US4501064A — Micro component assembly machine

Claim 1

Independent Claim 77 words

The method of placing chip-type micro-electronic components on a printed circuit board comprising: a. providing a plurality of component supply means each having a plurality of components; b. selecting a component from a component supply means; c. transferring a component to an enclosed conveyor; d. transporting a component in the enclosed conveyor to a receiving means; e. transferring a component from the receiving means to a placement means; f. placing a component on a printed circuit board.

Claim 2

Independent Claim 77 words

The method of placing chip-type micro-electronic components on a printed circuit board comprising: a. providing a plurality of component supply means each having a plurality of components; b. selecting a component from a component supply means; c. transferring a component to an enclosed conveyor; d. transporting a component in the enclosed conveyor to a receiving means; e. transferring a component from the receiving means to a placement means; f. placing a component on a printed circuit board.

Claim 3

Dependent Claim 16 words

The method of claim 1 including verifying in the conveyor that the selected component is acceptable.

Claim 4

Dependent Claim 174 words

A machine for automatically placing chip-type electronic components on the conductive lands of a substrate, said machine comprising: a. a component supply means located on support means and containing a plurality of components; b. a conveyor having one end located on said support means for transporting the components from said supply means for receiving means; c. means to transfer the components from said supply means and place the components on said conveyor; d. a verifier coacting with said machine and located on said conveyor to determine whether a given component is acceptable; e. means to receive said components from the opposite end of said conveyor; f. said receiving means including a placement head adapted to receive the component from said conveyor and position the components on the substrate at a predetermined desired location; g. said conveyor including an air track that passes through the transfer mechanism and transports the components to the placement means, and h. electrical control means associated with said machine functional to actuate each element of the machine in proper sequence.

Claim 5

Dependent Claim 174 words

A machine for automatically placing chip-type electronic components on the conductive lands of a substrate, said machine comprising: a. a component supply means located on support means and containing a plurality of components; b. a conveyor having one end located on said support means for transporting the components from said supply means for receiving means; c. means to transfer the components from said supply means and place the components on said conveyor; d. a verifier coacting with said machine and located on said conveyor to determine whether a given component is acceptable; e. means to receive said components from the opposite end of said conveyor; f. said receiving means including a placement head adapted to receive the component from said conveyor and position the components on the substrate at a predetermined desired location; g. said conveyor including an air track that passes through the transfer mechanism and transports the components to the placement means, and h. electrical control means associated with said machine functional to actuate each element of the machine in proper sequence.

Claim 6

Dependent Claim 27 words

The machine of claim 3 wherein said component supply means includes means to separate the components so that each component is individually supplied to said transfer means.

Claim 7

Dependent Claim 20 words

The machine of claim 3 wherein said supply means contains components of different types for supply to said transfer means.

Claim 8

Dependent Claim 31 words

The machine of claim 3 wherein said transfer means is a mechanism to transfer components from the supply means to said conveyor for transport of the components to the placement head.

Claim 9

Dependent Claim 35 words

The machine of claim 3 wherein said verifier is located on said conveyor and receives the components for measurement and testing and permits transport of the acceptable components down the conveyor to the placement head.

Claim 10

Dependent Claim 32 words

The machine of claim 3 wherein said placement head contains means for receiving said component from said conveyor and means for picking up the components and placing the components on the substrate.

Claim 11

Dependent Claim 41 words

The machine of claim 8 wherein said verifier measures the components and signals that measurement to the head receiving means to properly position the components with respect to said pickup means so that the components are properly positioned on the substrate.

Claim 12

Dependent Claim 22 words

The machine of claim 3 wherein sensor means coacts with said receiving means and said placement head to indicate proper component position.

Claim 13

Dependent Claim 14 words

The machine of claim 3 including means for supplying an adhesive to the substrate.

Claim 14

Dependent Claim 37 words

The machine of claim 11 including electrical control means to operate the adhesive supply means and placement head in synchronism so that as one substrate receives components from the placement means, a preceeding substrate receives an adhesive.

Claim 15

Dependent Claim 41 words

The machine of claim 11 wherein a plurality of adhesive supplying means and a plurality of placement means are provided, each operating in synchronism so that a plurality of components can be placed on a plurality of substrates at one time.

Claim 16

Dependent Claim 135 words

A machine for automatically placing chip-type micro-electronic components on a substrate comprising: a. a plurality of component supply means located on a support means; b. a conveyor located on said support means; c. a plurality of transfer mechanisms located on said support means, each transfer mechanism being adapted to receive components from said supply means and deposit the components in one end of said conveyor; d. said supply means being in a stationary relationship with respect to said transfer mechanisms; and e. a component placement means coacting with the opposite end of said conveyor to receive a component from said conveyor and to place any one of the supplied components to the substrate, and f. said conveyor including an air track that passes through the transfer mechanism and transports the components to the placement means.

Claim 17

Dependent Claim 135 words

A machine for automatically placing chip-type micro-electronic components on a substrate comprising: a. a plurality of component supply means located on a support means; b. a conveyor located on said support means; c. a plurality of transfer mechanisms located on said support means, each transfer mechanism being adapted to receive components from said supply means and deposit the components in one end of said conveyor; d. said supply means being in a stationary relationship with respect to said transfer mechanisms; and e. a component placement means coacting with the opposite end of said conveyor to receive a component from said conveyor and to place any one of the supplied components to the substrate, and f. said conveyor including an air track that passes through the transfer mechanism and transports the components to the placement means.

Claim 18

Dependent Claim 30 words

The machine of claim 14 wherein a component verifier coacts with said conveyor to determine whether a component is acceptable and permits acceptable components to travel to the placement means.

Claim 19

Dependent Claim 23 words

The machine of claim 14 wherein said source of supply is a plurality of component supplies each of which coacts with said conveyor.

Claim 20

Dependent Claim 24 words

The machine of claim 14 wherein said conveyor is an enclosed track which contains pressurized air that conveys the components to the receiving means.

Claim 21

Independent Claim 163 words

A system for automatically placing chip-type electronic components on the conductive lands of a substrate, said system including modular machine units and comprises; a. a first unit located on support means comprising a plurality of component supply means, each adapted to carry a plurality of components; b. a conveyor unit located on said support means for transporting the components; c. said first unit having means for transferring the components from said supply means onto one end of said conveyor; d. a placement head unit adapted to receive components from the opposite end of said conveyor and position the components on the substrate at a predetermined desired location; e. said system including electrical control means functional to actuate each unit of the system in proper sequence; f. said conveyor including an enclosed air track between said supply means and said placement head whereby the path of the components between said supply means and said placement head is defined by at least said air track.

Claim 22

Independent Claim 163 words

A system for automatically placing chip-type electronic components on the conductive lands of a substrate, said system including modular machine units and comprises; a. a first unit located on support means comprising a plurality of component supply means, each adapted to carry a plurality of components; b. a conveyor unit located on said support means for transporting the components; c. said first unit having means for transferring the components from said supply means onto one end of said conveyor; d. a placement head unit adapted to receive components from the opposite end of said conveyor and position the components on the substrate at a predetermined desired location; e. said system including electrical control means functional to actuate each unit of the system in proper sequence; f. said conveyor including an enclosed air track between said supply means and said placement head whereby the path of the components between said supply means and said placement head is defined by at least said air track.

Claim 23

Dependent Claim 23 words

The system of claim 18 wherein said supply means is a plurality of component supplies each of which coacts with said conveyor unit.

Claim 24

Dependent Claim 26 words

The system of claim 18 wherein said conveyor unit is an enclosed track which contains pressurized air that conveys the components to the placement head unit.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	1988-02-26	1988-08-27	1989-02-26	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	1992-02-26	1992-08-27	1993-02-26	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	1996-02-26	1996-08-27	1997-02-26	$7700.00	Window Closed / Lapsed

Micro component assembly machine

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