Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
219 words
A multi-wavelength optical demultiplexer comprising a substrate; a first relatively thick layer of a direct band gap semiconductor material deposited on said substrate; a first relatively thin layer of latticed matched material having a larger band gap than the materials in the first thick layer, deposited on said first relatively thick layer, for serving as a potential barrier to prevent photo-electrons generated in one layer from entering another; a second relatively thick layer of direct band gap semiconductor material deposited on said first relatively thin layer; a second relatively thin layer of latticed matched material having a larger band gap than the materials on said substrate, deposited on said second relatively thick layer, for serving as a potential barrier to prevent photo-electrons generated in adjacent thick layer from entering another; a third relatively thick layer of direct band gap semiconductor material deposited on said second relatively thin layer; and ohmic contacts of donor impurity diffusion at opposite ends of each of said relatively thick layers, wherein each of said relatively thick layers is on the order of one to ten microns thick to achieve good absorption, and wherein each of said relatively thin layers is on the order of 100 Angstroms thick, large enough to serve as electron barriers, but thin enough to pass optical frequencies without significant loss.
Claim 2
Dependent Claim
219 words
A multi-wavelength optical demultiplexer comprising a substrate; a first relatively thick layer of a direct band gap semiconductor material deposited on said substrate; a first relatively thin layer of latticed matched material having a larger band gap than the materials in the first thick layer, deposited on said first relatively thick layer, for serving as a potential barrier to prevent photo-electrons generated in one layer from entering another; a second relatively thick layer of direct band gap semiconductor material deposited on said first relatively thin layer; a second relatively thin layer of latticed matched material having a larger band gap than the materials on said substrate, deposited on said second relatively thick layer, for serving as a potential barrier to prevent photo-electrons generated in adjacent thick layer from entering another; a third relatively thick layer of direct band gap semiconductor material deposited on said second relatively thin layer; and ohmic contacts of donor impurity diffusion at opposite ends of each of said relatively thick layers, wherein each of said relatively thick layers is on the order of one to ten microns thick to achieve good absorption, and wherein each of said relatively thin layers is on the order of 100 Angstroms thick, large enough to serve as electron barriers, but thin enough to pass optical frequencies without significant loss.
Claim 3
Dependent Claim
19 words
The demultiplexer as recited in claim 1 wherein each of said relatively thin layers consists essentially of aluminum arsenide.
Claim 4
Dependent Claim
55 words
The demultiplexer as recited in claim 1 wherein said substrate is GaAs, said first relatively thick layer is Al c Ga 1-c As, said second relatively thick layer is Al b Ga 1-b As, said third relatively thick layer is Al a Ga 1-a As, each of said relatively thin layers is AlAs, and a>b>c.
Claim 5
Dependent Claim
12 words
The demuliplexer as recited in claim 3 wherein said impurity is silicon.
Claim 6
Dependent Claim
86 words
The demultiplexer as recited in claim 3 wherein said first relatively thick layer is molecular beam epitaxially deposited on said substrate, said first relatively thin layer is molecular beam epitaxially deposited on said first relatively thick layer, said second relatively thick layer is molecular beam epitaxially deposited on said first relatively thin layer, said second relatively thin layer is molecular beam epitaxially deposited on said second relatively thick layer, and said third relatively thick layer is molecular beam epitaxially deposited on said second relatively thin layer.
Claim 7
Dependent Claim
22 words
The demultiplexer as recited in claim 1 wherein each of said relatively thick layers is on the order of 10 μm thick.
Claim 8
Dependent Claim
9 words
The demultiplexer as recited in claim 3 wherein a≦0.37.
Claim 9
Dependent Claim
98 words
The demultiplexer as recited in claim 1 wherein said first relatively thick layer is Ga 0 .9 Al 0 .1 As and has a thickness on the order of one to three microns; said second relatively thick layer is Ga 0 .8 Al 0 .2 As and has a thickness on the order of one to three microns; said third relatively thick layer is Ga 0 .7 Al 0 .3 As and has a thickness on the order of one to three microns; and each of said relatively thin layers is Ga 0 .63 Al 0 .37 As.
Claim 10
Dependent Claim
63 words
Tthe demultiplexer as recited in claim 1 wherein said substrate is indium phosphide, said first relatively thick layer is In c Ga 1-c As x P 1-x , said second relatively thick layer is In b Ga 1-b As y P 1-y , said third relatively thick layer is In a Ga 1-a As z P 1-z , a>b>c, x=2.16(1-c), y=2.16(1-b), and z=2.16(1-a).
Claim 11
Dependent Claim
86 words
The demultiplexer as recited in claim 9 wherein said first relatively thick layer is molecular beam epitaxially deposited on said substract, said first relatively thin layer is molecular beam epitaxially deposited on said first relatively thick layer, said second relatively thick layer is molecular beam epitaxially deposited on said first relatively thin layer, said second relatively thin layer is molecular beam epitaxially deposited on said second relatively thick layer, and said third relatively thick layer is molecular beam epitaxially deposited on said second relatively thin layer.