Patent US4457467A successfully refreshed from Google Patents.
US4457467A
Expired / Lapsed
US
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Method for positioning and fixing optical components relative to one another
Assignee: Siemens AG
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Filing: 1982-07-22
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Granted: 1984-07-03
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Expires: 2002-07-22
Abstract
Abstract A method for positioning and fixing optical components relative to one another which comprises the steps of providing a carrier plate having an optical component, securing an optical component on a retainer plate having at least one solderable area, positioning the retainer plate above the carrier plate with a reference mark on said plates being aligned and the solderable area on each of the two plates being disposed in aligned pairs of solderable areas, applying at least one solder piece to each pair of solderable areas as the plates are held in the position, melting the solder pieces, allowing the molten metal to solidify to secure the aligned plates together and then releasing the secured aligned plates.
Inventors
- 👤 Ekkehard Klement
- 👤 Julius Wittmann
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 15:41
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3442; B; B23; B23K; B23K1/00; B23K1/005; G; G02; G02B; G02B6/00; G02B6/24; G02B6/36; G02B6/38; G02B6/3801; G02B6/3803; G02B6/42; G02B6/4201; G02B6/4219; G02B6/4236; G02B6/4238; G02B7/00; H05K2203/00; H05K2203/04; H05K2203/041; H05K2203/10; H05K2203/107; H05K3/3494; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
144 words
A method for positioning and fixing optical components relative to one another, said method comprising the steps of providing a carrier plate having an optical component secured thereon and having at least one solderable area, providing a retaining plate having at least one solderable area, securing at least one optical component on said retaining plate, positioning the retaining plate above the carrier plate with a reference mark on each of said plates being aligned and the solderable area of the retaining plates being disposed in alignment with solderable areas on the carrier plate to form aligned pairs, while continuing to hold the plates in the aligned position applying at least one solder piece at each aligned pair of solderable areas, melting the solder pieces, allowing the molten solder to solidify to secure the aligned plates together and then releasing the holding of said plates.
Claim 2
Independent Claim
144 words
A method for positioning and fixing optical components relative to one another, said method comprising the steps of providing a carrier plate having an optical component secured thereon and having at least one solderable area, providing a retaining plate having at least one solderable area, securing at least one optical component on said retaining plate, positioning the retaining plate above the carrier plate with a reference mark on each of said plates being aligned and the solderable area of the retaining plates being disposed in alignment with solderable areas on the carrier plate to form aligned pairs, while continuing to hold the plates in the aligned position applying at least one solder piece at each aligned pair of solderable areas, melting the solder pieces, allowing the molten solder to solidify to secure the aligned plates together and then releasing the holding of said plates.
Claim 3
Dependent Claim
65 words
A method according to claim 1, which includes providing a micromanipulator, said step of providing the retaining plate include providing a plate having means for fastening to a micromanipulator; and said step of positioning the retaining plate above the carrier plate with a reference mark on each plate being aligned include utilizing the micromanipulator to position and hold the retaining plate over the carrier plate.
Claim 4
Dependent Claim
31 words
A method according to claim 1, wherein the method of providing a retaining plate and providing a carrier plate provides one of the plates consisting of material exhibiting poor thermal conductivity.
Claim 5
Dependent Claim
48 words
A method according to claim 1, wherein the step of providing the retaining plate and the step of providing the carrier plate provides at least one of the plates being composed of a non-metallic material, each plate of non-metallic material having solderable areas formed by a metallized layer.
Claim 6
Dependent Claim
33 words
A method according to claim 4, wherein the one plate is the retaining plate and the metallized layer is provided on the entire peripheral edge and on a surface adjacent said peripheral edge.
Claim 7
Dependent Claim
36 words
A method according to claim 4, wherein the non-metallic plate is the retaining plate and the metallized layer is provided on portions of the peripheral edge and a surface adjacent said portion of the peripheral edge.
Claim 8
Dependent Claim
18 words
A method according to claim 4, wherein the step of providing the metallized layers provides a gold layer.
Claim 9
Dependent Claim
44 words
A method according to claim 1, wherein the step of providing a retaining plate provides a plate consisting of a material selected from a group consisting of semiconductor material and ceramic materials, said plate being provided with metallized layers to form the solderable areas.
Claim 10
Dependent Claim
32 words
A method according to claim 1, wherein the step of providing a retaining plate provides a retaining plate having at least one groove for positioning the optical component to be secured thereon.
Claim 11
Dependent Claim
25 words
A method according to claim 9, wherein the retaining plate with at least one groove comprises providing a silicon plate and etching each groove therein.
Claim 12
Dependent Claim
23 words
A method according to claim 1, wherein the step of applying at least one solder piece provides solder pieces having a circular cross-section.
Claim 13
Dependent Claim
31 words
A method according to claim 1, wherein the method of providing solder pieces provides solder composed of an alloy having no significant change of volume upon solidification from the melted phase.
Claim 14
Dependent Claim
21 words
A method according to claim 1, wherein the step of melting the solder comprises applying electromagnetic radiation to melt said solder.
Claim 15
Dependent Claim
16 words
A method according to claim 13, wherein the step of applying electromagnetic radiation applies light energy.
Claim 16
Dependent Claim
48 words
A method according to claim 1, wherein the step of providing a carrier plate having an optical component secured thereon and securing an optical component on the retaining plate comprises selecting the optical components from a group consisting of semiconductor laser diodes, light-emitting diodes, microlenses, and light waveguides.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-07-03 | 1988-01-02 | 1988-07-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-07-03 | 1992-01-02 | 1992-07-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-07-03 | 1996-01-02 | 1996-07-03 | $7700.00 | Window Closed / Lapsed |