alkyl-substituted cyclic groups having 3 to 8 carbon atoms and substituted by 1 to 7 hydroxy groups, with any single carbon atom having at most one hydroxy group attached; and (f) those groups selected from the group consisting of epoxy, ketal, acetal and ester which, on exhaustive hydrolysis, provide the aforementioned hydroxy or polyhydroxyalkyl groups, and R 2 is selected from: (a) hydrogen, and (b) any organic group such that the --Si(OR 2 ) 3 moiety is hydrolyzable.

Claim 6

A process for preparing a conductive composite structure comprising the steps of: (a) providing a substrate; (b) coating said substrate on at least one surface with a composition comprising the reaction product of (1) 1 to 95 weight percent of a hydrolyzate of an organosilane and 5 to 99 weight percent of an aqueous solvent, said organosilane having the general formula: R.sup.1 Si(OR.sup.2).sub.3 ps wherein R 1 is a dihydroxy or polyhydroxy-substituted organic group selected from: (a) alkyl groups containing from 2 to about 8 carbon atoms and substituted by 1 to 7 hydroxy groups, with any single carbon atom having at most one hydroxy group attached; (b) alkyl groups and cyclic alkyl groups having up to 20 carbon atoms, which carbon chain may be interrupted by one or more oxygen atoms and containing at least one hydroxyl group per 8 carbon atoms with any single carbon atom having at most one hydroxy group attached; (c) aralkyl or alkaryl groups containing 7 to 10 carbon atoms, said aralkyl or alkaryl group having 1 to 8 hydroxy groups, with any single carbon atom having at most one hydroxy group attached; (d) alkenyl groups containing up to 8 carbon atoms and 1 to 5 hydroxy groups with any single carbon atom having at most one hydroxy group attached; (e) cyclic or alkyl-substituted cyclic groups having 3 to 8 carbon atoms and substituted by 1 to 7 hydroxy groups, with any single carbon atom having at most one hydroxy group attached; and (f) those groups selected from the group consisting of epoxy, ketal, acetal and ester which, on exhaustive hydrolysis, provide the aforementioned hydroxy or polyhydroxyalkyl groups, and R 2 is selected from: (a) hydrogen, and (b) any organic group such that the --Si(OR 2 ) 3 moiety is hydrolyzable.

Claim 7

The process according to claim 3 further comprising overcoating said composite structure on any exposed surface with a compatible film.

Claim 8

The composite structure according to claim 1 wherein said substrate is selected from the group consisting of ceramic materials, metals, metal oxides, thermoplastic resins, polyesters, polycarbonates, polyamides polyolefins, acrylic resins, polyvinyl chloride, polysilanes, polysiloxanes, thermoset resins, epoxy resins, paper, wood, natural resins, textiles, and foams.

Claim 9

The composite structure according to claim 1 wherein said substrate is primed.

Claim 10

The composite structure according to claim 1 wherein said cured film has a thickness in the range of 0.1 to 25 microns.

Claim 11

The composite structure according to claim 1 wherein said cured film has a thickness in the range of 1 to 10 microns.

Claim 12

The composite structure according to claim 1 further comprising a second continuous or discontinuous film adhered on any exposed surface thereof.

Claim 13

A composite structure comprising: (a) a substrate, and (b) a cured film on at least one surface of said substrate, said film comprising the cured reaction product of (1) 1 to 95 weight percent of a hydrolyzate of an organosilane and 5 to 99 weight percent of an aqueous solvent, said organosilane having the general formula: R.sup.1 Si(OR.sup.2).sub.3 wherein R 1 is a hydroxy or polyhydroxy-substituted organic group selected from: (a) alkyl groups containing from 2 to about 8 carbon atoms and substituted by 1 to 7 hydroxy groups, with any single carbon atom having at most one hydroxy group attached; (b) alkyl groups and cyclic alkyl groups having up to 20 carbon atoms, which carbon chain may be interrupted by one or more oxygen atoms and containing at least one hydroxyl group per 8 carbon atoms with any single atom having at most one hydroxy group attached; (c) aralkyl or alkaryl groups containing 7 to 10 carbon atoms, said aralkyl or alkaryl group having 1 to 8 hydroxy groups, with any single carbon atom having at most one hydroxy group attached; (d) alkenyl groups containing up to 8 carbon atoms and 1 to 5 hydroxy groups with any single carbon atom having at most one hydroxy group attached; (e) cyclic or alkyl-substituted cyclic groups having 3 to 8 carbon atoms and substituted by 1 to 7 hydroxy groups, with any single carbon atom having at most one hydroxy group attached; and (f) those groups selected from the group consisting of epoxy, ketal, acetal and ester which, on exhaustive hydrolysis, provide the aforementioned hydroxy or polyhydroxyalkyl groups, and R 2 is selected from: (a) hydrogen, and (b) any organic group such that the --Si(OR 2 ) 3 moiety is hydrolyzable, and; (2) 0.001 to 50 weight percent of a silanol-sulfonate compound having the general formula ##STR14## wherein Q is selected from hydroxyl, alkyl groups containing from 1 to about 4 carbon atoms and alkoxy groups containing from 1 to 4 carbon atoms; X is an organic linking group containing up to 10 carbon atoms; Y is an organic or inorganic cation; r is equal to the valence of Y; and n is 1 or 2; with the proviso that the mole ratio of silanol-sulfonate compound to organosilane is less than 5 to 1.

Claim 14

A composite structure comprising: (a) a substrate, and (b) a cured film on at least one surface of said substrate, said film comprising the cured reaction product of (1) 1 to 95 weight percent of a hydrolyzate of an organosilane and 5 to 99 weight percent of an aqueous solvent, said organosilane having the general formula: R.sup.1 Si(OR.sup.2).sub.3 wherein R 1 is a hydroxy or polyhydroxy-substituted organic group selected from: (a) alkyl groups containing from 2 to about 8 carbon atoms and substituted by 1 to 7 hydroxy groups, with any single carbon atom having at most one hydroxy group attached; (b) alkyl groups and cyclic alkyl groups having up to 20 carbon atoms, which carbon chain may be interrupted by one or more oxygen atoms and containing at least one hydroxyl group per 8 carbon atoms with any single atom having at most one hydroxy group attached; (c) aralkyl or alkaryl groups containing 7 to 10 carbon atoms, said aralkyl or alkaryl group having 1 to 8 hydroxy groups, with any single carbon atom having at most one hydroxy group attached; (d) alkenyl groups containing up to 8 carbon atoms and 1 to 5 hydroxy groups with any single carbon atom having at most one hydroxy group attached; (e) cyclic or alkyl-substituted cyclic groups having 3 to 8 carbon atoms and substituted by 1 to 7 hydroxy groups, with any single carbon atom having at most one hydroxy group attached; and (f) those groups selected from the group consisting of epoxy, ketal, acetal and ester which, on exhaustive hydrolysis, provide the aforementioned hydroxy or polyhydroxyalkyl groups, and R 2 is selected from: (a) hydrogen, and (b) any organic group such that the --Si(OR 2 ) 3 moiety is hydrolyzable, and; (2) 0.001 to 50 weight percent of a silanol-sulfonate compound having the general formula ##STR14## wherein Q is selected from hydroxyl, alkyl groups containing from 1 to about 4 carbon atoms and alkoxy groups containing from 1 to 4 carbon atoms; X is an organic linking group containing up to 10 carbon atoms; Y is an organic or inorganic cation; r is equal to the valence of Y; and n is 1 or 2; with the proviso that the mole ratio of silanol-sulfonate compound to organosilane is less than 5 to 1.

Claim 15

The composite structure according to claim 10 wherein said film further comprises 1 to 5 weight percent of an acid catalyst.

Claim 16

The composite structure according to claim 10 further comprising a second continuous or discontinuous film adhered to any exposed surface thereof.

Claim 17

The composite structure according to claim 12 wherein said overcoating film is derived from at least one silane monomer, oligomer, polymer, or its hydrolyzate.

Claim 18

The composite structure according to claim 12 wherein said overcoating film is derived from heat or radiation curable silane monomers, or oligomers or hydrolyzates thereof selected from: ##STR15##

Claim 19

The composite structure according to claim 12 wherein said overcoating film is selected from the group consisting of adhesives, gelatin containing layers, photoemulsions, photoconductive coatings, abrasion resistant coatings, and dielectric materials.

Claim 20

The composite structure according to claim 10 wherein Y is selected from hydrogen, alkali metals, alkaline earth metals, transition metals, heavy metals, organic cations of protonated weak bases having an average molecular weight of less than 400 and a pK a of less than 11, and organic cations of strong organic bases having an average molecular weight of less than 400 and a pK a of greater than 11.

Claim 21

The composite structure according to claim 16 wherein Y is hydrogen.

Claim 22

The composite structure according to claim 10 wherein said silanol-sulfonate compound is replaced by a monomeric or polymeric alkyl-, aryl-, alkaryl-, and aralkyl-sulfonic acid, or salt thereof, having up to 20 carbon atoms per sulfonic acid group.

Claim 23

The process according to claim 2 further comprising overcoating said composite structure on any exposed surface with a compatible film.

Claim 24

The process according to claim 2 wherein said cured coating composition is subjected to a cation-exchange procedure.

Claim 25

The process according to claim 20 wherein said cation-exchange procedure employs cationic dyes.