Patent FR1136330A successfully refreshed from Google Patents.
Patent US4494807A successfully refreshed from Google Patents.
US4494807A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Low profile chip carrier contact
Assignee: TE Connectivity Corp
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Filing: 1982-12-27
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Granted: 1985-01-22
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Expires: 2002-12-27
Abstract
Abstract A low profile chip carrier housing contact having a very short electrical contact path is taught. Briefly stated, the device includes a frame having contacts arranged on each of the sides of the frame. The contact members are uniquely shaped so as to exert optimum forces of contact mating values between a leadless integrated circuit chip carrier package and a printed circuit board.
Inventors
- 👤 Nicola Cosmo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 05:46
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/02; H05K7/10; H05K7/1053; H05K7/1061; H05K7/1069
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
233 words
A device for connecting a leadless integrated circuit chip carrier or package to a circuit board, comprising: a circuit board having electrical conductors contained thereon; chip carrier housing means disposed on said circuit board for receivably receiving a leadless integrated circuit chip carrier, said carrier housing means having on each side thereof a plurality of slots for receivably receiving contact means; contact means disposed in said slots for providing electrical communication between a leadless integrated circuit chip carrier and said electrical conductors contained on said circuit board, said contacts having a first portion resembling an S which has been placed on its side having a second portion resembling a superimposed beam portion on one of the outermost curves, said beam portion having a contact area at each of its ends, with said beam ends being in engagement with opposed, inwardly facing, substantially planar surfaces of said circuit chip carrier and said circuit board, thereby providing electrical communication between a leadless integrated circuit chip carrier and said electrical conductors contained on said circuit board; first bracket means disposed on said carrier housing means for retaining said contact means in said carrier means; a leadless integrated circuit chip carrier disposed on said carrier housing means; and second bracket means disposed on the top of said leadless integrated circuit chip carrier for maintaining said leadless integrated circuit chip carrier in electrical communication with said contact means.
Claim 2
Independent Claim
233 words
A device for connecting a leadless integrated circuit chip carrier or package to a circuit board, comprising: a circuit board having electrical conductors contained thereon; chip carrier housing means disposed on said circuit board for receivably receiving a leadless integrated circuit chip carrier, said carrier housing means having on each side thereof a plurality of slots for receivably receiving contact means; contact means disposed in said slots for providing electrical communication between a leadless integrated circuit chip carrier and said electrical conductors contained on said circuit board, said contacts having a first portion resembling an S which has been placed on its side having a second portion resembling a superimposed beam portion on one of the outermost curves, said beam portion having a contact area at each of its ends, with said beam ends being in engagement with opposed, inwardly facing, substantially planar surfaces of said circuit chip carrier and said circuit board, thereby providing electrical communication between a leadless integrated circuit chip carrier and said electrical conductors contained on said circuit board; first bracket means disposed on said carrier housing means for retaining said contact means in said carrier means; a leadless integrated circuit chip carrier disposed on said carrier housing means; and second bracket means disposed on the top of said leadless integrated circuit chip carrier for maintaining said leadless integrated circuit chip carrier in electrical communication with said contact means.
Claim 3
Dependent Claim
15 words
A device according to claim 1 wherein said chip carrier housing means is generally rectangular.
Claim 4
Dependent Claim
28 words
A device according to claim 1 wherein said contact means have a form obtained by having been cut from and lifted out from a flat sheet of metal.
Claim 5
Dependent Claim
11 words
A device according to claim 3 wherein said metal beryllium copper.
Claim 6
Dependent Claim
25 words
A device according to claim 1 wherein said contact means is comprised of an electrically insulative material and has an electrically conductive material disposed thereon.
Claim 7
Dependent Claim
13 words
A device according to claim 5 wherein said electrically conductive material is glass.
Claim 8
Dependent Claim
15 words
A device according to claim 5 wherein said electrically insulative material is comprised of plastic.
Claim 9
Dependent Claim
14 words
A device according to claim 5 wherein said electrically conductive material is copper. PG,12
Claim 10
Dependent Claim
25 words
A device according to claim 1 wherein said carrier means and said first and said second bracket means are comprised of an electrically insulative material.
Claim 11
Dependent Claim
24 words
A device according to claim 1 wherein said chip carrier means, said first bracket means and said second bracket means are comprised of plastic.
Claim 12
Dependent Claim
15 words
A device according to claim 1 wherein said circuit board is a printed circuit board.
Claim 13
Dependent Claim
24 words
A device according to claim 5 wherein said chip carrier means, said first bracket means and said second bracket means are comprised of plastic.
Claim 14
Independent Claim
281 words
A device for connecting a leadless integrated circuit chip carrier or package to a circuit board, comprising: a circuit board having electrical conductors contained thereon; chip carrier housing means disposed on said circuit board for receivably receiving a leadless integrated circuit chip carrier, said carrier housing means having on each side thereof a plurality of slots for receivably receiving contact means; contact means disposed in said slots for providing electrical communication between a leadless integrated circuit chip carrier and said electrical conductors contained on said circuit board, said contacts having a first portion resembling a U having a first contact area at one end thereof and a second contact area at the lowermost portion of the curve, which lowermost portion also forms a free end of the U, thereby defining beam ends with said beam ends being in engagement with opposed, inwardly facing, substantially planar surfaces of said circuit chip carrier and said circuit board, said contact further having a second portion resembling a S placed on its side having one end doubled back and attached at the remaining end of said U and said S portion having an elongated remaining end, said contact providing electrical communication between said first and second contact areas and thereby between said leadless integrated circuit chip carrier and said electrical conductors contained on said circuit board; first bracket means disposed on said carrier means for retaining said contact means in said carrier means; a leadless integrated circuit chip carrier disposed on said carrier housing means; and second bracket means disposed on the top of said leadless integrated circuit chip carrier for maintaining said leadless integrated circuit chip carrier in electrical communication with said contact means.
Claim 15
Independent Claim
281 words
A device for connecting a leadless integrated circuit chip carrier or package to a circuit board, comprising: a circuit board having electrical conductors contained thereon; chip carrier housing means disposed on said circuit board for receivably receiving a leadless integrated circuit chip carrier, said carrier housing means having on each side thereof a plurality of slots for receivably receiving contact means; contact means disposed in said slots for providing electrical communication between a leadless integrated circuit chip carrier and said electrical conductors contained on said circuit board, said contacts having a first portion resembling a U having a first contact area at one end thereof and a second contact area at the lowermost portion of the curve, which lowermost portion also forms a free end of the U, thereby defining beam ends with said beam ends being in engagement with opposed, inwardly facing, substantially planar surfaces of said circuit chip carrier and said circuit board, said contact further having a second portion resembling a S placed on its side having one end doubled back and attached at the remaining end of said U and said S portion having an elongated remaining end, said contact providing electrical communication between said first and second contact areas and thereby between said leadless integrated circuit chip carrier and said electrical conductors contained on said circuit board; first bracket means disposed on said carrier means for retaining said contact means in said carrier means; a leadless integrated circuit chip carrier disposed on said carrier housing means; and second bracket means disposed on the top of said leadless integrated circuit chip carrier for maintaining said leadless integrated circuit chip carrier in electrical communication with said contact means.
Claim 16
Dependent Claim
15 words
A device according to claim 13 wherein said chip carrier housing means is generally rectangular.
Claim 17
Dependent Claim
28 words
A device according to claim 13 wherein said contact means have a form obtained by having been cut from and lifted out from a flat sheet of metal.
Claim 18
Dependent Claim
25 words
A device according to claim 13 wherein said contact means is comprised of an electrically insulative material and has an electrically conductive material disposed thereon.
Claim 19
Dependent Claim
24 words
A device according to claim 13 wherein said carrier means and said first and second bracket means are comprised of an electrically insulative material.
Claim 20
Dependent Claim
24 words
A device according to claim 13 wherein said chip carrier means, said first bracket means and said second bracket means are comprised of plastic.
Claim 21
Dependent Claim
15 words
A device according to claim 13 wherein said circuit board is a printed circuit board.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-01-22 | 1988-07-23 | 1989-01-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-01-22 | 1992-07-23 | 1993-01-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-01-22 | 1996-07-23 | 1997-01-22 | $7700.00 | Window Closed / Lapsed |