US4520313A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor testing and apparatus therefor
Assignee: ASM America Inc
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Filing: 1982-03-30
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Granted: 1985-05-28
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Expires: 2002-03-30
Abstract
Abstract A semiconductor die is positioned and examined by means of scanning certain strategic regions which border or overlap said die. The video which results from the scanning is digitized. For example, black is represented by an "0" and white is represented by a "1". The results may be compared with an acceptable pattern to determine a good die and statistically analyzed to see if the data represents the die or surrounding street.
Inventors
- 👤 Laurence L. Allred, Jr.
- 👤 Bradley N. Lange
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 20:36
CPC Classifications
G; G01; G01R; G01R31/00; G01R31/28; G01R31/282; G01R31/2831
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
91 words
A method of locating and testing a semiconductor die surrounded by a border region comprising: scanning preselected regions of said die and said border region to generate a video signal corresponding thereto; digitizing said video signal such that a light region of said die represented by a first potential and a dark region of said die is represented by a second potential; storing said digitized video signal of said preselected regions; and comparing said stored digitized video signal with a stored digitized video signal which corresponds to an acceptable semiconductor die.
Claim 2
Independent Claim
91 words
A method of locating and testing a semiconductor die surrounded by a border region comprising: scanning preselected regions of said die and said border region to generate a video signal corresponding thereto; digitizing said video signal such that a light region of said die represented by a first potential and a dark region of said die is represented by a second potential; storing said digitized video signal of said preselected regions; and comparing said stored digitized video signal with a stored digitized video signal which corresponds to an acceptable semiconductor die.
Claim 3
Dependent Claim
31 words
A method according to claim 1 further comprising: summing and averaging the occurrences of said first potential in each of said preselected regions to locate an edge of said semiconductor die.
Claim 4
Dependent Claim
79 words
A method according to claim 2 wherein said preselected regions correspond to top, bottom, left and right regions, said top region overlapping a middle portion of a top edge of said semiconductor die, said bottom region overlapping a middle portion of a bottom edge of said semiconductor die, said left region overlapping a middle portion of a left edge of said semiconductor die, and said right region overlapping a middle portion of a right edge of said semiconductor die.
Claim 5
Dependent Claim
28 words
A method according to claim 3 further comprising scanning first, second, third and fourth corner regions and digitizing the video signal therefrom to locate and align semiconductor die.
Claim 6
Dependent Claim
30 words
A method according to claim 1 further comprising summing and averaging the occurrences of said first potential in each of said preselected regions to locate defects in said semiconductor die.
Claim 7
Dependent Claim
44 words
A method according to claim 5 wherein said preselected regions correspond to center and side regions, said center region scanning a central region of said semiconductor die, said side regions scanning the lengths of top, bottom left and right sides of said semiconductor die.
Claim 8
Dependent Claim
15 words
A method according to claim 1 further comprising altering the size of said preselected regions.
Claim 9
Dependent Claim
15 words
A method according to claim 1 further comprising displaying alpha numerics on a video screen.
Claim 10
Dependent Claim
29 words
A method according to claim 8 further comprising displaying on a video screen, in combination, said digitized die and border video signals; said preselected regions; and said alpha numerics.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-05-27 | 1988-11-26 | 1989-05-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-05-27 | 1992-11-26 | 1993-05-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-05-27 | 1996-11-26 | 1997-05-28 | $7700.00 | Window Closed / Lapsed |