Patent US4465538A successfully refreshed from Google Patents.
US4465538A
Expired / Lapsed
US
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Method of making a printed circuit board
Assignee: Individual
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Filing: 1982-02-18
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Granted: 1984-08-14
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Expires: 2002-02-18
Abstract
Abstract Adhesive is applied to a substrate for a printed circuit board in a pattern corresponding to that of the printed circuit. If the adhesive is of the type which contains a solvent, the substrate and adhesive are heated after application of the latter in order to drive off the solvent. Subsequently, a thin foil of a material which is capable of bonding to a chemically deposited metal is pressed onto the adhesive. The adhesive is then permitted to set which causes those portions of the foil in contact with the adhesive to adhere tightly to the latter. Once the adhesive has set, the foil is peeled from the adhesive. The portions of the foil which contact the adhesive remain bound to the adhesive thereby forming a base which is capable of receiving a chemically deposited metal. The thus-coated substrate is immersed in a bath where an electrically conductive metal for forming the printed circuit is chemically deposited in a pattern corresponding to that of the adhesive and, consequently, of the printed circuit.
Inventors
- 👤 Helmuth Schmoock
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 09:06
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/02; H05K3/04; H05K3/046; H05K2201/00; H05K2201/03; H05K2201/0302; H05K2201/0317; H05K2201/0332; H05K2201/0335; H05K2201/0347; H05K2203/00; H05K2203/05; H05K2203/0502; H05K2203/0522; H05K2203/0528; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10S428/914; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917
Claims Analysis
Total Claims: 27
Claim 1
Independent Claim
63 words
A method of making a circuit board having a circuit of a predetermined pattern, said method comprising the steps of: (a) applying an adhesive layer to a circuit board substrate in said predetermined pattern; (b) adhering a base layer to said adhesive layer; and (c) forming said circuit subsequent to the adhering step by coating said base layer with an electrically conductive layer.
Claim 2
Independent Claim
63 words
A method of making a circuit board having a circuit of a predetermined pattern, said method comprising the steps of: (a) applying an adhesive layer to a circuit board substrate in said predetermined pattern; (b) adhering a base layer to said adhesive layer; and (c) forming said circuit subsequent to the adhering step by coating said base layer with an electrically conductive layer.
Claim 3
Dependent Claim
30 words
The method of claim 1, wherein said adhesive layer includes a solvent; and further comprising the step of removing said solvent from said adhesive layer prior to the adhering step.
Claim 4
Dependent Claim
34 words
The method of claim 1, said base layer being capable of bonding to a chemically deposited metallic coating; and wherein the forming step comprises chemically depositing said electrically conductive layer on said base layer.
Claim 5
Dependent Claim
46 words
The method of claim 1, wherein the adhering step comprises contacting said adhesive layer with a foil and thereafter disengaging said foil from said adhesive layer in such a manner that the portions of said foil corresponding to said pattern remain secured to said adhesive layer.
Claim 6
Dependent Claim
34 words
The method of claim 4, further comprising the step of vapor-depositing said foil on a carrier prior to the adhering step; and wherein the disengaging step comprises peeling said carrier from said adhesive layer.
Claim 7
Dependent Claim
34 words
The method of claim 5, further comprising the step of applying a parting layer to said carrier prior to the vapor-depositing step, said parting layer adhering to said carrier subsequent to the disengaging step.
Claim 8
Dependent Claim
17 words
The method of claim 6, wherein said parting layer comprises a wax, a silicone or a lacquer.
Claim 9
Dependent Claim
16 words
The method of claim 5, wherein said carrier comprises a polypropylene, a polyester or a polycarbonate.
Claim 10
Dependent Claim
19 words
The method of claim 4, further comprising the step of hardening said adhesive layer prior to the disengaging step.
Claim 11
Dependent Claim
73 words
The method of claim 9, said circuit board being designed for a predetermined electrical current, and said electrically conductive layer being metallic and coated in a thickness sufficient to carry the current, said substrate being substantially non-conductive; and wherein said adhesive layer includes a solvent and said solvent is removed from said adhesive layer prior to the adhering step, the forming step comprising chemically depositing said electrically conductive layer on said base layer.
Claim 12
Dependent Claim
21 words
The method of claim 1, wherein said adhesive layer is substantially free of solvent when said base layer is applied thereto.
Claim 13
Dependent Claim
12 words
The method of claim 1, wherein said electrically conductive layer is metallic.
Claim 14
Dependent Claim
11 words
The method of claim 1, wherein said substrate is substantially non-conductive.
Claim 15
Dependent Claim
15 words
The method of claim 1, wherein the applying step is performed using the silk-screen process.
Claim 16
Dependent Claim
15 words
The method of claim 1, wherein the applying step is performed using an intaglio process.
Claim 17
Dependent Claim
19 words
The method of claim 1, wherein said adhesive layer is substantially free of solvent prior to the forming step.
Claim 18
Dependent Claim
29 words
The method of claim 1, wherein said base layer is substantially free of coatings incapable of firmly bonding to said electrically conductive layer upon initiation of the forming step.
Claim 19
Independent Claim
137 words
A method of making a circuit board having a circuit of a predetermined pattern, said method comprising the steps of: (a) applying an adhesive layer to a substantially non-conductive circuit board substrate in said predetermined pattern; (b) applying a foil to a carrier, said foil being capable of firmly bonding to an electrically conductive material; (c) bonding said foil to said adhesive layer, said adhesive layer being substantially free of solvent prior to the bonding step; (d) removing said carrier subsequent to the bonding step so that the portions of said foil in contact with said adhesive layer remain secured to the latter while at least the major part of the remainder of said foil is removed with said carrier; and (e) forming said circuit by coating said portions of said foil with said electrically conductive material.
Claim 20
Independent Claim
137 words
A method of making a circuit board having a circuit of a predetermined pattern, said method comprising the steps of: (a) applying an adhesive layer to a substantially non-conductive circuit board substrate in said predetermined pattern; (b) applying a foil to a carrier, said foil being capable of firmly bonding to an electrically conductive material; (c) bonding said foil to said adhesive layer, said adhesive layer being substantially free of solvent prior to the bonding step; (d) removing said carrier subsequent to the bonding step so that the portions of said foil in contact with said adhesive layer remain secured to the latter while at least the major part of the remainder of said foil is removed with said carrier; and (e) forming said circuit by coating said portions of said foil with said electrically conductive material.
Claim 21
Dependent Claim
13 words
The method of claim 18, wherein said electrically conductive material is a metal.
Claim 22
Dependent Claim
22 words
The method of claim 18, wherein the forming step comprises chemically depositing said electrically conductive material on said portions of said foil.
Claim 23
Dependent Claim
36 words
The method of claim 18, wherein said adhesive layer comprises a solvent upon being applied to said substrate; and further comprising the step of removing said solvent from said adhesive layer prior to the bonding step.
Claim 24
Dependent Claim
17 words
The method of claim 18, wherein the bonding step comprises pressing said foil against said adhesive layer.
Claim 25
Dependent Claim
14 words
The method of claim 18, wherein said adhesive layer is printed onto said substrate.
Claim 26
Dependent Claim
20 words
The method of claim 18, wherein the bonding step comprises hardening said adhesive layer while said foil contacts the same.
Claim 27
Dependent Claim
31 words
The method of claim 18, wherein said portions of said foil are substantially free of coatings incapable of firmly bonding to said electrically conductive material upon initiation of the forming step.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-08-14 | 1988-02-13 | 1988-08-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-08-14 | 1992-02-13 | 1992-08-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-08-14 | 1996-02-13 | 1996-08-14 | $7700.00 | Window Closed / Lapsed |