Abstract Printed circuits are produced by an additive technique wherein a metal-loaded resinous ink is first printed on the board, the circuit next being covered with a conductive metal powder while the ink is still wet. The powder is then pressed into the ink and the circuit cured. Next, a solder stratum is alloyed with the powder as by a solder paste printed over the circuit and the board heated to cause the solder to alloy with the ink and powder substrates. A solder resist may then be applied selectively over the circuit and multiple layers of circuits may be built up on the board. The conductive ink is an epoxy resin loaded with a metallic powder, preferably copper, with a catalyst added to the ink. The solder paste is a lead-tin alloy containing antimony suspended in a binder and a flux. The apparatus employed to carry out the procedure includes silk screens and a roller arrangement for pressing the metallic powder into the ink. The press includes a plurality of progressively harder rollers. The process may be used to manufacture original circuits, or to repair or make changes to conventional printed circuits.
A printed circuit, comprising: (a) a support stratum providing a dielectric surface; (b) at least one circuit segment bonded to a selected area of said surface; (c) said segment including a stratum of metal loaded resinous ink, a stratum of electrically conductive metal powder bonded to the surface of said ink and a stratum of electrically conductive solder alloyed to said stratum of metal powder; (d) said stratum of metal loaded resinous ink including a phenolic based thermosetting resin of about 24% by weight, untreated copper powder of about 70% by weight, and a mixture of a catalyst of about 6% by weight comprised of anhydrous isopropanal and phosphoric acid; (e) said stratum of electrically conductive metal powder bonded to the surface of said ink and being formed of copper; and (f) said stratum of electrically conductive solder alloyed to said stratum of metal powder being a composition of a lead-tin alloy with antimony of about 80% by weight, an inorganic acid flux of about 5% by weight, and a binder of about 15% by weight, said solder stratum materially enhancing the conductivity of said circuit segment.
Claim 2
Dependent Claim
187 words
A printed circuit, comprising: (a) a support stratum providing a dielectric surface; (b) at least one circuit segment bonded to a selected area of said surface; (c) said segment including a stratum of metal loaded resinous ink, a stratum of electrically conductive metal powder bonded to the surface of said ink and a stratum of electrically conductive solder alloyed to said stratum of metal powder; (d) said stratum of metal loaded resinous ink including a phenolic based thermosetting resin of about 24% by weight, untreated copper powder of about 70% by weight, and a mixture of a catalyst of about 6% by weight comprised of anhydrous isopropanal and phosphoric acid; (e) said stratum of electrically conductive metal powder bonded to the surface of said ink and being formed of copper; and (f) said stratum of electrically conductive solder alloyed to said stratum of metal powder being a composition of a lead-tin alloy with antimony of about 80% by weight, an inorganic acid flux of about 5% by weight, and a binder of about 15% by weight, said solder stratum materially enhancing the conductivity of said circuit segment.
Claim 3
Dependent Claim
26 words
A printed circuit, according to claim 1, including a stratum of electrically insulating material bonded over at least a portion of said surface and said segment.