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US4504427A Expired / Lapsed US ⏱️ 0.0 years remaining

Solder preform stabilization for lead frames

Assignee: Nokia Bell Labs
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Filing: 1983-06-17
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Granted: 1985-03-12
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Expires: 2003-06-17
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Abstract

Abstract Fabricating spacer bars or dam bars in conventional lead frames of a low melting material, e.g. solder, permits facile removal of the bar after molding. The low melting bars can be removed by furnace heating, localized radiant energy heating, exposure to rapid thermal annealing (RTA), hot air or hot liquid leveling, etc.

Inventors

  • 👤 Harold W. Moyer

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-08 08:08
CPC Classifications
B; B29; B29C; B29C33/00; B29C33/12; B29C70/00; B29C70/68; B29C70/72; H; H10; H10W; H10W74/00; H10W74/01; B29L; B29L2031/00; B29L2031/34; B29L2031/3406; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H05K3/3426; H05K3/3465

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 95 words
Method for mold encapsulating an electrical device wherein the device has a plurality of electrical leads arranged to extend beyond the molded encapsulant and wherein a spacer element is applied to the leads to maintain the leads in a desired spatial relationship during the mold encapsulating process the invention characterized in that the spacer element is formed of a material that melts preferentially with respect to the material of the metal leads and the invention further characterized by melting the spacer element without melting the electrical leads or the encapsulant after the mold encapsulating process.
Claim 2
Dependent Claim 95 words
Method for mold encapsulating an electrical device wherein the device has a plurality of electrical leads arranged to extend beyond the molded encapsulant and wherein a spacer element is applied to the leads to maintain the leads in a desired spatial relationship during the mold encapsulating process the invention characterized in that the spacer element is formed of a material that melts preferentially with respect to the material of the metal leads and the invention further characterized by melting the spacer element without melting the electrical leads or the encapsulant after the mold encapsulating process.
Claim 3
Dependent Claim 14 words
The method of claim 1 in which the spacer bars are comprised of solder.
Claim 4
Dependent Claim 21 words
The method of claim 1 in which heat is applied by a beam of radiant energy to melt the spacer bars.
Claim 5
Dependent Claim 18 words
The method of claim 2 in which the spacer bars are removed by hot air or liquid leveling.
Claim 6
Dependent Claim 15 words
The method of claim 1 in which the spacer element is composed of conductive material.

References Cited (Backward Citations)

US1219629A Cited
US3076051A Cited
US3494023A Cited
US3429030A Cited
US3418089A Cited
US3529054A Cited
US3810300A Cited
US4137546A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1988-03-11 1988-09-10 1989-03-12 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1992-03-11 1992-09-10 1993-03-12 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1996-03-11 1996-09-10 1997-03-12 $7700.00 Window Closed / Lapsed

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