Multi-layer printed circuit board and process for production thereof

Claim 2

A multi-layer printed circuit board produced by laminating a plurality of unit circuit sheets having circuit layers on at least one surface of said unit circuit sheets in which a resin composition has been impregnated and cured via prepreg resin sheets, said prepreg resin sheets having been prepared by impregnating reinforcing substrates with a polyimide resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature (Tg 1 ) of the cured resin in the unit circuit sheets and the glass transition temperature (Tg 2 ) of the resin in the prepreg resin sheets after cured, and binding the laminated sheets with heating under pressure at a temperature equal to or lower than both the temperatures of Tg 1 and Tg 2 .

Claim 3

A multi-layer printed circuit board according to claim 1, wherein both the temperatures of Tg 1 and Tg 2 are 170° C. or higher.

Claim 4

A multi-layer printed circuit board according to claim 1, wherein said resin composition has a curing temperature between 160°-180° C., and wherein said binding with heating is performed at a temperature of 160°-180° C. to cure the resin in the prepreg sheets.

Claim 5

A multi-layer printed circuit bard according to claim 1, wherein said polyimide resin composition is impregnated into the reinforcing substrates as a varnish of the polyimide resin composition in an organic solvent.

Claim 6

A multi-layer printed circuit board according to claim 1, wherein the polyimide resin with which said reinforcing substrates has been impregnated is a resin composition selected from the group consisting of (a) a composition containing dicyanamide, or dicyanamide and an imidazole or an aromatic diamine, or a prepolymer thereof; and (b) a composition containing a polymaleimide, an aromatic diamine, an epoxy resin and a s-triazine amine compound, or a prepolymer thereof.

Claim 7

A multi-layer printed circuit board produced by laminating a plurality of unit circuit sheets having circuit layers on at least one surface of said unit circuit sheets in which a resin composition has been impregnated and cured via prepreg resin sheets, said prepreg resin sheets having been preprared by impregnating reinforcing substrates with a resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature (Tg 1 ) of the cured resin in the unit circuit sheets and the glass transition temperature (Tg 2 ) of the resin in the prepreg resin sheets after cured, and binding the laminated sheets with heating under pressure at a temperature equal to or lower than both the temperatures of Tg 1 and Tg 2 , and wherein the resin composition for at least the prepreg resin sheet comprises: (I) a prepolymer obtained by preliminarily reacting with heating (a) a bisimide of the formula ##STR7## wherein R is a divalent organic group having at least one carbon-carbon double bond; and R 1 is a divalent organic group having at least two carbon atoms, and (b) a diamine of the formula: H.sub.2 N--R.sub.2 --NH.sub.2 ( 2) wherein R 2 is a divalent organic group having at least two carbon atoms, (II) an epoxy resin, and (III) at least one amine selected from the group consisting of a s-triazine type amine compound of the formula: ##STR8## wherein R 3 , R 4 and R 5 are independently hydrogen, halogen, a hydrocarbon group, an amino group, a hydroxyl group, an amino-substituted hydrocarbon group, a hydroxyl-substituted hydrocarbon group, or a hydrocarbon-substituted amino group, and at least one of R 3 , R 4 and R 5 being an amino group or an amino-substituted hydrocarbon group, and dicyandiamide.

Claim 8

A multi-layer printed circuit board produced by laminating a plurality of unit circuit sheets having circuit layers on at least one surface of said unit circuit sheets in which a resin composition has been impregnated and cured via prepreg resin sheets, said prepreg resin sheets having been preprared by impregnating reinforcing substrates with a resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature (Tg 1 ) of the cured resin in the unit circuit sheets and the glass transition temperature (Tg 2 ) of the resin in the prepreg resin sheets after cured, and binding the laminated sheets with heating under pressure at a temperature equal to or lower than both the temperatures of Tg 1 and Tg 2 , and wherein the resin composition for at least the prepreg resin sheet comprises: (I) a prepolymer obtained by preliminarily reacting with heating (a) a bisimide of the formula ##STR7## wherein R is a divalent organic group having at least one carbon-carbon double bond; and R 1 is a divalent organic group having at least two carbon atoms, and (b) a diamine of the formula: H.sub.2 N--R.sub.2 --NH.sub.2 ( 2) wherein R 2 is a divalent organic group having at least two carbon atoms, (II) an epoxy resin, and (III) at least one amine selected from the group consisting of a s-triazine type amine compound of the formula: ##STR8## wherein R 3 , R 4 and R 5 are independently hydrogen, halogen, a hydrocarbon group, an amino group, a hydroxyl group, an amino-substituted hydrocarbon group, a hydroxyl-substituted hydrocarbon group, or a hydrocarbon-substituted amino group, and at least one of R 3 , R 4 and R 5 being an amino group or an amino-substituted hydrocarbon group, and dicyandiamide.

Claim 9

A multi-layer printed circuit board according to claim 6, wherein the amine is benzoguanamine, 2,4-diamino-s-triazine, 2,4-diamino-6-methyl-s-triazine, melamine, or dicyandiamide.

Claim 10

A multi-layer printed circuit board produced by laminating a plurality of unit circuit sheets having circuit layers on at least one surface of said unit circuit sheets in which a resin composition has been impregnated and cured via prepreg resn sheets, said prepreg resin sheets having been prepared by impregnating reinforcing substrates with a polyimide resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature (Tg 1 ) of the cured resin in the unit circuit sheets and the glass transition temperature (Tg 2 ) of the resin in the prepreg resin sheets after cured, and binding the laminated sheets with heating under pressure at a temperature equal to or lower than both the temperatures of Tg 1 and Tg 2 , and wherein the resin used in the resin composition for impregnating the unit circuit sheets is selected from the group consisting of addition polymerization polyimide resins, dehydration condensation polyimide resins, triazine resins and cyanate resins.

Claim 11

A multi-layer printed circuit board produced by laminating a plurality of unit circuit sheets having circuit layers on at least one surface of said unit circuit sheets in which a resin composition has been impregnated and cured via prepreg resn sheets, said prepreg resin sheets having been prepared by impregnating reinforcing substrates with a polyimide resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature (Tg 1 ) of the cured resin in the unit circuit sheets and the glass transition temperature (Tg 2 ) of the resin in the prepreg resin sheets after cured, and binding the laminated sheets with heating under pressure at a temperature equal to or lower than both the temperatures of Tg 1 and Tg 2 , and wherein the resin used in the resin composition for impregnating the unit circuit sheets is selected from the group consisting of addition polymerization polyimide resins, dehydration condensation polyimide resins, triazine resins and cyanate resins.

Claim 12

A multi-layer printed circuit board produced by laminating a plurality of unit circuit sheets having circuit layers on at least one surface of said unit circuit sheets in which a resin composition has been impregnated and cured via prepreg resin sheets, said prepreg resin sheets having been prepared by impregnating reinforcing substrates with a resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature (Tg 1 ) of the cured resin in the unit circuit sheets and the glass transition temperature (Tg 2 ) of the resin in the prepreg resin sheets after cured, and binding the laminated sheets with heating under pressure at a temperature equal to or lower than both the temperatures of Tg 1 and Tg 2 , and wherein the resin composition for at least the prepreg resin sheet comprises: (I) a prepolymer obtained by preliminarily reacting with heating (a) a bisimide of the formula ##STR9## wherein R is a divalent organic group having at least one carbon-carbon double bond; and R 1 is a divalent organic group having at least two carbon atoms, and (b) a diamine of the formula: H.sub.2 N--R.sub.2 --NH.sub.2 ( 2) wherein R 2 is a divalent organic group having at least two carbon atoms, (II) an epoxy resin, and (III) at least one amine selected from the group consisting of a s-triazine type amine compound of the formula: ##STR10## wherein R 3 , R 4 and R 5 are independently hydrogen, halogen, a hydrocarbon group, an amino group, a hydroxyl group, an amino-substituted hydrocarbon group, a hydroxyl-substituted hydrocarbon group, or a hydrocarbon-substituted amino group, and at least one of R 3 , R 4 and R 5 being an amino group or an amino-substituted hydrocarbon group, and dicyandiamide, and wherein the resin used in the resin composition for impregnating the unit circuit sheets is selected from the group consisting of addition polymerization polyimide resins, dehydration condensation polyimide resins, triazine resins and cyanate resins.

Claim 13

A multi-layer printed circuit board produced by laminating a plurality of unit circuit sheets having circuit layers on at least one surface of said unit circuit sheets in which a resin composition has been impregnated and cured via prepreg resin sheets, said prepreg resin sheets having been prepared by impregnating reinforcing substrates with a resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature (Tg 1 ) of the cured resin in the unit circuit sheets and the glass transition temperature (Tg 2 ) of the resin in the prepreg resin sheets after cured, and binding the laminated sheets with heating under pressure at a temperature equal to or lower than both the temperatures of Tg 1 and Tg 2 , and wherein the resin composition for at least the prepreg resin sheet comprises: (I) a prepolymer obtained by preliminarily reacting with heating (a) a bisimide of the formula ##STR9## wherein R is a divalent organic group having at least one carbon-carbon double bond; and R 1 is a divalent organic group having at least two carbon atoms, and (b) a diamine of the formula: H.sub.2 N--R.sub.2 --NH.sub.2 ( 2) wherein R 2 is a divalent organic group having at least two carbon atoms, (II) an epoxy resin, and (III) at least one amine selected from the group consisting of a s-triazine type amine compound of the formula: ##STR10## wherein R 3 , R 4 and R 5 are independently hydrogen, halogen, a hydrocarbon group, an amino group, a hydroxyl group, an amino-substituted hydrocarbon group, a hydroxyl-substituted hydrocarbon group, or a hydrocarbon-substituted amino group, and at least one of R 3 , R 4 and R 5 being an amino group or an amino-substituted hydrocarbon group, and dicyandiamide, and wherein the resin used in the resin composition for impregnating the unit circuit sheets is selected from the group consisting of addition polymerization polyimide resins, dehydration condensation polyimide resins, triazine resins and cyanate resins.

Claim 14

A prepreg resin sheet prepared by impregrating a reinforcing substrate with a polyimide resin composition which can be cured at a temperature equal to or lower than the glass transition temperature (Tg 2 ) of the resin after cured, said Tg 2 being 170° C. or higher.

Claim 15

A prepreg resin sheet prepared by impregrating a reinforcing substrate with a polyimide resin composition which can be cured at a temperature equal to or lower than the glass transition temperature (Tg 2 ) of the resin after cured, said Tg 2 being 170° C. or higher.

Claim 16

A prepreg resin sheet prepared by impregnating a reinforcing substrate with a polyimide resin composition which can be cured at a temperature equal to or lower than the glass transition temperature (Tg 2 ) of the resin after cured, said Tg 2 being 170° C. or higher, and wherein the resin composition comprises: (I) a prepolymer obtained by preliminarily reacting with heating (a) a bisimide of the formula: ##STR11## wherein R is a divalent organic group having at least one carbon-carbon double bond; and R 1 is a divalent organic group having at least two carbon atoms, and (b) a diamine of the formula: H.sub.2 N--R.sub.2 --NH.sub.2 ( 2) wherein R 2 is a divalent organic group having at least two carbon atoms, (II) an epoxy resin, and (III) at least one amine selected from the group consisting of a s-triazine type amine compound of the formula: ##STR12## wherein R 3 , R 4 and R 5 are independently hydrogen, halogen, a hydrocarbon group, an amino group, a hydroxyl group, an amino-substituted hydrocarbon group, a hydroxyl-substituted hydrocarbon group, or a hydrocarbon-substituted amino group, and at least one of R 3 , R 4 and R 5 being an amino group or an amino-substituted hydrocarbon group, and dicyandiamide.

Claim 17

A prepreg resin sheet prepared by impregnating a reinforcing substrate with a polyimide resin composition which can be cured at a temperature equal to or lower than the glass transition temperature (Tg 2 ) of the resin after cured, said Tg 2 being 170° C. or higher, and wherein the resin composition comprises: (I) a prepolymer obtained by preliminarily reacting with heating (a) a bisimide of the formula: ##STR11## wherein R is a divalent organic group having at least one carbon-carbon double bond; and R 1 is a divalent organic group having at least two carbon atoms, and (b) a diamine of the formula: H.sub.2 N--R.sub.2 --NH.sub.2 ( 2) wherein R 2 is a divalent organic group having at least two carbon atoms, (II) an epoxy resin, and (III) at least one amine selected from the group consisting of a s-triazine type amine compound of the formula: ##STR12## wherein R 3 , R 4 and R 5 are independently hydrogen, halogen, a hydrocarbon group, an amino group, a hydroxyl group, an amino-substituted hydrocarbon group, a hydroxyl-substituted hydrocarbon group, or a hydrocarbon-substituted amino group, and at least one of R 3 , R 4 and R 5 being an amino group or an amino-substituted hydrocarbon group, and dicyandiamide.

Claim 18

A prepreg resin sheet according to claim 11, wherein the amine is benzoganamine, 2,4-diamino-s-triazine, 2,4-diamino-6-methyl-s-triazine, or dicyandiamide.

Claim 19

A prepreg resin sheet according to claim 11, wherein R has 2 to 10 carbon atoms, R 1 has 2 to 40 carbon atoms, and R 2 has 2 to 40 carbon atoms.

Claim 20

A prepreg resin sheet according to claim 11, wherein the bisimide of (a) is at least one selected from the group consisting of N,N'-ethylenebismaleimide, N,N'-hexamethylenebismaleimide, N,N'-m-phenylenebismaleimide, N,N'-p-phenylenebismaleimide, N,N'-4,4'-diphenylmethanebismaleimide, N,N'-4,4'-diphenyletherbismaleimide, N,N'-4,4'-diphenylsufonebismaleimide, N,N'-4,4'-dicyclohexylmethanebismaleimide, N,N'-α,α'-4,4'-dimethylenecyclohexanebismaleimide, N,N'-m-methaxylenebismaleimide, N,N'-4,4'-diphenylcyclohexanebismaleimide, and N,N'-methylenebis(3-chloro-p-phenylene)bismaleimide; the diamine (b) is at least one selected from the group consisting of 4,4'-diaminodicyclohexylmethane, 1,4-diaminocyclohexane, 2,6-diaminopyridine, m-phenylenediamine, p-phenylenediamine, 4,4'-diaminodiphenylmethane, 2,2'-bis(4-aminophenyl)propane, benzidine, 4,4'-diaminophenyl oxide, 4,4'-diaminodiphenylsulfone, bis(4-aminophenyl)phenylphosphone oxide, bis(4-aminophenyl)methylamine, 1,5-diaminonaphthalene, m-xylenediamine, p-xylenediamine, hexamethylenediamime, 6,6'-diamine-2,2'-pyridyl, 4,4'-diaminobenzophenone, 4,4'-diaminoazobenzene, bis(4-aminophenyl)phenylmethane, 1,1-bis(4-aminophenyl)cyclohexane, 1,1-bis(4-amino-3-methylphenyl)cyclohexane, 2,5-bis(m-aminophenyl)-1,3,4-oxadiazole, 2,5-bis(p-aminophenyl)-1,3,4-oxadiazole, 2,5-bis(m-aminophenyl)thiazo(4,5-d)thiazole, 5,5'-di(m-aminophenyl)-(2,2')-bis-(1,3,4-oxadiazolyl), 4,4'-diaminodiphenylether, 4,4'-bis(p-aminophenyl)-2,2'-dithiazole, m-bis(4-p-aminophenyl-2-thiazolyl)benzene, 4,4'-diaminobenzanilide, 4,4'-diaminophenyl benzoate, N,N'-bis(4-aminobenzyl)-p-phenylenediamine, and 4,4'-methylenebis(2-chloroaniline); the epoxy resin of (II) is at least one selected from the group consisting of bisphenol A diglycidyl ether, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate, 4,4'-(1,2-epoxyethyl)biphenyl, 4,4'-di(1,2-epoxyethyl)diphenyl ether, resorcindiglycidyl ether, bis(2,3-epoxycyclopentyl)ether, N,N'-m-phenylenebis(4,5'-epoxy-1,2-cyclohexanedicarboxyimide), triglycidyl compounds of p-amino-phenol, 1,3,5-tri(1,2-epoxyethyl)benzene, tetraglycidoxytetraphenylethane, and polyglycidyl ether of phenol-formaldehyde novolak resin; and the amine of (III) is at least one selected from the group consisting of melamine, 2-amino-s-triazine, 2-amino-4-phenyl-s-triazine, 2-amino-4-phenyl-s-triazine, 2-amino-4,6-diethyl-s-triazine, 2-amino-4,6-diphenyl-s-triazine, 2-amino-4,6-bis(p-methoxyphenyl)-s-triazine, 2-amino-4-anilino-s-triazine, 2-amino-4-phenoxy-s-triazine, 2-amino-4-chloro-s-triazine, 2-amino-4-aminomethyl-6-chloro-s-triazine, 2-(p-aminophenyl)-4,6-dichloro-s-triazine, 2,4-diamino-s-triazine, 2,4-diamino-6-methyl-s-triazine, 2,4-diamino-6-phenyl-s-triazine, 2,4-diamino-6-benzyl-s-triazine, 2,4-diamino-6-(p-aminophenyl)-s-triazine, 2,4-diamino-6-(m-aminophenyl)-s-triazine, 4-amino-6-phenyl-s-triazine-2-ol, and 6-amino-s-triazine-2,4-diol.

Claim 21

A prepreg resin sheet according to claim 14, wherein a polyvalent maleimide of the following formula: ##STR13## wherein n is 0.1 to 3.0 on the average, is used with the bismaleimide of (a).

Claim 22

A prepreg resin sheet prepared by impregnating a reinforcing substrate with a polyimide resin composition which can be cured at a temperature equal to or lower than the glass transition temperature (Tg 2 ) of the resin after cured, said Tg 2 being 170° C. or higher, and wherein the resin used in the resin composition for impregnating the unit circuit sheets is selected from the group consisting of addition polymerization polyimide resins, dehydration condensation polyimide resins, triazine resins and cyanate resins.

Claim 23

A prepreg resin sheet prepared by impregnating a reinforcing substrate with a polyimide resin composition which can be cured at a temperature equal to or lower than the glass transition temperature (Tg 2 ) of the resin after cured, said Tg 2 being 170° C. or higher, and wherein the resin used in the resin composition for impregnating the unit circuit sheets is selected from the group consisting of addition polymerization polyimide resins, dehydration condensation polyimide resins, triazine resins and cyanate resins.

Claim 24

A prepreg resin sheet prepared by impregnating a reinforcing substrate with a polyimide resin composition which can be cured at a temperature equal to or lower than the glass transition temperature (Tg 2 ) of the resin after cured, said Tg 2 being 170° C. or higher, and wherein the resin composition comprises: (I) a prepolymer obtained by preliminarily reacting with heating (a) a bisimide of the formula: ##STR14## wherein R is a divalent organic group having at least one carbon-carbon double bond; and R 1 is a divalent organic group having at least two carbon atoms, and (b) a diamine of the formula: H.sub.2 N--R.sub.2 --NH.sub.2 ( 2) wherein R 2 is a divalent organic group having at least two carbon atoms, (II) an epoxy resin, and (III) at least one amine selected from the group consisting of a s-triazine type amine compound of the formula: ##STR15## wherein R 3 , R 4 and R 5 are independently hydrogen, halogen, a hydrocarbon group, an amino group, a hydroxyl group, an amino-substituted hydrocarbon group, a hydroxyl-substituted hydrocarbon group, or a hydrocarbon-substituted amino group, and at least one of R 3 , R 4 and R 5 being an amino group or an amino-substituted hydrocarbon group, and dicyandiamide, and wherein the resin used in the resin composition for impregnating the unit circuit sheets is selected from the group consisting of addition polymerization polyimide resins, dehydration condensation polyimide resins, triazine resins and cyanate resins.

Claim 25

A prepreg resin sheet prepared by impregnating a reinforcing substrate with a polyimide resin composition which can be cured at a temperature equal to or lower than the glass transition temperature (Tg 2 ) of the resin after cured, said Tg 2 being 170° C. or higher, and wherein the resin composition comprises: (I) a prepolymer obtained by preliminarily reacting with heating (a) a bisimide of the formula: ##STR14## wherein R is a divalent organic group having at least one carbon-carbon double bond; and R 1 is a divalent organic group having at least two carbon atoms, and (b) a diamine of the formula: H.sub.2 N--R.sub.2 --NH.sub.2 ( 2) wherein R 2 is a divalent organic group having at least two carbon atoms, (II) an epoxy resin, and (III) at least one amine selected from the group consisting of a s-triazine type amine compound of the formula: ##STR15## wherein R 3 , R 4 and R 5 are independently hydrogen, halogen, a hydrocarbon group, an amino group, a hydroxyl group, an amino-substituted hydrocarbon group, a hydroxyl-substituted hydrocarbon group, or a hydrocarbon-substituted amino group, and at least one of R 3 , R 4 and R 5 being an amino group or an amino-substituted hydrocarbon group, and dicyandiamide, and wherein the resin used in the resin composition for impregnating the unit circuit sheets is selected from the group consisting of addition polymerization polyimide resins, dehydration condensation polyimide resins, triazine resins and cyanate resins.

Claim 26

A combined material system for producing a multi-layer printed circircuit board comprising (i) at least one unit circuit sheet having circuit layers on at least one surface of said sheet in which a resin composition has been impregnated and cured, said cured resin having a glass transition temperature (Tg 1 ) of 170° C. or higher, and (ii) at least one prepreg resin sheet having been prepared by impregnating a reinforcing substrate with a polyimide resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature of Tg 1 and the glass transition temperature (Tg 2 ) of the resin in the prepreg resin sheet after cured, said Tg 2 being 170° C. or higher.

Claim 27

A combined material system for producing a multi-layer printed circircuit board comprising (i) at least one unit circuit sheet having circuit layers on at least one surface of said sheet in which a resin composition has been impregnated and cured, said cured resin having a glass transition temperature (Tg 1 ) of 170° C. or higher, and (ii) at least one prepreg resin sheet having been prepared by impregnating a reinforcing substrate with a polyimide resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature of Tg 1 and the glass transition temperature (Tg 2 ) of the resin in the prepreg resin sheet after cured, said Tg 2 being 170° C. or higher.

Claim 28

A combined material system for producing a multi-layer printed circuit board comprising: (i) at least one unit circuit sheet having circuit layers on at least one surface of said sheet in which a resin composition has been impregnated and cured, said cured resin having a glass transition temperature (Tg 1 ) of 170° C. or higher, and (ii) at least one prepreg resin sheet having been prepared by impregnating a reinforcing substrate with a resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature of Tg 1 and the glass transition temperature (Tg 2 ) of the resin in the prepreg resin sheet after cured, said Tg 2 being 170° C. or higher, and wherein the resin composition for at least the prepreg resin sheet comprises: (I) a prepolymer obtained by preliminarily reacting with heating (a) a bisimide of the formula: ##STR16## wherein R is a divalent organic group having at least one carbon-carbon double bond; and R 1 is a divalent organic group having at least two carbon atoms, and (b) a diamine of the formula: H.sub.2 N--R.sub.2 --NH.sub.2 ( 2) wherein R 2 is a divalent organic group having at least two carbon atoms; (II) an epoxy resin; and (III) at least one amine selected from the group consisting of a s-triazine type amine compound of the formula: ##STR17## wherein R 3 , R 4 and R 5 are independently hydrogen, halogen, a hydrocarbon group, an amino group, a hydroxyl group, an amino-substituted hydrocarbon group, a hydroxyl-substituted hydrocarbon group, or a hydrocarbon-substituted amino group, and at least one of R 3 , R 4 and R 5 being an amino group or an amino-substituted hydrocarbon group, and dicyandiamide.

Claim 29

A combined material system for producing a multi-layer printed circuit board comprising: (i) at least one unit circuit sheet having circuit layers on at least one surface of said sheet in which a resin composition has been impregnated and cured, said cured resin having a glass transition temperature (Tg 1 ) of 170° C. or higher, and (ii) at least one prepreg resin sheet having been prepared by impregnating a reinforcing substrate with a resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature of Tg 1 and the glass transition temperature (Tg 2 ) of the resin in the prepreg resin sheet after cured, said Tg 2 being 170° C. or higher, and wherein the resin composition for at least the prepreg resin sheet comprises: (I) a prepolymer obtained by preliminarily reacting with heating (a) a bisimide of the formula: ##STR16## wherein R is a divalent organic group having at least one carbon-carbon double bond; and R 1 is a divalent organic group having at least two carbon atoms, and (b) a diamine of the formula: H.sub.2 N--R.sub.2 --NH.sub.2 ( 2) wherein R 2 is a divalent organic group having at least two carbon atoms; (II) an epoxy resin; and (III) at least one amine selected from the group consisting of a s-triazine type amine compound of the formula: ##STR17## wherein R 3 , R 4 and R 5 are independently hydrogen, halogen, a hydrocarbon group, an amino group, a hydroxyl group, an amino-substituted hydrocarbon group, a hydroxyl-substituted hydrocarbon group, or a hydrocarbon-substituted amino group, and at least one of R 3 , R 4 and R 5 being an amino group or an amino-substituted hydrocarbon group, and dicyandiamide.

Claim 30

A combined material system according to claim 19, wherein the amine is benzoguanamine, 2,4-diamino-s-triazine, 2,4-diamino-6-methyl-s-triazine, melamine, or dicyandiaminde.

Claim 31

A combined material system according to claim 19, wherein the resin composition is a polyimide resin composition, and the polyimide resin composition is impregnated into the reinforcing substrate as a varnish of the polyimide resin composition in an organic solvent.

Claim 32

A combined material system for producing a multi-layer printed circuit board comprising: (i) at least one unit cirucuit sheet having circuit layers on at least one surface of said sheet in which a resin composition has been impregnated and cured, said cured resin having a glass transition temperature (Tg 1 ) of 170° C. or higher, and (ii) at least one prepreg resin sheet having been prepared by impregnating a reinforcing substrate with a resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature of Tg 1 and the glass transition temperature (Tg 2 ) of the resin in the prepreg resin sheet after cured, said Tg 2 being 170° C. or higher, and wherein the unit circuit sheet contains a polyimide resin and the prepreg resin sheet contains a resin composition comprising: (I) a prepolymer obtained by preliminarily reacting with heating (a) a bisimide of the formula: ##STR18## wherein R is a divalent organic group having at least one carbon-carbon double bond; and R 1 is a divalent organic group having at least two carbon atoms; and (b) a diamine of the formula: H.sub.2 N--R.sub.2 --NH.sub.2 ( 2) wherein R 2 is a divalent organic group having at least two carbon atoms, (II) an epoxy resin, and (III) at least one amine selected from the group consisting of a s-triazine type amine compound of the formula: ##STR19## wherein R 3 , R 4 and R 5 are independently hydrogen, halogen, a hydrocarbon group, an amino group, a hydroxyl group, an amino-substituted hydrocarbon group, a hydroxyl-substituted hydrocarbon group, or a hydrocarbon-substituted amino group, and at least one of R 3 , R 4 and R 5 being an amino group or an amino-substituted hydrocarbon group, and dicyandiamide.

Claim 33

A combined material system for producing a multi-layer printed circuit board comprising: (i) at least one unit cirucuit sheet having circuit layers on at least one surface of said sheet in which a resin composition has been impregnated and cured, said cured resin having a glass transition temperature (Tg 1 ) of 170° C. or higher, and (ii) at least one prepreg resin sheet having been prepared by impregnating a reinforcing substrate with a resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature of Tg 1 and the glass transition temperature (Tg 2 ) of the resin in the prepreg resin sheet after cured, said Tg 2 being 170° C. or higher, and wherein the unit circuit sheet contains a polyimide resin and the prepreg resin sheet contains a resin composition comprising: (I) a prepolymer obtained by preliminarily reacting with heating (a) a bisimide of the formula: ##STR18## wherein R is a divalent organic group having at least one carbon-carbon double bond; and R 1 is a divalent organic group having at least two carbon atoms; and (b) a diamine of the formula: H.sub.2 N--R.sub.2 --NH.sub.2 ( 2) wherein R 2 is a divalent organic group having at least two carbon atoms, (II) an epoxy resin, and (III) at least one amine selected from the group consisting of a s-triazine type amine compound of the formula: ##STR19## wherein R 3 , R 4 and R 5 are independently hydrogen, halogen, a hydrocarbon group, an amino group, a hydroxyl group, an amino-substituted hydrocarbon group, a hydroxyl-substituted hydrocarbon group, or a hydrocarbon-substituted amino group, and at least one of R 3 , R 4 and R 5 being an amino group or an amino-substituted hydrocarbon group, and dicyandiamide.

Claim 34

A combined material system according to claim 22, wherein the amine is benzoguanamine 2,4-diamino-s-triazine, 2,4-diamino-6-methyl-s-triazine, melamine, or dicyandiamide.

Claim 35

A combined material system for producing a multi-layer printed circuit board comprising (i) at least one unit circuit sheet having circuit layers on at least one surface of said sheet in which a resin composition has been impregnated and cured, said cured resin having a glass transition temperature (Tg 1 ) of 170° C. or higher, and (ii) at least one prepreg resin sheet having been prepared by impregnating a reinforcing substrate with a polyimide resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature of Tg 1 and the glass transition temperature (Tg 2 ) of the resin in the prepreg resin sheet after cured, said Tg 2 being 170° C. or higher, and wherein the resin used in the resin composition for impregnating the unit circuit sheets is selected from the group consisting of addition polymerization polyimide resins, dehydration condensation polyimide resins, triazine resins and cyanate resins.

Claim 36

A combined material system for producing a multi-layer printed circuit board comprising (i) at least one unit circuit sheet having circuit layers on at least one surface of said sheet in which a resin composition has been impregnated and cured, said cured resin having a glass transition temperature (Tg 1 ) of 170° C. or higher, and (ii) at least one prepreg resin sheet having been prepared by impregnating a reinforcing substrate with a polyimide resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature of Tg 1 and the glass transition temperature (Tg 2 ) of the resin in the prepreg resin sheet after cured, said Tg 2 being 170° C. or higher, and wherein the resin used in the resin composition for impregnating the unit circuit sheets is selected from the group consisting of addition polymerization polyimide resins, dehydration condensation polyimide resins, triazine resins and cyanate resins.

Claim 37

A combined material system for producing a multi-layer printed circuit board comprising: (i) at least one unit circuit sheet having circuit layers on at least one surface of said sheet in which a resin composition has been impregnated and cured, said cured resin having a glass transition temperature (Tg 1 ) of 170° C. or higher, and (ii) at least one prepreg resin sheet having been prepared by impregnating a reinforcing substrate with a resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature of Tg 1 and the glass transition temperature (Tg 2 ) of the resin in the prepreg resin sheet after cured, said Tg 2 being 170° C. or higher, and wherein the resin composition for at least the prepreg resin sheet comprises: (I) a prepolymer obtained by preliminarily reacting with heating (a) a bisimide of the formula: ##STR20## wherein R is a divalent organic group having at least one carbon-carbon double bond; and R 1 is a divalent organic group having at least two carbon atoms, and (b) a diamine of the formula: H.sub.2 N--R.sub.2 --NH.sub.2 ( 2) wherein R 2 is a divalent organic group having at least two carbon atoms; (II) an epoxy resin; and (III) at least one amine selected from the group consisting of a s-triazine type amine compound of the formula: ##STR21## wherein R 3 , R 4 and R 5 are independently hydrogen, halogen, a hydrocarbon group, an amino group, a hydroxyl group, an amino-substituted hydrocarbon group, a hydroxyl-substituted hydrocarbon group, or a hydrocarbon-substituted amino group, and at least one of R 3 , R 4 and R 5 being an amino group or an amino-substituted hydrocarbon group, and dicyandiamide, and wherein the resin used in the resin composition for impregnating the unit circuit sheets is selected from the group consisting of addition polymerization polyimide resins, dehydration condensation polyimide resins, triazine resins, and cyanate resins.

Claim 38

A combined material system for producing a multi-layer printed circuit board comprising: (i) at least one unit circuit sheet having circuit layers on at least one surface of said sheet in which a resin composition has been impregnated and cured, said cured resin having a glass transition temperature (Tg 1 ) of 170° C. or higher, and (ii) at least one prepreg resin sheet having been prepared by impregnating a reinforcing substrate with a resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature of Tg 1 and the glass transition temperature (Tg 2 ) of the resin in the prepreg resin sheet after cured, said Tg 2 being 170° C. or higher, and wherein the resin composition for at least the prepreg resin sheet comprises: (I) a prepolymer obtained by preliminarily reacting with heating (a) a bisimide of the formula: ##STR20## wherein R is a divalent organic group having at least one carbon-carbon double bond; and R 1 is a divalent organic group having at least two carbon atoms, and (b) a diamine of the formula: H.sub.2 N--R.sub.2 --NH.sub.2 ( 2) wherein R 2 is a divalent organic group having at least two carbon atoms; (II) an epoxy resin; and (III) at least one amine selected from the group consisting of a s-triazine type amine compound of the formula: ##STR21## wherein R 3 , R 4 and R 5 are independently hydrogen, halogen, a hydrocarbon group, an amino group, a hydroxyl group, an amino-substituted hydrocarbon group, a hydroxyl-substituted hydrocarbon group, or a hydrocarbon-substituted amino group, and at least one of R 3 , R 4 and R 5 being an amino group or an amino-substituted hydrocarbon group, and dicyandiamide, and wherein the resin used in the resin composition for impregnating the unit circuit sheets is selected from the group consisting of addition polymerization polyimide resins, dehydration condensation polyimide resins, triazine resins, and cyanate resins.

Claim 39

A process for producing a multi-layer circuit board which comprises laminating a plurality of unit circuit sheets having circuit layers on at least one surface of said unit circuit sheets in which a resin composition has been impregnated and cured, via prepreg resin sheets, said prepreg resin sheets having been prepared by impregnating a reinforcing substrate with a polyimide resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature (Tg 1 ) of the cured resin in the unit circuit sheets and the glass transition temperature (Tg 2 ) of the resin in the prepreg resin sheets after cured, and binding the laminated sheets with heating underpressure of 5 to 30 Kg/cm 2 and at a temperature equal to or lower than 180° C. and both the temperatures of Tg 1 and Tg 2 .

Claim 40

A process for producing a multi-layer circuit board which comprises laminating a plurality of unit circuit sheets having circuit layers on at least one surface of said unit circuit sheets in which a resin composition has been impregnated and cured, via prepreg resin sheets, said prepreg resin sheets having been prepared by impregnating a reinforcing substrate with a polyimide resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature (Tg 1 ) of the cured resin in the unit circuit sheets and the glass transition temperature (Tg 2 ) of the resin in the prepreg resin sheets after cured, and binding the laminated sheets with heating underpressure of 5 to 30 Kg/cm 2 and at a temperature equal to or lower than 180° C. and both the temperatures of Tg 1 and Tg 2 .

Claim 41

A process according to claim 26, wherein both the temperatures of Tg 1 and Tg 2 are 170° C. or higher.

Claim 42

A process according to claim 26, wherein the polyimide resin composition is impregnated into the reinforcing substrate as a varnish of the polyimide resin composition in an organic solvent.

Claim 43

A process according to claim 26, wherein the polyimide resin composition with which the reinforcing substrate has been impregnated is a resin composition selected from the group consisting of (a) a composition containing dicyanamide, or dicyanamide and an imidazole or an aromatic diamine, or a prepolymer thereof; and (b) a composition containing a polymaleimide, an aromatic diamine, an epoxy resin and a s-triazine amine compound, or a prepolymer thereof.

Claim 44

A process according to claim 26, wherein the pressure for binding the laminated sheets is 5 to 30 kg/cm 2 .

Claim 45

Product formed by the process of claim 26.

Claim 46

A process according to claim 26, wherein the resin composition for at least the prepreg resin sheet comprises (I) a prepolymer obtained by preliminarily reacting with heating (a) a bisimide of the formula: ##STR22## wherein R is a divalent organic group having at least one carbon-carbon double bond; and R 1 is a divalent organic group having at least two carbon atoms, and (b) a diamine of the formula: H.sub.2 N--R.sub.2 --NH.sub.2 ( 2) wherein R 2 is a divalent organic group having at least two carbon atoms, (II) an epoxy resin, and (III) at least one amine selected from the group consisting of a s-triazine type amine compound of the formula: ##STR23## wherein R 3 , R 4 and R 5 are independently hydrogen, halogen, a hydrocarbon group, an amino group, a hydroxyl group, an amino-substituted hydrocarbon group, a hydroxyl-substituted hydrocarbon group, or a hydrocarbon-substituted amino group, and at least one of R 3 , R 4 and R 5 being an amino group or an amino-substituted hydrocarbon group, and dicyandiamide.

Claim 47

Product formed by the process of claim 32.

Claim 48

A process according to claim 26, wherein said binding is achieved by curing the resin in the prepreg resin sheets with said heating under pressure.

Claim 49

A process according to claim 34, wherein the curing is performed at a temperature of 160°-180° C.