Temperature testing apparatus for an electronic circuit substrate

Claim 1

An apparatus for testing the reflow-soldering temperature profile on an electronic circuit substrate having a heated surface exposed to a source of heat and a test surface where the reflow soldering is to take place and which has the temperature profile to be tested, comprising: an aperture extending through the substrate between the two surfaces, with a recess surrounding the aperture and adjacent to the heated surface; a bolt having a head, the bolt extending through the aperture in the substrate and beyond, with the head of the bolt located in the recess; screw threads on a portion of the bolt extending beyond the test surface of the substrate; a flat spring having an aperture therethrough, the flat spring oriented to bear against the test surface of the substrate, with the bolt extending through the aperture in the flat spring; a pressure plate having an aperture therethrough, the pressure plate oriented to press the flat spring against the test surface of the substrate, with the bolt extending through the aperture of the pressure plate; a coil spring positioned around the bolt and oriented to press the pressure plate toward the test surface of the substrate; a nut having internal threads engaging the threads of the bolt, the threaded engagement being sufficient for the nut to deflect the coil spring by an arbitrary amount; a wire-guiding groove extending around the nut; a thermocouple having at least one electrical wire extending therefrom, the thermocouple located between the substrate and the flat spring, the flat spring being deflected sufficient to accommodate and exert a force upon the thermocouple to hold the thermocouple in place, the thermocouple wire being wrapped about the wire-guiding groove; and a flexible thermal and electrical insulator located between the flat spring and the thermocouple.

Claim 2

An apparatus for testing the reflow-soldering temperature profile on an electronic circuit substrate having a heated surface exposed to a source of heat and a test surface where the reflow soldering is to take place and which has the temperature profile to be tested, comprising: an aperture extending through the substrate between the two surfaces, with a recess surrounding the aperture and adjacent to the heated surface; a bolt having a head, the bolt extending through the aperture in the substrate and beyond, with the head of the bolt located in the recess; screw threads on a portion of the bolt extending beyond the test surface of the substrate; a flat spring having an aperture therethrough, the flat spring oriented to bear against the test surface of the substrate, with the bolt extending through the aperture in the flat spring; a pressure plate having an aperture therethrough, the pressure plate oriented to press the flat spring against the test surface of the substrate, with the bolt extending through the aperture of the pressure plate; a coil spring positioned around the bolt and oriented to press the pressure plate toward the test surface of the substrate; a nut having internal threads engaging the threads of the bolt, the threaded engagement being sufficient for the nut to deflect the coil spring by an arbitrary amount; a wire-guiding groove extending around the nut; a thermocouple having at least one electrical wire extending therefrom, the thermocouple located between the substrate and the flat spring, the flat spring being deflected sufficient to accommodate and exert a force upon the thermocouple to hold the thermocouple in place, the thermocouple wire being wrapped about the wire-guiding groove; and a flexible thermal and electrical insulator located between the flat spring and the thermocouple.

Claim 3

An apparatus for testing a time-dependent temperature profile comprising: an electronic circuit substrate having a heated surface exposed to a source of heat and a test surface having the temperature profile to be tested; means for sensing the temperature of the test surface of the substrate; a flat spring having two ends and oriented to yieldably press with substantially one end thereof the temperature-sensing means against the test surface of the substrate with a force proportional to the amount of flexure experienced by the flat spring; means for thermally insulating the flat spring from the temperature-sensing means; and means for pressing the other end of the flat spring toward the test surface of the substrate, with a force that is manually adjustable.

Claim 4

An apparatus for testing a time-dependent temperature profile comprising: an electronic circuit substrate having a heated surface exposed to a source of heat and a test surface having the temperature profile to be tested; means for sensing the temperature of the test surface of the substrate; a flat spring having two ends and oriented to yieldably press with substantially one end thereof the temperature-sensing means against the test surface of the substrate with a force proportional to the amount of flexure experienced by the flat spring; means for thermally insulating the flat spring from the temperature-sensing means; and means for pressing the other end of the flat spring toward the test surface of the substrate, with a force that is manually adjustable.

Claim 8

An apparatus for testing a time-dependent, reflowsoldering temperature profile of an electronic circuit substrate having a heated surface exposed to a source of heat and a test surface where the reflow soldering is to take place and which has the temperature profile to be tested, comprising: a thermocouple having at least one electrical wire extending therefrom, the thermocouple located in contact with the test surface of the substrate; a flexible thermal and electrical insulator in contact with the thermocouple and located on the side of the thermocouple opposite from the substrate; a flat spring in contact with the side of the insulator opposite from the thermocouple and oriented to press the thermocouple against the test surface of the substrate; a pressure plate in contact with the side of the flat spring opposite from the insulator and oriented to press the flat spring toward the test surface of the substrate; a coil spring oriented to press the pressure plate toward the test surface of the substrate and means to selectively read the temperature sensed by the thermocouple.

Claim 9

An apparatus for testing a time-dependent, reflowsoldering temperature profile of an electronic circuit substrate having a heated surface exposed to a source of heat and a test surface where the reflow soldering is to take place and which has the temperature profile to be tested, comprising: a thermocouple having at least one electrical wire extending therefrom, the thermocouple located in contact with the test surface of the substrate; a flexible thermal and electrical insulator in contact with the thermocouple and located on the side of the thermocouple opposite from the substrate; a flat spring in contact with the side of the insulator opposite from the thermocouple and oriented to press the thermocouple against the test surface of the substrate; a pressure plate in contact with the side of the flat spring opposite from the insulator and oriented to press the flat spring toward the test surface of the substrate; a coil spring oriented to press the pressure plate toward the test surface of the substrate and means to selectively read the temperature sensed by the thermocouple.