Heat resistant resin composition comprising reaction product of polyamideimide resin, alcohol and acid component.

Claim 2

A heat resistant resin composition comprising a heat resistant resin and a phenolic solvent; the heat resistant resin being produced by reacting with heating (A) a polyamideimide resin obtained by reacting in a phenolic solvent the following components (a) to (e): (a) a polyisocyanate containing an isocyanurate ring in an amount of 0 to 30 equivalent percents based on the total isocyanate equivalent, (b) a diisocyanate free of an isocyanurate ring, (c) a lactam, (d) a tricarboxylic acid anhydride, and (e) a compound different from the component (d) and selected from the group consisting of trimesic acid, tris(2-carboxyethyl)isocyanurate, 3,3',4,4'-butanetricarboxylic acid, anhydrides thereof and a reaction product of trimellitic anhydride and a trimer of isophorone diisocyanate or a trimer of tolylene diisocyanate, in an amount of 0 to 30 equivalent percents based on the total carboxyl equivalent, with (B) an alcohol component selected from the group consisting of a di- or higher polyhydric alcohol and a mixture of a di- or higher polyhydric alcohol with a monohydric alcohol, and (C) an acid component selected from the group consisting of a divalent or higher polyvalent carboxylic acid, an ester thereof and an anhydride thereof.

Claim 3

A composition according to claim 1, wherein the polyisocyanate containing an isocyanurate ring (a) is one obtained by trimerization of an aromatic diisocyanate, an aliphatic diisocyanate, an alicyclic diisocyanate or a polyisocyanate.

Claim 4

A composition according to claim 2, wherein the aromatic diisocyanate is tolylene diisocyanate, or 4,4'-diphenylmethane diisocyanate.

Claim 5

A composition according to claim 2, wherein the alicyclic diisocyanate is isophorone diisocyanate.

Claim 6

A composition according to claim 1, wherein the diisocyanate (b) is 4,4'-diphenylmethane diisocyanate, 4,4'-diphenylether diisocyanate, tolylene diisocyanate or xylylene diisocyanate.

Claim 7

A composition according to claim 1, wherein the lactam (c) is ε-caprolactam.

Claim 8

A composition according to claim 1, wherein the tricarboxylic acid anhydride (d) is trimellitic acid anhydride.

Claim 9

A composition according to claim 1, wherein the alcohol component (B) contains tris(2-hydroxyethyl)isocyanurate.

Claim 10

A composition according to claim 1, wherein the acid component (C) contains dimethyl terephthalate, terephthalic acid.

Claim 11

A composition according to claim 1, wherein the amount of lactam (c) is 10 to 100 equivalent percents based on the total isocyanate equivalent.

Claim 12

A composition according to claim 1, wherein the sum of the equivalent percent of the component (a) based on the total isocyanate equivalent and the equivalent percent of the component (e) based on the total carboxyl equivalent is in the range of 3 to 30 equivalent percents.

Claim 13

A composition according to claim 1, wherein the polyamideimide (A) is branched and is obtained from a polyisocyanate containing an isocyanurate ring, a diisocyanate, a lactam, and a tricarboxylic acid anhydride.

Claim 14

A composition according to claim 1, wherein the phenolic solvent is cresol, phenol, N-methylpyrrolidone, xylene, or a mixture thereof.

Claim 15

A composition according to claim 1, which further comprises at least one member selected from the group consisting of metallic salts of organic acids and titanium compounds in an amount of 0.05 to 20% by weight based on the weight of the heat resistant resin.

Claim 16

A composition according to claim 14, wherein the titanium compound is tetrabutyl titanate.

Claim 17

A composition according to claim 1, which further comprises, based on the weight of the heat resistant resin, 0.1 to 25% by weight of at least one member selected from the group consisting of an epoxy resin, a phenol-formaldehyde resin, a polyether resin, a polyamide resin, a polyesterimide resin, a polyhydanotoin resin, an alkoxy modified amino resin, a polysulfone resin, a furan resin, and a phenoxy resin.

Claim 18

A composition according to claim 1, which further comprises 0.1 to 25% by weight of an alkoxy modified amino resin.

Claim 19

A composition according to claim 1, wherein the polyisocyanate containing an isocyanurate ring is obtained by a trimerization of an aromatic diisocyanate, an aliphatic diisocyanate, an alicyclic diisocyanate or a polyisocyanate.

Claim 20

A composition according to claim 17, wherein the diisocyanate free of an isocyanurate ring is selected from the group consisting of an aromatic diisocyanate, an aliphatic diisocyanate, and an alicyclic diisocyanate.

Claim 21

A composition according to claim 2, wherein said aliphatic diisocyanate is selected from the group consisting of ethylene diisocyanate, 1,4-tetramethylene diisocyanate and 1,6-hexamethylene diisocyanate.

Claim 22

A process for producing a heat resistant resin which comprises reacting with heating (A) a polyamideimide resin obtained by reacting in a phenolic solvent the following components (a) to (e): (a) a polyisocyanate containing an isocyanurate ring in an amount of 0 to 30 equivalent percents based on the total isocyanate equivalent, (b) a diisocyanate free of an isocyanurate ring, (c) a lactam, (d) a tricarboxylic acid anhydride, and (e) a compound different from the component (d) and selected from the group consisting of trimesic acid, tris(2-carboxyethyl)isocyanurate, 3,3',4,4'-benzophenonetetracarboxylic acid, 1,2,3,4-butanetetracarboxylic acid, 1,2,4-butanetricarboxylic acid, anhydrides thereof, and a reaction product of trimellitic anhydride and a trimer of isophorone diisocyanate or a trimer of tolylene diisocyanate, in an amount of 0 to 30 equivalent percents based on the total carboxyl equivalent, with (B) an alcohol component selected from the group consisting of a di- or higher polyhydric alcohol and a mixture of a di- or higher polyhydric alcohol with a monohydric alcohol, and (C) an acid component selected from the group consisting of a divalent or higher polyvalent carboxylic acid, an ester thereof and an anhydride thereof.

Claim 23

A process for producing a heat resistant resin which comprises reacting with heating (A) a polyamideimide resin obtained by reacting in a phenolic solvent the following components (a) to (e): (a) a polyisocyanate containing an isocyanurate ring in an amount of 0 to 30 equivalent percents based on the total isocyanate equivalent, (b) a diisocyanate free of an isocyanurate ring, (c) a lactam, (d) a tricarboxylic acid anhydride, and (e) a compound different from the component (d) and selected from the group consisting of trimesic acid, tris(2-carboxyethyl)isocyanurate, 3,3',4,4'-benzophenonetetracarboxylic acid, 1,2,3,4-butanetetracarboxylic acid, 1,2,4-butanetricarboxylic acid, anhydrides thereof, and a reaction product of trimellitic anhydride and a trimer of isophorone diisocyanate or a trimer of tolylene diisocyanate, in an amount of 0 to 30 equivalent percents based on the total carboxyl equivalent, with (B) an alcohol component selected from the group consisting of a di- or higher polyhydric alcohol and a mixture of a di- or higher polyhydric alcohol with a monohydric alcohol, and (C) an acid component selected from the group consisting of a divalent or higher polyvalent carboxylic acid, an ester thereof and an anhydride thereof.

Claim 24

A process according to claim 21, wherein 25 to 500 parts by weight of the polyamideimide resin (A) is reacted with 100 parts by weight of the total of the alcohol component (B) and the acid component (C), and the equivalent ratio of (B)/(C) being 0.6-2.0/1.