Patent US4454528A successfully refreshed from Google Patents.
US4454528A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Low resistance backside preparation for semiconductor integrated circuit chips
Assignee: Zilog Inc
•
Filing: 1983-01-24
•
Granted: 1984-06-12
•
Expires: 2003-01-24
Abstract
Abstract To provide an electrically conductive p-type wafer backside for semiconductor integrated circuit chips (die), a process is provided consisting of applying a thin layer of aluminum on a silicon dioxide free surface of the chip, followed by a layer of gold, then alloying the metals to diffuse the gold and traces of aluminum into the chip surface. The surface thus prepared can then be advantageously die attachable to a receiving surface by either eutectic alloy or conductive polymer techniques.
Inventors
- 👤 Richard K. Trueblood
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 18:58
CPC Classifications
H; H10; H10P; H10P95/00; H10P95/50; H10W; H10W72/00; H10W72/30; H10W72/071; H10W72/073; H10W72/07331; H10W72/07336
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
61 words
A semiconductor integrated circuit chip capable of conductive attachment to a receiving surface comprising: a silicon chip body having at least one surface free of silicon dioxide, an alloy of aluminum and gold on said silicon dioxide free surface, and a gradient of gold with traces of aluminum extending into the silicon chip body adjacent to said silicon dioxide free surface.
Claim 2
Dependent Claim
61 words
A semiconductor integrated circuit chip capable of conductive attachment to a receiving surface comprising: a silicon chip body having at least one surface free of silicon dioxide, an alloy of aluminum and gold on said silicon dioxide free surface, and a gradient of gold with traces of aluminum extending into the silicon chip body adjacent to said silicon dioxide free surface.
Claim 3
Dependent Claim
19 words
The semiconductor integrated circuit chip of claim 1 wherein a conductive polymer layer is contacted to the alloy surface.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-06-12 | 1987-12-12 | 1988-06-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-06-12 | 1991-12-12 | 1992-06-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-06-12 | 1995-12-12 | 1996-06-12 | $7700.00 | Window Closed / Lapsed |