Abstract A lithography system for X-ray or other beam printing on a substrate such as a silicon semiconductor wafer comprises a beam chamber (301), a beam source (302), means (309) for mounting a mask, means (308) for mounting an image sensing means (342) interiorly of the chamber, means (317, 318), for mounting a substrate (307) in multiple including six degrees of freedom and means (308, 292, 320-322) including the image sensing means to align the mask and substrate relative to one another utilizing alignment patterns on the mask and substrate, images of which are brought into registration and sensed by the image sensing means. In a preferred embodiment three sets of target images are provided so as to adjust the substrate and mask relative orientation in six degrees of freedom. The mask seals helium within the chamber. The mask and the substrate are aligned in situ in the same position in which the mask and substrate are to be exposed to the beam. Means (313, 314, 311, 312) are provided for loading masks, calibration assemblies and substrate-holding means. The source-to-substrate distance is adjustable as is the mask-to-substrate gap. To conserve helium volume adjustable optic objectives (342) are provided in the chamber to sense registration of alignment targets on each of the mask and substrate, with essentially the remainder of the optics outside the chamber. Improved compression optics (408) are also provided in the alignment system.
A lithography system for a substrate printing sequence comprising: a beam chamber having a gaseous interior environment of high permeability to x-rays; means for mounting a x-ray beam source adjacent one end of the chamber; means for adjustably mounting a mask at a position across an opposite end of said chamber; means for movably mounting a plurality of objective lenses in said chamber above said mask; means for movably mounting a substrate in parallelism to and at a side of said mask opposite said source to receive a beam image extending through said mask; means for providing alignment targets on each of said mask and said substrate; and means, including a laser light source, said objective lenses and optics, for aligning said alignment targets on said mask with respect to said alignment targets on said substrate by relative movement of said mask and substrate with respect to each other, said optics being located exteriorly of said beam chamber.
Claim 2
Dependent Claim
158 words
A lithography system for a substrate printing sequence comprising: a beam chamber having a gaseous interior environment of high permeability to x-rays; means for mounting a x-ray beam source adjacent one end of the chamber; means for adjustably mounting a mask at a position across an opposite end of said chamber; means for movably mounting a plurality of objective lenses in said chamber above said mask; means for movably mounting a substrate in parallelism to and at a side of said mask opposite said source to receive a beam image extending through said mask; means for providing alignment targets on each of said mask and said substrate; and means, including a laser light source, said objective lenses and optics, for aligning said alignment targets on said mask with respect to said alignment targets on said substrate by relative movement of said mask and substrate with respect to each other, said optics being located exteriorly of said beam chamber.
Claim 3
Dependent Claim
35 words
The system of claim 1 including a laser light transmitting window in said chamber to pass incident laser illumination to said targets and target alignment information from said plurality of objective lenses to said optics.
Claim 4
Dependent Claim
19 words
The system of claim 1 including a mask positioner for movably holding and adjusting said mask on said chamber.
Claim 5
Dependent Claim
20 words
The system of claim 1 in which said mask is mounted for in situ adjustible movement with respect said chamber.