Deposition process
Abstract
Abstract Disclosed herein is a deposition process which comprises, in an air-tight reaction vessel, generating a plasma through a discharge gas by means of a discharge system, disposing a substrate at a position apart from the plasma by a distance greater than the mean free path of species produced by the plasma in such a state that the substrate can be exposed directly to light radiated from the plasma, feeding a carrier gas and photoreactive gas in such a manner that they flow along the substrate, and causing the photoreactive gas to undergo a reaction by the light from the plasma to deposit the reaction product on the substrate. In the deposition process the substrate and a film deposited thereon are prevented from contamination or damage by charged particles. Electrodes are kept free from deposition of the reaction product, thereby allowing to conduct the deposition operation for a long period of time without need for cleaning them frequently.
Inventors
- 👤 Tatsumi Hiramoto
Bibliographic Details
Claims Analysis
Total Claims: 9References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-02-19 | 1988-08-20 | 1989-02-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-02-19 | 1992-08-20 | 1993-02-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-02-19 | 1996-08-20 | 1997-02-19 | $7700.00 | Window Closed / Lapsed |