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US4428802A
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Palladium-nickel alloy electroplating and solutions therefor
Assignee: Nisshin Kasei KK
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Filing: 1981-09-18
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Granted: 1984-01-31
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Expires: 2001-09-18
Abstract
Abstract A palladium-nickel alloy plating solutions formed from tetramminepalladous chloride is provided. The tetramminepalladous chloride is soluble in aqueous ammonia plating solution and is also water soluble. This permits replenishment of the palladium in a palladium-nickel plating solution during plating operation merely by adding the tetramminepalladous palladius chloride as a solid which is easily dissolved. The palladium-nickel alloy plating solutions contain between about 5 to 30 g/l of palladium and 5 to 30 g/l of nickel.
Inventors
- 👤 Masao Kanai
- 👤 Hirotomo Koshiro
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 21:44
CPC Classifications
C; C25; C25D; C25D21/00; C25D21/16; C25D21/18; C25D3/00; C25D3/02; C25D3/56; C25D3/562; C25D3/567
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
64 words
A palladium-nickel alloy electro-plating solution for forming an electro-deposited alloy layer having a palladium content between about 30 and 90%, comprising: an alkaline aqueous solution of from about 5 to 30 g/l of palladium ions, added as tetramminepalladous chloride; and from about 5 to 30 g/l nickel ions; the source of the nickel ions selected from one of ammonium nickel sulfate or nickel acetate.
Claim 2
Dependent Claim
64 words
A palladium-nickel alloy electro-plating solution for forming an electro-deposited alloy layer having a palladium content between about 30 and 90%, comprising: an alkaline aqueous solution of from about 5 to 30 g/l of palladium ions, added as tetramminepalladous chloride; and from about 5 to 30 g/l nickel ions; the source of the nickel ions selected from one of ammonium nickel sulfate or nickel acetate.
Claim 3
Dependent Claim
17 words
A palladium-nickel alloy electroplating solution of claim 1, wherein the pH is between about 7 and 9.
Claim 4
Dependent Claim
21 words
The palladium-nickel alloy electroplating solution of claim 1, further including at least one sulfo compound for providing a more lustrous plating.
Claim 5
Dependent Claim
32 words
The palladium-nickel alloy electroplating solution of claim 3, wherein the sulfo compound is selected from the group consisting of a naphthalene sulfonic acid, naphthalene sulfonates, aromatic sulfonamides, derivatives thereof and mixtures thereof.
Claim 6
Dependent Claim
34 words
The palladium-nickel alloy electroplating solution of claim 1, wherein the source of the nickel is ammonium nickel sulfate and the alloy plating solution includes 10 g/l palladium ions and 10 g/l of nickel ions.
Claim 7
Dependent Claim
33 words
The palladium-nickel alloy electroplating solution of claim 1, wherein the source of the nickel ions is nickel acetate and the alloy plating solution includes 25 g/l palladium ions and 10 g/l nickel ions.
Claim 8
Dependent Claim
56 words
In a process for electrolytic plating of a palladium-nickel alloy including forming an aqueous ammonia plating solution including about 5 to 30 g/l of palladium ions and 5 to 30 g/l of nickel ions, the improvement which comprises replenishing the palladium ions in the plating solution by adding crystalline tetraamminepalladous chloride directly to the plating solution.
Claim 9
Dependent Claim
56 words
In a process for electrolytic plating of a palladium-nickel alloy including forming an aqueous ammonia plating solution including about 5 to 30 g/l of palladium ions and 5 to 30 g/l of nickel ions, the improvement which comprises replenishing the palladium ions in the plating solution by adding crystalline tetraamminepalladous chloride directly to the plating solution.
Claim 10
Dependent Claim
19 words
In the process of plating of claim 7, the step of maintaining the pH between about 7.0 and 9.0.
Claim 11
Dependent Claim
20 words
In the process of plating of claim 7, the step of maintaining the temperature between about 15° and 50° C.
Claim 12
Dependent Claim
20 words
In the process of plating of claim 7, the step of maintaining the temperature between about 25° and 35° C.
Claim 13
Dependent Claim
24 words
In the process of plating of claim 7, the step of maintaining the cathode current density between about 0.5 to 2 A/dm 2 .
Claim 14
Dependent Claim
22 words
In the process of plating of claim 11, the step of maintaining the cathode current density at about 1.0 A/dm 2 .
Claim 15
Dependent Claim
26 words
In the process of plating of claim 7, the step of adding to the plating solution at least one sulfo compound for providing more lusturous plating.
Claim 16
Dependent Claim
90 words
In a process for electrolytic plating of a palladium-nickel alloy including forming an aqueous ammonia plating solution including about 5 to 30 g/l of palladium ions and 5 to 30 g/l of nickel ions and adding to the plating solution at least one sulfo compound selected from the group consisting of naphthalene sulfonic acid, naphthalene sulfonates, aromatic sulfonamides, derivatives thereof and mixtures thereof for providing more lustrous plating, the improvement which comprises replenishing the palladium ions in the plating solution by adding crystalline tetraamminepalladous chloride directly to the plating solution.
Claim 17
Dependent Claim
90 words
In a process for electrolytic plating of a palladium-nickel alloy including forming an aqueous ammonia plating solution including about 5 to 30 g/l of palladium ions and 5 to 30 g/l of nickel ions and adding to the plating solution at least one sulfo compound selected from the group consisting of naphthalene sulfonic acid, naphthalene sulfonates, aromatic sulfonamides, derivatives thereof and mixtures thereof for providing more lustrous plating, the improvement which comprises replenishing the palladium ions in the plating solution by adding crystalline tetraamminepalladous chloride directly to the plating solution.
Claim 18
Dependent Claim
72 words
In a process for electrolytic plating of a palladium-nickel alloy including forming an aqueous ammonia plating solution including about 5 to 30 g/l of palladium ions and 5 to 30 g/l of nickel ions and providing the nickel ions in the aqueous ammonia plating solution by dissolving ammonium nickel sulfate the improvement which comprises replenishing the palladium ions in the plating solution by adding crystalline tetraaminepalladous chloride directly to the plating solution.
Claim 19
Dependent Claim
72 words
In a process for electrolytic plating of a palladium-nickel alloy including forming an aqueous ammonia plating solution including about 5 to 30 g/l of palladium ions and 5 to 30 g/l of nickel ions and providing the nickel ions in the aqueous ammonia plating solution by dissolving ammonium nickel sulfate the improvement which comprises replenishing the palladium ions in the plating solution by adding crystalline tetraaminepalladous chloride directly to the plating solution.
Claim 20
Dependent Claim
71 words
In a process for electrolytic plating of a palladium-nickel alloy including forming an aqueous ammonia plating solution including about 5 to 30 g/l of palladium ions and 5 to 30 g/l of nickel ions and providing the nickel ions in the aqueous ammonia plating solution by dissolving nickel acetate the improvement which comprises replenishing the palladium ions in the plating solution by adding crystalline tetraaminepalladous chloride directly to the plating solution.
Claim 21
Dependent Claim
71 words
In a process for electrolytic plating of a palladium-nickel alloy including forming an aqueous ammonia plating solution including about 5 to 30 g/l of palladium ions and 5 to 30 g/l of nickel ions and providing the nickel ions in the aqueous ammonia plating solution by dissolving nickel acetate the improvement which comprises replenishing the palladium ions in the plating solution by adding crystalline tetraaminepalladous chloride directly to the plating solution.
Claim 22
Dependent Claim
72 words
In a process for electrolytic plating of a palladium-nickel alloy including forming an aqueous ammonia plating solution including about 5 to 30 g/l of palladium ions and 5 to 30 g/l of nickel ions and providing the nickel ions in the aqueous ammonia plating solution by dissolving disodium nickel ethylenediamine-tetraacetate the improvement which comprises replenishing the palladium ions in the plating solution by adding crystalline tetraaminepalladous chloride directly to the plating solution.
Claim 23
Dependent Claim
72 words
In a process for electrolytic plating of a palladium-nickel alloy including forming an aqueous ammonia plating solution including about 5 to 30 g/l of palladium ions and 5 to 30 g/l of nickel ions and providing the nickel ions in the aqueous ammonia plating solution by dissolving disodium nickel ethylenediamine-tetraacetate the improvement which comprises replenishing the palladium ions in the plating solution by adding crystalline tetraaminepalladous chloride directly to the plating solution.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-01-30 | 1987-08-01 | 1988-01-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-01-30 | 1991-08-01 | 1992-01-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-01-30 | 1995-08-01 | 1996-01-31 | $7700.00 | Window Closed / Lapsed |