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US4430173A
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Additive composition, bath and process for acid copper electroplating
Assignee: Rhone Poulenc Specialites Chimiques
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Filing: 1982-07-16
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Granted: 1984-02-07
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Expires: 2002-07-16
Abstract
Abstract Additive composition for an acid copper electroplating bath, which bath being well adapted for the copper plating of printed circuits, is comprised of (1) the sodium salt of ω-sulfo-n-propyl N,N-diethyldithiocarbamate, (2) polyethylene glycol having an average molecular weight ranging from about 6,000 to 20,000, (3) crystal violet, and (4) sulfuric acid.
Inventors
- 👤 Bernard Boudot
- 👤 Georges Nury
- 👤 Andre Lambert
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 04:57
CPC Classifications
C; C25; C25D; C25D3/00; C25D3/02; C25D3/38
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
38 words
An additive composition for an acid copper electroplating bath, comprising (1) the sodium salt of ω-sulfo-n-propyl N,N-diethyldithiocarbamate, (2) polyethylene glycol having an average molecular weight ranging from about 6,000 to 20,000, (3) crystal violet, and (4) sulfuric acid.
Claim 2
Dependent Claim
38 words
An additive composition for an acid copper electroplating bath, comprising (1) the sodium salt of ω-sulfo-n-propyl N,N-diethyldithiocarbamate, (2) polyethylene glycol having an average molecular weight ranging from about 6,000 to 20,000, (3) crystal violet, and (4) sulfuric acid.
Claim 3
Dependent Claim
61 words
The additive composition as defined by claim 1, wherein the concentration of the sodium salt of ω-sulfo-n-propyl N,N-diethyldithiocarbamate ranges from 0.5 to 10 g/l, the concentration of the crystal violet ranges from 0.1 to 100 g/l, the concentration of the crystal violet ranges from 0.1 to 1 g/l, and the concentration of the sulfuric acid ranges from 0.1 to 0.5 N.
Claim 4
Dependent Claim
53 words
A process for the preparation of the additive composition as defined by claim 1, comprising: (a) intimately admixing the components comprising said composition; and (b) aging the intimate admixture which results at a temperature ranging from about 58° and 70° C., for a period of time of from about 60 to 200 hours.
Claim 5
Dependent Claim
61 words
The additive composition as defined by claim 2, wherein the concentration of the sodium salt of ω-sulfo-n-propyl N,N-diethyldithiocarbamate ranges from 1 to 3 g/l, the concentration of the polyethylene glycol ranges from 15 to 20 g/l, the concentration of the cyrstal violet ranges from 0.2 to 0.5 g/l, and the concentration of the sulfuric acid ranges from 0.1 to 0.2 N.
Claim 6
Dependent Claim
31 words
The process as defined by claim 3, said aging (b) being at a temperature ranging from 60° to 62° C., for a period of time of from 75 to 100 hours.
Claim 7
Dependent Claim
23 words
In an acid copper electroplating bath, the improvement which comprises, as an additive composition therefor, the additive composition as defined by claim 1.
Claim 8
Dependent Claim
16 words
The acid copper electroplating bath as defined by claim 6, containing copper sulfate and sulfuric acid.
Claim 9
Dependent Claim
14 words
The said copper electroplating bath as defined by claim 7, further containing chloride ions.
Claim 10
Dependent Claim
50 words
The acid copper electroplating bath as defined by claim 7, the concentration of the copper sulfate therein ranging from 50 to 250 g/l, the concentration of the sulfuric acid therein ranging from 60 to 250 g/l, and the concentration of the additive composition therein ranging from 2 to 100 ml/l.
Claim 11
Dependent Claim
23 words
The acid copper electroplating bath as defined by claim 9, the concentration of the additive composition therein ranging from 3 to 50 ml/l.
Claim 12
Dependent Claim
34 words
In a method for electrodepositing copper from an aqueous acidic copper plating bath, the improvement which comprises, as the acid copper electroplating bath therefor, the acid copper electroplating bath as defined by claim 9.
Claim 13
Dependent Claim
33 words
The method for electrodepositing copper as defined by claim 11, the bath being at a temperature of less than 60° C. and the current density ranging from 0.5 to 10 A/dm 2 .
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-02-06 | 1987-08-08 | 1988-02-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-02-06 | 1991-08-08 | 1992-02-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-02-06 | 1995-08-08 | 1996-02-07 | $7700.00 | Window Closed / Lapsed |