Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
123 words
A monolithic chip capacitor comprising a multilayer dielectric capacitor body formed of stacked, alternately arranged layers of dielectric material and metallic electrode material, alternate electrode layers extending to opposite endfaces of the body, a noncompliant metalized layer on each of said opposite endfaces electrically contacting the electrode layers extending thereto, a coating of compliant, conductive material on the surface of each of said noncompliant metalized layers, said compliant, conductive material containing tin and silver and having a thickness of at least 2.5 μm, and a metallic layer disposed over the surface of each of said compliant coatings, the melting point of the metallic layers being greater than that of said compliant coating, said metallic layer having a melting point greater than 900° C.
Claim 2
Dependent Claim
123 words
A monolithic chip capacitor comprising a multilayer dielectric capacitor body formed of stacked, alternately arranged layers of dielectric material and metallic electrode material, alternate electrode layers extending to opposite endfaces of the body, a noncompliant metalized layer on each of said opposite endfaces electrically contacting the electrode layers extending thereto, a coating of compliant, conductive material on the surface of each of said noncompliant metalized layers, said compliant, conductive material containing tin and silver and having a thickness of at least 2.5 μm, and a metallic layer disposed over the surface of each of said compliant coatings, the melting point of the metallic layers being greater than that of said compliant coating, said metallic layer having a melting point greater than 900° C.
Claim 3
Dependent Claim
20 words
A capacitor in accordance with claim 1 wherein said compliant, conductive material is an alloy comprising at least 50% lead.
Claim 4
Dependent Claim
43 words
A capacitor in accordance with claim 1 wherein said metallic layer comprises a relatively easily oxidized metal on the surface of said coating of compliant material, said capacitor further comprising an oxidation resistant metal on the surface of said relatively easily oxidized metal.
Claim 5
Dependent Claim
23 words
A capacitor in accordance with claim 3 wherein said relatively easily oxidized metal is selected from the group consisting of copper and nickel.
Claim 6
Dependent Claim
26 words
A capacitor in accordance with claim 4 wherein said oxidation resistant metal is selected from the group consisting of tin, gold, silver, platinum and alloys thereof.
Claim 7
Dependent Claim
17 words
A capacitor in accordance with claim 5 wherein said compliant, conductive material comprises at least 90% lead.
Claim 8
Dependent Claim
119 words
A monolithic chip capacitor which is adapted to be connected directly to conductive lands of a circuit board without the use of lead wires, said capacitor comprising a multilayer dielectric capacitor body formed of stacked, alternately arranged layers of dielectric material and metallic electrode material, alternate electrode layers extending to opposite endfaces of the body, a noncompliant metalized layer on each of said opposite endfaces electrically contacting the electrode layers extending thereto, a coating of compliant, conductive material over the entire surface of each of said noncompliant metalized layers, and a metallic layer disposed over the entire surface of each of said compliant coatings, the melting point of the metallic layers being greater than that of said compliant coating.
Claim 9
Dependent Claim
119 words
A monolithic chip capacitor which is adapted to be connected directly to conductive lands of a circuit board without the use of lead wires, said capacitor comprising a multilayer dielectric capacitor body formed of stacked, alternately arranged layers of dielectric material and metallic electrode material, alternate electrode layers extending to opposite endfaces of the body, a noncompliant metalized layer on each of said opposite endfaces electrically contacting the electrode layers extending thereto, a coating of compliant, conductive material over the entire surface of each of said noncompliant metalized layers, and a metallic layer disposed over the entire surface of each of said compliant coatings, the melting point of the metallic layers being greater than that of said compliant coating.
Claim 10
Dependent Claim
20 words
A capacitor in accordance with claim 7 wherein said compliant, conductive material is an alloy comprising at least 90% lead.
Claim 11
Dependent Claim
16 words
A capacitor in accordance with claim 8 wherein said compliant, conductive material contains tin and silver.