US4418466A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making a linear light-detecting diode integrated circuit
Assignee: United States Department of the Army
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Filing: 1981-04-27
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Granted: 1983-12-06
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Expires: 2001-04-27
Abstract
Abstract An array for light-detecting diodes is inserted into a cavity in an electally insulating substrate with trimmable resistances on the substrate. The substrate is cooled, the diodes are connected to the resistances and are energized via electrical conductors on the substrate and in the cavity, and their individual near infrared light detectivities are measured. The resistors are trimmed by a laser beam such that all diodes have the same amount of detectivity. The substrate is allowed to return to ambient temperature, is mounted on a cold finger, and electrical conductors are made between the resistance-diode combinations and connectors on the cold finger.
Inventors
- 👤 James R. Piedmont
- 👤 Michael Hacskaylo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 22:55
CPC Classifications
H; H10; H10W; H10W90/00
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
108 words
The method of making a linear light-detecting diode array integrated circuit, including at least the steps of: (a) preparing a linear array of diodes; (b) preparing a substrate with resistors thereon corresponding to said diodes; (c) mounting said array on said substrate and electrically connecting said resistors to corresponding diodes; (d) placing said substrate on a temporary cold station; (e) testing the light detectivity of said diodes to determine normalization resistance values therefor, and trimming corresponding resistances to such values; (f) removing said substrate from said cold station; (g) bonding said substrate to a cold finger; and (h) connecting external leads on said substrate and said cold finger.
Claim 2
Independent Claim
108 words
The method of making a linear light-detecting diode array integrated circuit, including at least the steps of: (a) preparing a linear array of diodes; (b) preparing a substrate with resistors thereon corresponding to said diodes; (c) mounting said array on said substrate and electrically connecting said resistors to corresponding diodes; (d) placing said substrate on a temporary cold station; (e) testing the light detectivity of said diodes to determine normalization resistance values therefor, and trimming corresponding resistances to such values; (f) removing said substrate from said cold station; (g) bonding said substrate to a cold finger; and (h) connecting external leads on said substrate and said cold finger.
Claim 3
Dependent Claim
56 words
The method as set forth in claim 1 wherein step (b) includes the steps of: (1) forming a cavity in said substrate of physical dimension equal to those of the diode array; (2) depositing resistors onto said substrate corresponding to said diodes; and (3) depositing an electrical conductor on the walls and bottom of said cavity.
References Cited (Backward Citations)
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US4097988A
Cited
US4304624A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-12-05 | 1987-06-06 | 1987-12-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-12-05 | 1991-06-06 | 1991-12-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-12-05 | 1995-06-06 | 1995-12-06 | $7700.00 | Window Closed / Lapsed |