US4518630A
Expired / Lapsed
US
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Method for forming silicon oxide films
Assignee: Siemens AG
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Filing: 1983-02-10
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Granted: 1985-05-21
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Expires: 2003-02-10
Abstract
Abstract Method for forming silicon oxide layers on silicon surfaces with at least two oxidation steps, in which a first step (B 1 ) is performed at a low oxidation temperature (T 1 ) in an atmosphere containing a mixture of oxygen and hydrogen chloride with a low hydrogen chloride concentration, and in which a second step (B 3 ) is performed at a high oxidation temperature (T 2 ), characterized by the feature that the second step (B 3 ) is performed in a dry oxygen atmosphere. An intermediate step (B 2 ) may also be employed for heating from the low temperature to the high temperature.
Inventors
- 👤 Leo Grasser
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 11:02
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/60; H10P14/63; H10P14/6302; H10P14/6304; H10P14/6306; H10P14/6308; H10P14/6309; H10P14/6322
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
175 words
Method for forming silicon oxide layers on silicon surfaces which comprises subjecting the silicon surface to at least two oxidation steps; (a) a first oxidation step carried out at a low oxidation temperature in the range of 700° C. to 900° C. in an atmosphere containing a mixture of oxygen and hydrochloric acid with a low hydrochloric acid concentration, (b) a second oxidation step carried out at a higher oxidation temperature of at least 100° C. above the low oxidation temperature of the first step and within the temperature range of 850° C. to 1050° C., and in a dry oxygen atmosphere, (c) an intermediate step between step (a) and step (b) wherein the oxidation temperature is increased from the low oxidation temperature of step (a) to the high oxidation temperature of step (b), in an atmosphere containing a mixture of oxygen and hydrochloric acid with a low hydrochloric acid concentration, and (d) immediately after the second oxidation step (b) carrying out a cooling-down step to cool down the silicon oxide on the silicon surface.
Claim 2
Dependent Claim
175 words
Method for forming silicon oxide layers on silicon surfaces which comprises subjecting the silicon surface to at least two oxidation steps; (a) a first oxidation step carried out at a low oxidation temperature in the range of 700° C. to 900° C. in an atmosphere containing a mixture of oxygen and hydrochloric acid with a low hydrochloric acid concentration, (b) a second oxidation step carried out at a higher oxidation temperature of at least 100° C. above the low oxidation temperature of the first step and within the temperature range of 850° C. to 1050° C., and in a dry oxygen atmosphere, (c) an intermediate step between step (a) and step (b) wherein the oxidation temperature is increased from the low oxidation temperature of step (a) to the high oxidation temperature of step (b), in an atmosphere containing a mixture of oxygen and hydrochloric acid with a low hydrochloric acid concentration, and (d) immediately after the second oxidation step (b) carrying out a cooling-down step to cool down the silicon oxide on the silicon surface.
Claim 3
Dependent Claim
21 words
Method according to claim 1, wherein in the first step (a) the hydrochloric acid concentration is 2.5 to 4 volume %.
Claim 4
Dependent Claim
24 words
Method according to claim 1, wherein the first step (a) is carried out at an oxidation temperature of about 750° C. to 850° C.
Claim 5
Dependent Claim
24 words
Method according to claim 2, wherein the first step (a) is carried out at an oxidation temperature of about 750° C. to 850° C.
Claim 6
Dependent Claim
24 words
Method according to claim 1, wherein the second step (b) is carried out at an oxidation temperature of about 900° C. to 1000° C.
Claim 7
Dependent Claim
24 words
Method according to claim 2, wherein the second step (b) is carried out at an oxidation temperature of about 900° C. to 1000° C.
Claim 8
Dependent Claim
24 words
Method according to claim 3, wherein the second step (b) is carried out at an oxidation temperature of about 900° C. to 1000° C.
References Cited (Backward Citations)
US28385A
Cited
USRE28385E
Cited
US3837905A
Cited
US4268538A
Cited
US4275094A
Cited
US4293590A
Cited
US4293589A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-05-20 | 1988-11-19 | 1989-05-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-05-20 | 1992-11-19 | 1993-05-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-05-20 | 1996-11-19 | 1997-05-21 | $7700.00 | Window Closed / Lapsed |