Process for manufacturing plastic containers incorporating a heat disperser for integrated circuits

Claim 1

Process for manufacturing plastic containers incorporating a heat disperser for integrated circuits, consisting in; working a sheet metal strip so as to form a series of identical flat aligned structures, each comprising a central support area and a number of flat conductors; welding to each support area a chip of semiconductor material comprising an integrated circuit; electrically connecting predetermined areas in each integrated circuit to predetermined conductors; joining to each structure in the sheet metal structure a metal mass, acting as a heat disperser, so that it will adhere to the sheet metal surface opposite to the support area; placing the sheet metal strip and the heat dispersers in an appropriate die with the dispersers facing the extractors in the die; injecting into the die under pressure synthetic resin in liquid form; letting the resin coagulate; opening the die and operating the extractors, characterized in that the coupling of the heat dispersers to the structures in the sheet metal strip consists in placing a disperser on each outlet hole of the extractors, so as to close it completely, and in placing the prepared sheet metal strip in the die with its free surfaces opposite the support areas in contact with the dispersers.