US4419192A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for galvanic deposition of copper
Assignee: Atotech Deutschland GmbH and Co KG
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Filing: 1981-03-17
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Granted: 1983-12-06
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Expires: 2001-03-17
Abstract
Abstract In a method for galvanic deposition of smooth and ductile copper from acid copper baths, the metal content of the bath is kept constant by using inert anodes together with soluble anodes. The inert anodes are made of precious metal, precious metal alloys or their compounds. The ratio of the geometric surface of inert to soluble anode should amount to from 1:1 to 1:200, preferably from 1:5 to 1:20. The inert anode may be provided with additional potential, and the acid bath may contain organic thio compounds. The method is useful for building up conductor paths of printed circuits.
Inventors
- 👤 Wolfgang Dahms
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 12:49
CPC Classifications
C; C25; C25D; C25D3/00; C25D3/02; C25D3/38; C25D17/00; C25D17/10
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
110 words
Method for galvanic deposition of smooth and ductile copper from acid copper baths, the metal content of which baths remains unchanged during the deposition, comprising the steps of providing an acid copper bath, inserting the object to be plated into said bath, connecting said object as a cathode, immersing into said bath a combination of soluble anode and inert anode composed of precious metal, precious metal alloys or their compounds, connecting said anodes to a source of electrical energy, using the anodes in which the ratio of the geometric surface of inert to soluble anode amounts to from 1:1 to 1:200, and providing the inert anode additionally with a potential.
Claim 2
Dependent Claim
110 words
Method for galvanic deposition of smooth and ductile copper from acid copper baths, the metal content of which baths remains unchanged during the deposition, comprising the steps of providing an acid copper bath, inserting the object to be plated into said bath, connecting said object as a cathode, immersing into said bath a combination of soluble anode and inert anode composed of precious metal, precious metal alloys or their compounds, connecting said anodes to a source of electrical energy, using the anodes in which the ratio of the geometric surface of inert to soluble anode amounts to from 1:1 to 1:200, and providing the inert anode additionally with a potential.
Claim 3
Dependent Claim
24 words
Method according to claim 1, wherein said inert anodes are made from platinum, iridium, rhodium, palladium, gold, ruthenium, rhenium, their alloys, oxides or carbides.
Claim 4
Dependent Claim
14 words
Method according to claim 1, wherein said ratio amounts to from 1:5 to 1:20.
Claim 5
Dependent Claim
14 words
Method according to claim 1, wherein said acid copper baths contain organic thio compounds.
Claim 6
Dependent Claim
14 words
Method according to claim 1 for building up the conductor paths of printed circuits.
Claim 7
Dependent Claim
11 words
Method according to claim 1, wherein said bath contains selenium compounds.
Claim 8
Dependent Claim
33 words
Method according to claim 1, wherein the operating conditions of said baths include pH-value of less than 1, temperature between 15° and 35° C. and cathode current density of 0.5-8 A/dm 2 .
References Cited (Backward Citations)
US1465034A
Cited
US2133255A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-12-05 | 1987-06-06 | 1987-12-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-12-05 | 1991-06-06 | 1991-12-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-12-05 | 1995-06-06 | 1995-12-06 | $7700.00 | Window Closed / Lapsed |