Patent US4507340A successfully refreshed from Google Patents.
US4507340A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Adhesives and devices coated therewith
Assignee: Raychem Corp
•
Filing: 1980-07-31
•
Granted: 1985-03-26
•
Expires: 2000-07-31
Abstract
Abstract Novel curable adhesives are solid, substantially free of cross-linking and substantially tack-free at 25° C.; remain substantially uncured when maintained for extended periods at 80° C.; have an initial viscosity of 10 3 to 10 4 poise at 150° C. and cure relatively slowly at 150° C.; and cure rapidly at 200° C. The adhesives preferably contain at least one epoxy resin, particularly an epoxy resin having a softening point of at least 50° C. and an epoxy equivalent weight of at least 200 in combination with an epoxy resin which is liquid at 25° C. or an elastomer or other compatible high molecular weight polymer. The adhesive preferably also contains a high temperature curing agent and preferably also a filler, which may be particulate or fibrous. The novel adhesives are particularly useful in combination with heat-recoverable devices, e.g. devices comprising components made of heat-recoverable metal.
Inventors
- 👤 James A. Rinde
- 👤 Eugene F. Lopez
- 👤 Leon C. Glover
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 22:22
CPC Classifications
B; B29; B29C; B29C61/00; B29C61/06; B29C61/0608; B29C61/0616; C; C08; C08G; C08G59/00; C08G59/18; C08G59/20; C08G59/32; C08G59/38; C09; C09J; C09J163/00; Y; Y10; Y10S; Y10S138/00; Y10S138/01; Y10S174/00; Y10S174/08; Y10T; Y10T428/00; Y10T428/13; Y10T428/1328; Y10T428/31504; Y10T428/31511; Y10T428/31529
Claims Analysis
Total Claims: 30
Claim 1
Independent Claim
213 words
A heat-recoverable device which recovers at a temperature of 100° to 200° C. and which comprises an elastically deformed member held in an elastically deformed state by a polymeric restraint which, when heated, weakens, but does not melt or flow, at a temperature between 100° and 200° C. and thus permits elastic recovery of said elastically deformed member, said device having on a surface thereof which can contact another surface as a result of such elastic recovery a layer of a curable adhesive composition which (a) is solid, substantially free of cross-linking and substantially tack-free at 25° C.; (b) after having been heated rapidly to 80° C., maintained at 80° C. for 10 days, and heated rapidly to 150° C., has a viscosity at 150° C. of at most 5×10 4 poise; (c) when heated rapidly to 150° C. has an initial viscosity at 150° C. of 10 3 to 10 4 poise and after having been maintained at 150° C. for 1 hour has a viscosity at 150° C. of at most 5×10 4 poise; and (d) when heated rapidly to 200° C. and after having been maintained at 200° C. for 10 minutes is substantially void-free and has cured to a viscosity at 200° C. of at least 5×10 5 poise.
Claim 2
Dependent Claim
213 words
A heat-recoverable device which recovers at a temperature of 100° to 200° C. and which comprises an elastically deformed member held in an elastically deformed state by a polymeric restraint which, when heated, weakens, but does not melt or flow, at a temperature between 100° and 200° C. and thus permits elastic recovery of said elastically deformed member, said device having on a surface thereof which can contact another surface as a result of such elastic recovery a layer of a curable adhesive composition which (a) is solid, substantially free of cross-linking and substantially tack-free at 25° C.; (b) after having been heated rapidly to 80° C., maintained at 80° C. for 10 days, and heated rapidly to 150° C., has a viscosity at 150° C. of at most 5×10 4 poise; (c) when heated rapidly to 150° C. has an initial viscosity at 150° C. of 10 3 to 10 4 poise and after having been maintained at 150° C. for 1 hour has a viscosity at 150° C. of at most 5×10 4 poise; and (d) when heated rapidly to 200° C. and after having been maintained at 200° C. for 10 minutes is substantially void-free and has cured to a viscosity at 200° C. of at least 5×10 5 poise.
Claim 3
Dependent Claim
99 words
A device according to claim 1 wherein said composition has at least one of the following characteristics (e) it is solid, substantially free of cross-linking and substantially tack-free at 50° C.; (f) after having been heated rapidly to 80° C., maintained at 80° C. for 165 days, and heated rapidly to 150° C., it has a viscosity at 150° C. of at most 5×10 4 poise; and (g) after having been heated rapidly to 200° C. and maintained at 200° C. for 5 minutes, it has cured to a viscosity at 200° C. of at least 5×10 5 poise.
Claim 4
Dependent Claim
37 words
A device according to claim 1 wherein said composition contains at least 65% by weight of a curable resin component, at least 40% by weight of said curable resin component being at least one polyfunctional epoxy resin.
Claim 5
Dependent Claim
20 words
A device according to claim 3 wherein said composition contains at least 85% by weight of said curable resin component.
Claim 6
Dependent Claim
42 words
A device according to claim 3 wherein said curable resin component comprises at least 40% by weight of at least one solid epoxy resin having a softening point of at least 50° C. and an epoxy equivalent weight of at least 110.
Claim 7
Dependent Claim
23 words
A device according to claim 3 wherein at least 70% by weight of said curable resin component is at least one epoxy resin.
Claim 8
Dependent Claim
42 words
A device according to claim 6 wherein said curable resin component comprises at least 40% by weight of at least one solid epoxy resin having a softening point of at least 50° C. and an epoxy equivalent weight of at least 110.
Claim 9
Dependent Claim
15 words
A device according to claim 7 wherein said epoxy resin comprises an epoxy novolak resin.
Claim 10
Dependent Claim
75 words
A device according to claim 6 wherein said curable resin component comprises (a) 10 to 30% by weight of a flexible epoxy resin having a viscosity at 25° C. of 10 to 100 poise and an epoxy equivalent weight of 500 to 1,000, and (b) 50 to 90% by weight of at least one solid epoxy resin having a softening point of at least 50° C. and an epoxy equivalent weight of at least 110.
Claim 11
Dependent Claim
22 words
A device according to claim 9 wherein said epoxy resin (a) has a viscosity at 25° C. of 15 to 60 poise.
Claim 12
Dependent Claim
26 words
A device according to claim 9 wherein said epoxy resin (b) comprises at least one epoxy resin having an epoxy equivalent weight of at least 175.
Claim 13
Dependent Claim
51 words
A device according to claim 9 wherein said epoxy resin (b) comprises at least one epoxy resin which has an epoxy equivalent weight of at least 175 and which is substantially free of hydroxyl functionality and at least one epoxy resin which has an epoxy equivalent weight of at least 375.
Claim 14
Dependent Claim
22 words
A device according to claim 12 wherein said epoxy resin (b) comprises a novolak epoxy resin and a Bisphenol A epoxy resin.
Claim 15
Dependent Claim
67 words
A device according to claim 3 wherein said composition contains (a) 40 to 90% by weight of at least one epoxy resin having a softening point of at least 50° C. and an epoxy equivalent weight of at least 110; and (b) 10 to 30% by weight of a polymer which is compatible with said epoxy resin and which has a molecular weight of at least 5,000.
Claim 16
Dependent Claim
13 words
A device according to claim 14 wherein said polymer (b) is an elastomer.
Claim 17
Dependent Claim
13 words
A device according to claim 15 wherein said elastomer is a nitrile rubber.
Claim 18
Dependent Claim
13 words
A device according to claim 14 wherein said polymer (b) is a polyamide.
Claim 19
Dependent Claim
26 words
A device according to claim 14 wherein said epoxy resin (a) comprises at least one epoxy resin having an epoxy equivalent weight of at least 175.
Claim 20
Dependent Claim
51 words
A device according to claim 14 wherein said epoxy resin (a) comprises at least one epoxy resin which has an epoxy equivalent weight of at least 175 and which is substantially free of hydroxyl functionality and at least one epoxy resin which has an epoxy equivalent weight of at least 375.
Claim 21
Dependent Claim
20 words
A device according to claim 3 wherein said composition contains isophthaloyl dihydrazide as a curing agent for said epoxy resin.
Claim 22
Dependent Claim
20 words
A device according to claim 3 wherein said composition contains 1 to 10% of a particulate, high surface area filler.
Claim 23
Dependent Claim
19 words
A device according to claim 3 wherein said composition contains 1 to 10% by weight of a fibrous filler.
Claim 24
Dependent Claim
19 words
A device according to claim 3 wherein said composition contains up to 1% by weight of a fluorine-substituted surfactant.
Claim 25
Dependent Claim
16 words
A device according to claim 1 which recovers at a temperature of 150° to 200° C.
Claim 26
Dependent Claim
27 words
A device according to claim 1 which has been heated under conditions which cause the device to recover and the layer of curable adhesive thereon to cure.
Claim 27
Dependent Claim
16 words
A device according to claim 1 wherein said restraint is composed of a cross-linked thermoplastic polymer.
Claim 28
Dependent Claim
12 words
A device according to claim 26 wherein the polymer is poly(vinylidene fluoride).
Claim 29
Dependent Claim
17 words
A device according to claim 1 wherein said elastically deformed member is made of a memory metal.
Claim 30
Dependent Claim
18 words
A device according to claim 28 wherein said memory metal has an austenite/martensite transformation temperature below room temperature.
References Cited (Backward Citations)
US2847395A
Cited
US3390704A
Cited
US3382121A
Cited
US4206786A
Cited
US3894113A
Cited
US3496250A
Cited
US3655815A
Cited
US3707583A
Cited
US4035534A
Cited
US4077927A
Cited
US4181775A
Cited
US4130546A
Cited
US4197880A
Cited
US4237609A
Cited
US4295494A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-03-25 | 1988-09-24 | 1989-03-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-03-25 | 1992-09-24 | 1993-03-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-03-25 | 1996-09-24 | 1997-03-26 | $7700.00 | Window Closed / Lapsed |