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Etched-source static induction transistor

Assignee: Verizon Laboratories Inc
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Filing: 1981-11-12
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Granted: 1984-07-03
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Expires: 2001-11-12
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Abstract

Abstract A gate-source structure and fabrication method for a static induction transistor. The method and the device are embodied by the epitaxial layer of, for example, high resistivity p-type semiconductor material grown on an epitaxial layer of high resistivity n-type semiconductor material. A silicon dioxide layer with source and gate windows is formed on the p-type epitaxial layer. Source grooves are formed in the p-type epitaxial layer at source window locations and the grooves are diffused with n-type impurities to form a diffusion region which extends to connect with the n-type epitaxial layer. Source and gate electrodes are formed in the source and gate windows.

Inventors

  • 👤 Adrian I. Cogan

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-27 05:01
CPC Classifications
H; H10; H10D; H10D30/00; H10D30/202

Claims Analysis

Total Claims: 2
Claim 1
Independent Claim 121 words
A gate-source structure for a static induction transistor comprising: a high resistivity epitaxial layer of one conductivity type; a high resistivity epitaxial layer of opposite conductivity type formed on said one-type epitaxial layer; a silicon dioxide layer formed on said opposite-type epitaxial layer; parallel source and gate windows in said silicon dioxide layer; source groove in said opposite-type epitaxial layer at the location of said source windows; diffused region of said one conductivity type extending from the surface of said grooves through said opposite-type epitaxial layer to form a channel to said one-type epitaxial layer; gate electrodes deposited on said opposite-type epitaxial layer at said gate window locations; and source electrode deposited on said diffused region at said source groove surface.
Claim 2
Dependent Claim 121 words
A gate-source structure for a static induction transistor comprising: a high resistivity epitaxial layer of one conductivity type; a high resistivity epitaxial layer of opposite conductivity type formed on said one-type epitaxial layer; a silicon dioxide layer formed on said opposite-type epitaxial layer; parallel source and gate windows in said silicon dioxide layer; source groove in said opposite-type epitaxial layer at the location of said source windows; diffused region of said one conductivity type extending from the surface of said grooves through said opposite-type epitaxial layer to form a channel to said one-type epitaxial layer; gate electrodes deposited on said opposite-type epitaxial layer at said gate window locations; and source electrode deposited on said diffused region at said source groove surface.

References Cited (Backward Citations)

US3828230A Cited
US4288800A Cited
JPS54102877A Cited
JPS54105978A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1987-07-03 1988-01-02 1988-07-03 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1991-07-03 1992-01-02 1992-07-03 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1995-07-03 1996-01-02 1996-07-03 $7700.00 Window Closed / Lapsed

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