Patent US4442966A successfully refreshed from Google Patents.
US4442966A
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US
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Method of simultaneously manufacturing multiple electrical connections between two electrical elements
Assignee: US Philips Corp
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Filing: 1981-10-14
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Granted: 1984-04-17
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Expires: 2001-10-14
Abstract
Abstract A method for the simultaneous manufacture of multiple electrical connections, in particular for the electrical connection of semiconductor elements. In the method a conductive paste is used. Because the conductive paste would otherwise provide a poor electrical connection with the contact pads which are manufactured of certain metals, the paste is first polymerized and thermo-compression of the paste is then carried out on the contact pad by the simultaneous application of pressure and a rise in temperature so that the paste forms a readily conductive and reliable connection.
Inventors
- 👤 Philippe Jourdain
- 👤 Georges E. Florens, deceased
- 👤 representative Georges A. L. Souquet
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 10:59
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/40; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/321; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/073; H10W72/07331; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
73 words
A method for simultaneously electrically connecting two semiconductor elements each having a plurality of mutually-opposing contact pad metallizations, which comprises: applying an electrically-conductive paste to each of said contact pad metallizations on at least one of said two elements; then polymerizing said electrically-conductive paste; then compressing said polymerized electrically-conductive paste between the mutually-opposing contact pad metallizations of said two elements; and heating at least one of said two elements being connected during compression.
Claim 2
Independent Claim
73 words
A method for simultaneously electrically connecting two semiconductor elements each having a plurality of mutually-opposing contact pad metallizations, which comprises: applying an electrically-conductive paste to each of said contact pad metallizations on at least one of said two elements; then polymerizing said electrically-conductive paste; then compressing said polymerized electrically-conductive paste between the mutually-opposing contact pad metallizations of said two elements; and heating at least one of said two elements being connected during compression.
Claim 3
Dependent Claim
54 words
A method as claimed in claim 1, wherein the contact pad metallization on at least one semiconductor element comprises a conductive material selected from the group consisting of aluminum, copper, nickel, gold, titanium, germanium, silicon, molybdenum, chromium, cobalt, tin, cadmium, silver, platinum, palladium, alloys of silver-palladium, silver-platinum, cobalt-tin, cobalt-nickel, gold-copper-cadmium, gold-silver, titanium-gold, and gold-vanadium.
Claim 4
Dependent Claim
21 words
A method as claimed in claim 1 or 2, wherein said electrically-conductive paste comprises an epoxy resin filled with silver particles.
Claim 5
Dependent Claim
21 words
A method as claimed in claim 1 or 2, wherein said electrically-conductive paste comprises an epoxy resin filled with gold particles.
References Cited (Backward Citations)
US3463698A
Cited
US3697308A
Cited
GB1525148A
Cited
US4127699A
Cited
US4147669A
Cited
US4233103A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-04-17 | 1987-10-17 | 1988-04-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-04-17 | 1991-10-17 | 1992-04-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-04-17 | 1995-10-17 | 1996-04-17 | $7700.00 | Window Closed / Lapsed |