Patent US6345216B1 successfully refreshed from Google Patents.
US4416725A
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Copper texturing process
Assignee: International Business Machines Corp
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Filing: 1982-12-30
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Granted: 1983-11-22
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Expires: 2002-12-30
Abstract
Abstract The invention is a room-temperature dry process for texturing copper on polyester, to improve adhesion of coatings to the copper surface through mechanical as well as chemical bonding. An iodine plasma is produced by backfilling an evacuated chamber with iodine and applying an RF potential. The iodine plasma includes both positive and negative iodine ions. Unprotected surface areas of the copper form a copper iodide; when the copper iodide is removed, the remaining surface is highly textured. The associated polyester is not damaged. The copper iodide is conveniently removed by a 10% hydrochloric acid solution which has no damaging effects on the associated polyester or on the metallic copper, or on associated polyester in a plastic laminated with copper.
Inventors
- 👤 Jerome J. Cuomo
- 👤 Pamela A. Leary
- 👤 Dennis S. Yee
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 10:54
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/38; H05K3/382; C; C23; C23F; C23F4/00; H05K2203/00; H05K2203/09; H05K2203/095
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
79 words
A room temperature dry process for providing an adherent textured surface to copper characterized by placing the sample within an evacuable chamber; evacuating the chamber; backfilling the chamber with iodine vapor to a pressure of ≈30 μTorr; maintaining the sample at a temperature range room temperature to 50° C.; applying an RF voltage of approximately 300 V at 50 watts power to grow a copper iodide layer; and removing the copper iodide and removing the sample from the chamber.
Claim 2
Dependent Claim
79 words
A room temperature dry process for providing an adherent textured surface to copper characterized by placing the sample within an evacuable chamber; evacuating the chamber; backfilling the chamber with iodine vapor to a pressure of ≈30 μTorr; maintaining the sample at a temperature range room temperature to 50° C.; applying an RF voltage of approximately 300 V at 50 watts power to grow a copper iodide layer; and removing the copper iodide and removing the sample from the chamber.
Claim 3
Dependent Claim
22 words
The process according to claim 1, further characterized by washing the sample in a dilute acid solution to remove the copper iodide.
Claim 4
Dependent Claim
16 words
The process according to claim 2 further characterized in that said temperature range is ≈30° C.
Claim 5
Dependent Claim
17 words
The process according to claim 2 further characterized in that said dilute acid solution is ≈10% HCl.
Claim 6
Dependent Claim
97 words
A room temperature dry process for providing an adherent textured surface to a plastic copper laminated sample characterized by mounting the plastic copper laminate sample within an evacuable chamber; evacuating the chamber; backfilling the chamber with iodine vapor to a pressure of ≈30 μTorr; maintaining the sample at a temperature range below degradation temperatures for the plastic copper laminate; applying an RF voltage of approximately 300 V at 50 watts power to grow a copper iodide layer on the exposed copper surface; and removing the copper iodide and removing the plastic copper laminate sample from the chamber.
Claim 7
Dependent Claim
97 words
A room temperature dry process for providing an adherent textured surface to a plastic copper laminated sample characterized by mounting the plastic copper laminate sample within an evacuable chamber; evacuating the chamber; backfilling the chamber with iodine vapor to a pressure of ≈30 μTorr; maintaining the sample at a temperature range below degradation temperatures for the plastic copper laminate; applying an RF voltage of approximately 300 V at 50 watts power to grow a copper iodide layer on the exposed copper surface; and removing the copper iodide and removing the plastic copper laminate sample from the chamber.
Claim 8
Dependent Claim
13 words
The process of claim 5 further characterized in that said plastic is polyimide.
Claim 9
Dependent Claim
14 words
The process of claim 5 further characterized in that said plastic is polymethyl methacrylate.
Claim 10
Dependent Claim
15 words
The process of claim 5 further characterized in that said temperature range is ≈30° C.
Claim 11
Dependent Claim
26 words
The process of claim 5 further characterized in that said RF voltage of approximately 300 V at 50 watts power is at a frequency ≈13.56 MHz.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-11-21 | 1987-05-23 | 1987-11-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-11-21 | 1991-05-23 | 1991-11-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-11-21 | 1995-05-23 | 1995-11-22 | $7700.00 | Window Closed / Lapsed |