US4425209A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Photosetting resin compositions
Assignee: Panasonic Holdings Corp
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Filing: 1982-09-21
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Granted: 1984-01-10
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Expires: 2002-09-21
Abstract
Abstract A photosetting resin composition containing more than 10% by weight of one or more resins each having more than 3 functional groups-acryloyl or methacryloyl radicals-and a sensitizer. Since the compositions contain more than 10% by weight of one or more resins each having more than three functional groups, they exhibit very satisfactory and well balanced resistance-to-solder (JISC-6481, 260 DEG C., 10 sec), flexural strength (JISP-8115, 0.38R, 180 DEG bending) and adhesion (JISD-0202, chequer pattern test).
Inventors
- 👤 Keiji Saeki
- 👤 Junji Ikeda
- 👤 Wakahata Tamotsu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 03:55
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/22; B23K35/224; C; C08; C08F; C08F22/00; C08F22/10; C08F22/1006; H; H05; H05K; H05K3/00; H05K3/22; H05K3/28; H05K3/285; H05K3/287; H05K1/00; H05K1/02; H05K1/03; H05K1/0393
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
81 words
A photocurable solder resist for use with flexible printed circuit boards comprising from 10 to 20% by weight of a resin selected from the group consisting of epoxy (metha) acrylate and trimethylol propane triacrylate having at least three groups per molecule selected from acryloyl and methacryloyl groups, from 10 to 12% by weight of an ester (metha) acrylate having two groups per molecule selected from acryloyl and methacryloyl groups, and 32 to 42% by weight of 2-hydroxyethyl methacrylate and a sensitizer.
Claim 2
Dependent Claim
81 words
A photocurable solder resist for use with flexible printed circuit boards comprising from 10 to 20% by weight of a resin selected from the group consisting of epoxy (metha) acrylate and trimethylol propane triacrylate having at least three groups per molecule selected from acryloyl and methacryloyl groups, from 10 to 12% by weight of an ester (metha) acrylate having two groups per molecule selected from acryloyl and methacryloyl groups, and 32 to 42% by weight of 2-hydroxyethyl methacrylate and a sensitizer.
Claim 3
Dependent Claim
34 words
A photocurable solder resist as claimed in claim 1, wherein said resin having at least three groups per molecule selected from acryloyl and methacryloyl groups is selected from epoxyacrylate, trimethylolpropane triacrylate and mixtures thereof.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-01-09 | 1987-07-11 | 1988-01-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-01-09 | 1991-07-11 | 1992-01-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-01-09 | 1995-07-11 | 1996-01-10 | $7700.00 | Window Closed / Lapsed |