Patent EP0508138A2 successfully refreshed from Google Patents.
Patent US4450029A successfully refreshed from Google Patents.
US4450029A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Backplane fabrication method
Assignee: Intel Corp
•
Filing: 1982-01-13
•
Granted: 1984-05-22
•
Expires: 2002-01-13
Abstract
Abstract A backplane power distribution system characterized by generally uniform current densities so as to be capable of handling very high levels of current. This is achieved with a stepped backplane construction. For example, in a system having, in order, a first conductive layer, a first dielectric layer, a second conductive layer, and a second dielectric layer, the second conductive and dielectric layers extend transversely beyond the first conductive and dielectric layers to present a substantial exposed area of the second conductive layer. Typically, a rectangular metal bus bar is bolted to the backplane to make contact with the exposed area, and power supply connections to the bus bar are made in any convenient manner. The backplane is preferably first laminated with all layers coextensive, and portions of the first conductive and dielectric layers then removed by milling.
Inventors
- 👤 Kenneth W. Holbert
- 👤 Edwin M. Massey
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 18:44
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4611; H05K3/4641; H02; H02G; H02G5/00; H02G5/005; H05K1/00; H05K1/02; H05K1/0213; H05K1/0263; H05K2201/00; H05K2201/04; H05K2201/044; H05K2201/09; H05K2201/09145; H05K2201/0919; H05K2201/09209; H05K2201/0929; H05K2201/09309; H05K2201/09818; H05K2201/09845; H05K2201/10; H05K2201/10227; H05K2201/10272; H05K3/40; H05K3/42; H05K3/429; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T156/108; Y10T156/1082; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
106 words
A method of fabricating a backplane power distribution system comprising the steps of: providing a first dielectric layer having a signal layer on one side thereof; providing a conductive layer; providing a second dielectric layer; applying a release agent to a substantial area of the conductive layer; laminating, in order, the first dielectric layer, the conductive layer, and the second dielectric layer to produce a rigid laminated structure with the signal layer on the outside and the conductive layer and the first and second dielectric layers generally coextensive; and removing a portion of the first dielectric layer to expose the substantial area of the conductive layer.
Claim 2
Independent Claim
106 words
A method of fabricating a backplane power distribution system comprising the steps of: providing a first dielectric layer having a signal layer on one side thereof; providing a conductive layer; providing a second dielectric layer; applying a release agent to a substantial area of the conductive layer; laminating, in order, the first dielectric layer, the conductive layer, and the second dielectric layer to produce a rigid laminated structure with the signal layer on the outside and the conductive layer and the first and second dielectric layers generally coextensive; and removing a portion of the first dielectric layer to expose the substantial area of the conductive layer.
Claim 3
Dependent Claim
21 words
The method of claim 1 wherein said removing step is carried out along an edge region of the rigid laminated structure.
Claim 4
Independent Claim
149 words
A method of fabricating a backplane power distribution system comprising the steps of: providing a first dielectric layer having a signal layer on one side thereof; providing a conductive layer; providing a second dielectric layer; applying a release agent to a substantial area of the conductive layer; after said applying step, laminating, in order, the first dielectric layer, the conductive layer, and the second dielectric layer to produce a rigid laminated structure with the signal layer on the outside and the conductive layer and the first and second dielectric layers generally coextensive; milling the rigid laminated structure to leave a thin region of the first dielectric layer overlying at least part of the substantial area of the conductive layer and separated therefrom by the release agent; and separating the thin region of the first dielectric layer from the conductive layer to expose the substantial area of the conductive layer.
Claim 5
Independent Claim
149 words
A method of fabricating a backplane power distribution system comprising the steps of: providing a first dielectric layer having a signal layer on one side thereof; providing a conductive layer; providing a second dielectric layer; applying a release agent to a substantial area of the conductive layer; after said applying step, laminating, in order, the first dielectric layer, the conductive layer, and the second dielectric layer to produce a rigid laminated structure with the signal layer on the outside and the conductive layer and the first and second dielectric layers generally coextensive; milling the rigid laminated structure to leave a thin region of the first dielectric layer overlying at least part of the substantial area of the conductive layer and separated therefrom by the release agent; and separating the thin region of the first dielectric layer from the conductive layer to expose the substantial area of the conductive layer.
Claim 6
Dependent Claim
21 words
The method of claim 3 wherein said milling step is carried out along an edge region of the rigid laminated structure.
Claim 7
Dependent Claim
17 words
The method of claim 3 wherein said milling substep is carried out over the entire substantial area.
Claim 8
Independent Claim
90 words
A method of fabricating a backplane power distribution system comrpising the steps of: laminating, in order, a first conductive layer, a first dielectric layer, a second conductive layer, and a second dielectric layer to produce a rigid structure with the first and second conductive layers and the first and second dielectric layers generally coextensive; and milling the laminated structure to a depth to remove a portion of the first conductive layer and a portion of the first dielectric layer to leave a substantial area of the second conductive layer exposed.
Claim 9
Independent Claim
90 words
A method of fabricating a backplane power distribution system comrpising the steps of: laminating, in order, a first conductive layer, a first dielectric layer, a second conductive layer, and a second dielectric layer to produce a rigid structure with the first and second conductive layers and the first and second dielectric layers generally coextensive; and milling the laminated structure to a depth to remove a portion of the first conductive layer and a portion of the first dielectric layer to leave a substantial area of the second conductive layer exposed.
Claim 10
Dependent Claim
52 words
The method of claim 6 wherein said milling step defines an edge of the first conductive layer and is carried out so as to leave a step region of the first dielectric layer exposed between the edge of the first conductive layer and the substantial exposed area of the second condutive layer.
Claim 11
Independent Claim
143 words
A method of fabricating a backplane power distribution system comprising the steps of: providing a first conductive layer; providing a first dielectric layer; providing a second conductive layer; providing a second dielectric layer; applying a release agent to a substantial area of the second conductive layer; laminating, in order, the first conductive layer, the first dielectric layer, the second conductive layer, and the second dielectric layer to produce a rigid laminated structure with the first and second conductive and dielectric layers generally coextensive; milling the rigid laminated structure to leave a thin region of the first dielectric layer overlying at least part of the substantial area of the second condutive layer and separated therefrom by the release agent; and separating the thin region of the first dielectric layer from the second conductive layer to expose the substantial area of the second conductive layer.
Claim 12
Independent Claim
143 words
A method of fabricating a backplane power distribution system comprising the steps of: providing a first conductive layer; providing a first dielectric layer; providing a second conductive layer; providing a second dielectric layer; applying a release agent to a substantial area of the second conductive layer; laminating, in order, the first conductive layer, the first dielectric layer, the second conductive layer, and the second dielectric layer to produce a rigid laminated structure with the first and second conductive and dielectric layers generally coextensive; milling the rigid laminated structure to leave a thin region of the first dielectric layer overlying at least part of the substantial area of the second condutive layer and separated therefrom by the release agent; and separating the thin region of the first dielectric layer from the second conductive layer to expose the substantial area of the second conductive layer.
Claim 13
Dependent Claim
21 words
The method of claim 8 wherein said milling step is carried out along an edge region of the rigid laminated structure.
Claim 14
Dependent Claim
17 words
The method of claim 8 wherein said milling step is carried out over the entire substantial area.
Claim 15
Dependent Claim
20 words
The method of claim 8 wherein said milling step is carried out over only a part of the substantial area.
Claim 16
Dependent Claim
50 words
The method of claim 8 wherein said milling step defines an edge of the first conductive layer and is carried out to leave a step region of the first dielectric layer exposed between the edge of the first conductive layer and the substantial exposed area of the second conductive layer.
Claim 17
Independent Claim
102 words
A method of fabricating a backplane distribution system comprising the steps of: providing a first conductive layer; providing a first dielectric layer; providing a second conductive layer; providing a second dielectric layer; laminating, in order, the first conductive layer, the first dielectric layer, the second conductive layer, and the second dielectric layer to produce a rigid laminated structure with the first and second conductive and dielectric layers generally coextensive; and removing a portion of the first conductive and dielectric layers to leave a substantial area of the second conductive layer exposed by milling the rigid laminated structure along an edge region thereof.
Claim 18
Independent Claim
102 words
A method of fabricating a backplane distribution system comprising the steps of: providing a first conductive layer; providing a first dielectric layer; providing a second conductive layer; providing a second dielectric layer; laminating, in order, the first conductive layer, the first dielectric layer, the second conductive layer, and the second dielectric layer to produce a rigid laminated structure with the first and second conductive and dielectric layers generally coextensive; and removing a portion of the first conductive and dielectric layers to leave a substantial area of the second conductive layer exposed by milling the rigid laminated structure along an edge region thereof.
References Cited (Backward Citations)
US3331718A
Cited
US3499218A
Cited
US3718936A
Cited
US3777221A
Cited
US3909327A
Cited
US4091125A
Cited
US4250616A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-05-22 | 1987-11-21 | 1988-05-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-05-22 | 1991-11-21 | 1992-05-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-05-22 | 1995-11-21 | 1996-05-22 | $7700.00 | Window Closed / Lapsed |