Lower temperature glass and hermetic seal means and method

Claim 2

In a method for making an electrical device having at least one electrically conductive member hermetically sealed to another member by a sealing material, the improvement comprising: utilizing a lead-free glass plus alumina ceramic sealing material consisting essentially of the following ingredients by weight percent in the range of: ______________________________________ Ingredients Composition Range ______________________________________ SiO.sub.2 34-50 Al.sub.2 O.sub.3 2-25 K.sub.2 O 2-6 Na.sub.2 O 4-9 Li.sub.2 O 2-6 CaO 0-4 ZnO 4-12 BaO 1-5 TiO.sub.2 2-6 B.sub.2 O.sub.3 11-21 ______________________________________

Claim 3

The method of claim 1 wherein 30 to 90 percent of the Al 2 O 3 in the sealing material is mixed into the sealing material in powdered form after substantially all other ingredients have been melted, formed into frit, and ground.

Claim 4

The method of claim 1 wherein the sealing material consists essentially of the following ingredients by weight percent in the range of: ______________________________________ Ingredients Composition Range ______________________________________ SiO.sub.2 38-47 Al.sub.2 O.sub.3 7-22 K.sub.2 O 3-5 Na.sub.2 O 5-8 Li.sub.2 O 3-5 CaO 1-2 ZnO 6-10 BaO 1-3 TiO.sub.2 3-5 B.sub.2 O.sub.3 13-20 ______________________________________

Claim 5

The method of claim 1 wherein the sealing material consists essentially of the following ingredients by weight percent in the range of: ______________________________________ Ingredients Composition Range ______________________________________ SiO.sub.2 43-47 Al.sub.2 O.sub.3 7-11 K.sub.2 O 3-5 Na.sub.2 O 6-8 Li.sub.2 O 3-5 CaO 1-2 ZnO 7-10 BaO 1-3 TiO.sub.2 3-5 B.sub.2 O.sub.3 15-20 ______________________________________ and wherein the sealing material has an average coefficient of thermal expansion between 25° C. and 300° C. in the range of 83-91×10 -7 per °C.

Claim 6

The method as set forth in claim 1, 2, 3 or 4 further comprising preplating at least one electrically conductive member with a nickel alloy coating prior to sealing with said sealing material.

Claim 7

An enclosure for an electrical device comprising: a portion of said enclosure containing at least one aperture; at least one electrically conductive lead positioned within said aperture; and means within said aperture and surrounding said at least one lead for sealing said aperture, said means comprising a lead-free glass plus alumina ceramic sealing material consisting essentially of the following ingredients by weight percent in the range: ______________________________________ Ingredients Composition Range ______________________________________ SiO.sub.2 34-50 Al.sub.2 O.sub.3 2-25 K.sub.2 O 2-6 Na.sub.2 O 4-9 Li.sub.2 O 2-6 CaO 0-4 ZnO 4-12 BaO 1-5 TiO.sub.2 2-6 B.sub.2 O.sub.3 11-21 ______________________________________

Claim 8

An enclosure for an electrical device comprising: a portion of said enclosure containing at least one aperture; at least one electrically conductive lead positioned within said aperture; and means within said aperture and surrounding said at least one lead for sealing said aperture, said means comprising a lead-free glass plus alumina ceramic sealing material consisting essentially of the following ingredients by weight percent in the range: ______________________________________ Ingredients Composition Range ______________________________________ SiO.sub.2 34-50 Al.sub.2 O.sub.3 2-25 K.sub.2 O 2-6 Na.sub.2 O 4-9 Li.sub.2 O 2-6 CaO 0-4 ZnO 4-12 BaO 1-5 TiO.sub.2 2-6 B.sub.2 O.sub.3 11-21 ______________________________________

Claim 9

The enclosure of claim 6 wherein 30 to 90 percent of the Al 2 O 3 in the sealing material is mixed into the sealing material in powdered form after substantially all other ingredients have been melted, formed into frit, and ground.

Claim 10

The enclosure of claim 6 wherein the sealing material has a composition consisting essentially of the following ingredients by weight percent in the range: ______________________________________ Ingredients Composition Range ______________________________________ SiO.sub.2 38-47 Al.sub.2 O.sub.3 7-22 K.sub.2 O 3-5 Na.sub.2 O 5-8 Li.sub.2 O 3-5 CaO 1-2 ZnO 6-10 BaO 1-3 TiO.sub.2 3-5 B.sub.2 O.sub.3 13-20 ______________________________________

Claim 11

The enclosure of claim 6 wherein the sealing material has a composition consisting essentially of the following ingredients by weight percent in the range: ______________________________________ Ingredients Composition Range ______________________________________ SiO.sub.2 43-47 Al.sub.2 O.sub.3 7-11 K.sub.2 O 3-5 Na.sub.2 O 6-8 Li.sub.2 O 3-5 CaO 1-2 ZnO 7-10 BaO 1-3 TiO.sub.2 3-5 B.sub.2 O.sub.3 15-20 ______________________________________ and wherein the sealing material has an average coefficient of thermal expansion between 25° C. and 300° C. in the range of 83-91×10 -7 per °C.

Claim 12

The enclosure for an electrical device of claim 6, 7, 8 or 9 wherein said portion of said enclosure and said at least one electrically conductive lead are coated with a corrosion resistant material prior to sealing said aperture with said sealing material.