Life extension of catalyst predip baths

Claim 2

In a method that includes soaking a substrate having an etched copper coating in an aqueous acidic sodium chloride solution subject to build up of copper ions, and then soaking the substrate in a second aqueous solution that contains stannous chloride ions and is subject to contamination by copper ions, the improvement of extending the useful life of sodium chloride solution by circulating it over metallic tin, which precipitates particles of copper and introduces tin ions in the sodium chloride solution, and then circulating the sodium chloride solution through a filter that does not allow the copper-containing particles to pass therethrough, whereby the second aqueous solution is protected from copper ion contamination and at least partially replenished with tin ions.

Claim 3

In a process for electroless copper plating of passage walls through the thickness of an electronic circuit board after etching at least one copper film thereon, which method includes immersing the circuit board in an acidic sodium chloride bath immediately prior to immersing the circuit board in a catalyst bath containing a palladium colloid and tin chloride, the improvement wherein the lifetime of the acidic bath containing sodium chloride is extended by recirculating the latter bath through a filter bag containing one or more pieces of metallic tin, the filter bag having openings therein not greater than about 50 microns in maximum dimension, whereby at least some of the copper ions, that might otherwise build up in the latter bath and contaminate the catalyst bath by drag-out, are precipitated within the filter bag as particles generally larger than 50 microns and thus restrained from transferring over into the next following catalyst bath.

Claim 4

In a process for electroless copper plating of passage walls through the thickness of an electronic circuit board after etching at least one copper film thereon, which method includes immersing the circuit board in an acidic sodium chloride bath immediately prior to immersing the circuit board in a catalyst bath containing a palladium colloid and tin chloride, the improvement wherein the lifetime of the acidic bath containing sodium chloride is extended by recirculating the latter bath through a filter bag containing one or more pieces of metallic tin, the filter bag having openings therein not greater than about 50 microns in maximum dimension, whereby at least some of the copper ions, that might otherwise build up in the latter bath and contaminate the catalyst bath by drag-out, are precipitated within the filter bag as particles generally larger than 50 microns and thus restrained from transferring over into the next following catalyst bath.