Lead frame connector for compact circuit package

Claim 2

A lead frame connector and a compact circuit package comprising a first substrate having a first side retaining a first circuit located within a cavity provided by a housing to conduct heat generated by said first circuit through said substrate to a point external to said cavity, at least a portion of said first substrate being located within said cavity and operatively connected to said housing, and a second substrate retaining a second circuit, wherein said lead frame connector comprises a first lead frame extension having a first portion electrically connected to said first circuit and a second portion electrically connected to said second circuit to conduct electrical current between said first and second circuits and engaging said first and second substrates to maintain said first and second substrates in spaced relationship with respect to each other, said first lead frame extension comprising a one-piece section integrally extending from said first substrate to said second substrate to support said second substrate regardless of any supporting engagement of said second substrate by said housing, and a second lead frame extension spaced from said first lead frame extension and having a first portion connected to one of said first and second substrates and a second portion spaced from the other of said first and second substrates and extending through an aperture within said housing to provide an external electrical connection for said circuit package.

Claim 3

The lead frame connector of claim 1, and including an integral lead frame portion interconnecting said first and second lead frame extensions to provide an external electrical connection for said first and second circuits.

Claim 4

The lead frame connector of claim 1, wherein said first lead frame extension first portion is connected to a main power terminal and said second portion is connected to one of said first and second circuits to conduct operating power to said compact circuit package.

Claim 5

The lead frame connector of claim 1, wherein said second portion of said first lead frame extension includes a ledge operatively engaging said second substrate to maintain said first and second substrates spaced from each other and an outer end projecting beyond said ledge to be located within a corresponding opening within said second substrate and forming an electrical connection with said second circuit.

Claim 6

The lead frame connector of claim 4, wherein said second circuit includes a printed circuit, and including an electrically conductive solder joining said lead frame outer end to said printed circuit to maintain said electrical connection therebetween.

Claim 7

A circuit package, comprising means providing a cavity to form a circuit receiving receptacle, a first circuit assembly including first substrate means operatively connected to said receptacle and providing a first side facing inside said cavity to conduct heat generated at said first side to a point external to said cavity and first circuit means operatively connected to said first side of said first substrate means for conducting electrical current resulting in generated heat at said first side, a second circuit assembly including second substrate means spaced from said first substrate means for providing a circuit retaining structure and second circuit means operatively connected to said second substrate means for conducting electrical current, and lead frame means connecting said first and second circuit assemblies to maintain said second circuit assembly spaced from said first circuit assembly and to conduct electrical current between said first and second circuit assemblies and including a first series of lead frame extensions extending normally from said first substrate means into said cavity and protruding through corresponding apertures within said receptacle to provide selectable external electrical connections to said first circuit means and a second series of lead frame extensions extending normally from said first substrate means and engaging said second substrate means to provide said current conduction between said first and second circuit assemblies, said second series of lead frame extensions comprising one-piece sections integrally extending from said first substrate means to said second substrate means to support said second substrate means regardless of any supporting engagement of said second substrate means by said receptacle.

Claim 8

A circuit package, comprising means providing a cavity to form a circuit receiving receptacle, a first circuit assembly including first substrate means operatively connected to said receptacle and providing a first side facing inside said cavity to conduct heat generated at said first side to a point external to said cavity and first circuit means operatively connected to said first side of said first substrate means for conducting electrical current resulting in generated heat at said first side, a second circuit assembly including second substrate means spaced from said first substrate means for providing a circuit retaining structure and second circuit means operatively connected to said second substrate means for conducting electrical current, and lead frame means connecting said first and second circuit assemblies to maintain said second circuit assembly spaced from said first circuit assembly and to conduct electrical current between said first and second circuit assemblies and including a first series of lead frame extensions extending normally from said first substrate means into said cavity and protruding through corresponding apertures within said receptacle to provide selectable external electrical connections to said first circuit means and a second series of lead frame extensions extending normally from said first substrate means and engaging said second substrate means to provide said current conduction between said first and second circuit assemblies, said second series of lead frame extensions comprising one-piece sections integrally extending from said first substrate means to said second substrate means to support said second substrate means regardless of any supporting engagement of said second substrate means by said receptacle.

Claim 9

A compact circuit package, comprising an electrically insulating housing having a cavity formed by a base plate surrounded by a peripheral wall terminating at a rim to form a circuit receiving receptacle, a circuit sub-assembly located within said cavity and including a first electrically insulating and heat conducting planar substrate having a side edge engaging an abutment located adjacent to said rim within said peripheral wall to limit the depth of entry of said circuit sub-assembly into said cavity and to substantially enclose said cavity by said first substrate, a first series of electrical circuits located at a first side of said first substrate facing said cavity and including circuit means operatively connected to said first substrate first side and operative to conduct substantial electrical energy thereby generating substantial heat which is conducted through said first substrate to a second side oppositely disposed from said first side to dissipate said generated heat at a point external to said cavity and lead frame means operatively connected to said first substrate first side to operatively conduct electrical energy to and between said first series of electrical circuits and including a first series of lead frame extensions extending normally from said first substrate into said cavity and protruding through corresponding apertures within said housing to provide external electrical connections to said circuit sub-assembly and a second series of lead frame extensions extending normally from said first substrate and terminating within said cavity, a second electrically insulating substantially planar substrate spaced from said first substrate and located within said cavity and including oppositely spaced first and second sides retaining a second series of electrical circuits including printed circuits, said second series of lead frame extensions each providing a ledge engaging said second substrate to maintain said first and second substrates spaced from each other and an outer end projection extending beyond said ledge and located within a corresponding opening within said second substrate, and means connecting said second series of lead frame extensions to said second substrate to retain said second substrate in a spaced relationship with respect to said housing and to electrically connect said second lead frame extensions and said second series of electrical circuits to provide a compact circuit module and the efficient transfer of electrical energy.

Claim 10

A compact circuit package, comprising an electrically insulating housing having a cavity formed by a base plate surrounded by a peripheral wall terminating at a rim to form a circuit receiving receptacle, a circuit sub-assembly located within said cavity and including a first electrically insulating and heat conducting planar substrate having a side edge engaging an abutment located adjacent to said rim within said peripheral wall to limit the depth of entry of said circuit sub-assembly into said cavity and to substantially enclose said cavity by said first substrate, a first series of electrical circuits located at a first side of said first substrate facing said cavity and including circuit means operatively connected to said first substrate first side and operative to conduct substantial electrical energy thereby generating substantial heat which is conducted through said first substrate to a second side oppositely disposed from said first side to dissipate said generated heat at a point external to said cavity and lead frame means operatively connected to said first substrate first side to operatively conduct electrical energy to and between said first series of electrical circuits and including a first series of lead frame extensions extending normally from said first substrate into said cavity and protruding through corresponding apertures within said housing to provide external electrical connections to said circuit sub-assembly and a second series of lead frame extensions extending normally from said first substrate and terminating within said cavity, a second electrically insulating substantially planar substrate spaced from said first substrate and located within said cavity and including oppositely spaced first and second sides retaining a second series of electrical circuits including printed circuits, said second series of lead frame extensions each providing a ledge engaging said second substrate to maintain said first and second substrates spaced from each other and an outer end projection extending beyond said ledge and located within a corresponding opening within said second substrate, and means connecting said second series of lead frame extensions to said second substrate to retain said second substrate in a spaced relationship with respect to said housing and to electrically connect said second lead frame extensions and said second series of electrical circuits to provide a compact circuit module and the efficient transfer of electrical energy.

Claim 11

The compact circuit package of claim 7, wherein said connecting means includes first connection means to electrically connect a first selected number of said second lead frame extensions to said second circuits located at said first side of said second substrate and second connection means to electrically connect a second selected number of said second lead frame extensions to said second circuits located at said second side of said second substrate.