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US4481233A Expired / Lapsed US ⏱️ 0.0 years remaining

Process for producing solid-state color image pickup array

Assignee: Canon Inc
•
Filing: 1983-02-16
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Granted: 1984-11-06
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Expires: 2003-02-16
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Abstract

Abstract A process for producing a solid-state color pickup array, which comprises forming a resist mask on a wafer having a solid image pickup array; vapor-depositing a colorant on the wafer having the resist mask and on the resist mask; and removing the resist mask by dissolution, thereby eliminating selectively the colorant film vapor-deposited on the resist mask.

Inventors

  • 👤 Hajime Sakata
  • 👤 Kojiro Yokono
  • 👤 Seiichi Takahashi

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 02:16
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/0005; G03F7/0007; B; B05; B05D; B05D1/00; B05D1/32; B05D1/322; B05D1/327; B05D1/60

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 92 words
A process for producing a solid-state color pickup array, which comprises: (a) forming a resist mask on a wafer having a solid-state image pickup array wherein the portion of the wafer having the resist mask formed thereon is the unexposed portion of the wafer and the remainder of the wafer is the exposed portion; (b) vapor-depositing a colorant on the exposed wafer and on the resist mask on the wafer; and (c) removing by dissolution the resist mask thereby also eliminating the portion of the colorant film vapor-deposited on the resist mask.
Claim 2
Dependent Claim 92 words
A process for producing a solid-state color pickup array, which comprises: (a) forming a resist mask on a wafer having a solid-state image pickup array wherein the portion of the wafer having the resist mask formed thereon is the unexposed portion of the wafer and the remainder of the wafer is the exposed portion; (b) vapor-depositing a colorant on the exposed wafer and on the resist mask on the wafer; and (c) removing by dissolution the resist mask thereby also eliminating the portion of the colorant film vapor-deposited on the resist mask.
Claim 3
Dependent Claim 18 words
The process according to claim 1, wherein the resist mask is formed of a positive type of resist.
Claim 4
Dependent Claim 16 words
The process according to claim 1, wherein the colorant film has a thickness of 1000-10,000 Å.
Claim 5
Dependent Claim 26 words
The process according to claim 1, further comprising forming a transparent protective coating after the step for removing the colorant film vapor-deposited on the resist mask.

References Cited (Backward Citations)

No citation records indexed.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1987-11-06 1988-05-07 1988-11-06 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1991-11-06 1992-05-07 1992-11-06 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1995-11-06 1996-05-07 1996-11-06 $7700.00 Window Closed / Lapsed

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