US4482913A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device soldered to a graphite substrate
Assignee: Westinghouse Electric Corp
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Filing: 1982-02-24
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Granted: 1984-11-13
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Expires: 2002-02-24
Abstract
Abstract The present invention is directed to a semiconductor device in which a wafer of semiconductor material is soldered to a graphite substrate.
Inventors
- 👤 Michael A. Burke
- 👤 Clarence A. Andersson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 02:28
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/692; H10W72/00; H10W72/20; H10W72/30; H10W72/381
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
59 words
A power semiconductor device comprising a wafer of silicon, said wafer containing at least one p-type conductivity region and at least one n-type conductivity region with a p-n junction between adjacent regions of different conductivity type, said wafer having opposed surfaces, and a graphite substrate, said graphite substrate being soldered to one of said opposed surfaces of said wafer.
Claim 2
Dependent Claim
59 words
A power semiconductor device comprising a wafer of silicon, said wafer containing at least one p-type conductivity region and at least one n-type conductivity region with a p-n junction between adjacent regions of different conductivity type, said wafer having opposed surfaces, and a graphite substrate, said graphite substrate being soldered to one of said opposed surfaces of said wafer.
Claim 3
Dependent Claim
36 words
The device of claim 1 in which the surface of the substrate soldered to the wafer has a layer of a metal disposed thereon said metal being selected from the group consisting of aluminum and molybdenum.
Claim 4
Dependent Claim
17 words
The device of claim 1 in which the graphite substrate is also soldered to a base member.
Claim 5
Dependent Claim
47 words
The device of claim 3 in which the surface of the substrate soldered to the wafer and the surface of the substrate soldered to the base member have a layer of a metal disposed thereon, said metal being selected from the group consisting of aluminum and molybdenum.
References Cited (Backward Citations)
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Cited
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Cited
US4074305A
Cited
US4213801A
Cited
US4372809A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-11-13 | 1988-05-14 | 1988-11-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-11-13 | 1992-05-14 | 1992-11-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-11-13 | 1996-05-14 | 1996-11-13 | $7700.00 | Window Closed / Lapsed |