Package for rugged electronics

Claim 1

An Electronic module for an ordnance projectile for utilization in environments wherein the substrate module would be subject to very high mechanical stress, comprising: at least three substrates having electronic components thereon, each of said substrates having first and second interconnecting tab means extending therefrom, each of which tab means interlocks with complementary tab means interlocks with complementary tab means extending from the substrate adjacent said tab means to form a module of relatively high mechanical strength in order to withstand high mechanical stress; wherein each of said substrates is planar and has two sides and top and bottom edges and said first and second tab means are disposed on each side of each substrate, respectively; and each of said substrates are tapered inwardly toward the top such that the bottom edge of the substrate is longer than the top edge; wherein said interconnecting tab means mechanically and electrically directly interconnect said substrate to the tab means on a similar adjacent substrate; wherein said electrically interconnecting tabs are soldered to complementary electrically interconnecting tabs on a similar substrate so as to secure the the electrical conduction path across these complementary conducting traces; and wherein said mechanically interconnecting tab means interlock along a surface plane that is perpendicular to the direction of flight of said ordnance projectile wherein said direction of flight is also parallel to the direction in which primary mechanical stress occurs, while the electrically interconnecting tabs interlock along a surface plane that is parallel to said primary mechanical stress such that the mechanically interconnecting tabs receive most of the mechanical stress.