US4356505A
Expired / Lapsed
US
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Conductive adhesive system including a conductivity enhancer
Assignee: AT&T Inc
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Filing: 1979-11-05
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Granted: 1982-10-26
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Expires: 1999-11-05
Abstract
Abstract An electric conductive adhesive system includes a hydroxy terminated ether or ester thereof which serves as a conductivity enhancer. Conductivity levels attained exceed those of prior art systems.
Inventors
- 👤 Andrew J. Lovinger
- 👤 Louis H. Sharpe
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 05:06
CPC Classifications
H; H01; H01B; H01B1/00; H01B1/20; H01B1/22; H10; H10W; H10W20/00; H10W20/40; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/321; H10W72/00; H10W72/071; H10W72/073; H10W72/07331; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W72/353; H10W72/354
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
135 words
A method for bonding one electrical assembly or element to another or to a support member with an epoxy material, comprising the steps of applying an uncured epoxy material comprising a conductivity component consisting essentially of metal powder or flakes, of particle size typically between 0.5 μm and 50 μm, the weight of the conductivity component being between about 25% and about 85% by weight of the epoxy material, and a dispersing component, to at least one surface, applying the surfaces to be bonded together, and curing the epoxy material, the method characterized in that the epoxy material contains 0.1% to 10%, by weight, based on the weight of the epoxy resin, of a conductivity enhancer selected from the group consisting of HO--CH.sub.2 --[CH.sub.2 --O--CH.sub.2 ].sub.n --CH.sub.2 --OH n being within the range of 2-10.
Claim 2
Independent Claim
135 words
A method for bonding one electrical assembly or element to another or to a support member with an epoxy material, comprising the steps of applying an uncured epoxy material comprising a conductivity component consisting essentially of metal powder or flakes, of particle size typically between 0.5 μm and 50 μm, the weight of the conductivity component being between about 25% and about 85% by weight of the epoxy material, and a dispersing component, to at least one surface, applying the surfaces to be bonded together, and curing the epoxy material, the method characterized in that the epoxy material contains 0.1% to 10%, by weight, based on the weight of the epoxy resin, of a conductivity enhancer selected from the group consisting of HO--CH.sub.2 --[CH.sub.2 --O--CH.sub.2 ].sub.n --CH.sub.2 --OH n being within the range of 2-10.
Claim 3
Dependent Claim
15 words
The method of claim 1 in which the epoxy material additionally contains a curing agent.
Claim 4
Dependent Claim
106 words
An electrical device, comprising at least two elements bonded together with an electrically conductive bonding material comprising an epoxy resin, a conductivity component consisting essentially of metal powder or flakes of particle size, typically between 0.5 μm and 50 μm, the weight of the conductivity component being between about 25% and about 85% by weight of the epoxy material, and a dispersing component, characterized in that the bonding material further comprises 0.1% to 10%, by weight, based on the weight of the epoxy resin, of a conductivity enhancer selected from the group consisting of HO--CH.sub.2 --[CH.sub.2 --O--CH.sub.2 ].sub.n--CH.sub.2 --OH n being within the range of 2-10.
Claim 5
Dependent Claim
106 words
An electrical device, comprising at least two elements bonded together with an electrically conductive bonding material comprising an epoxy resin, a conductivity component consisting essentially of metal powder or flakes of particle size, typically between 0.5 μm and 50 μm, the weight of the conductivity component being between about 25% and about 85% by weight of the epoxy material, and a dispersing component, characterized in that the bonding material further comprises 0.1% to 10%, by weight, based on the weight of the epoxy resin, of a conductivity enhancer selected from the group consisting of HO--CH.sub.2 --[CH.sub.2 --O--CH.sub.2 ].sub.n--CH.sub.2 --OH n being within the range of 2-10.
Claim 6
Dependent Claim
104 words
An integrated circuit, comprising a semiconductor chip bonded to a support substrate with an epoxy resin comprising a conductivity component consisting essentially of metal powder or flakes, of particle size typically between 0.5 μm and 50 μm, the weight of the conductivity component being between about 25% and about 85% by weight of the epoxy material, and a dispersing component, characterized in that the bonding material further comprises 0.1% to 10%, by weight, based on the weight of the epoxy resin, of a conductivity enhancer selected from the group consisting of HO--CH.sub.2 --[CH.sub.2 --O--CH.sub.2 ].sub.n --CH.sub.2 --OH n being within the range of 2-10.
Claim 7
Dependent Claim
104 words
An integrated circuit, comprising a semiconductor chip bonded to a support substrate with an epoxy resin comprising a conductivity component consisting essentially of metal powder or flakes, of particle size typically between 0.5 μm and 50 μm, the weight of the conductivity component being between about 25% and about 85% by weight of the epoxy material, and a dispersing component, characterized in that the bonding material further comprises 0.1% to 10%, by weight, based on the weight of the epoxy resin, of a conductivity enhancer selected from the group consisting of HO--CH.sub.2 --[CH.sub.2 --O--CH.sub.2 ].sub.n --CH.sub.2 --OH n being within the range of 2-10.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1985-10-25 | 1986-04-26 | 1986-10-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1989-10-25 | 1990-04-26 | 1990-10-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1993-10-25 | 1994-04-26 | 1994-10-26 | $7700.00 | Window Closed / Lapsed |