Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
166 words
The process of manufacture of a high speed, high power transistor comprising the steps of: forming a thin semiconductor body having flat, parallel first and second surfaces; forming a relatively highly doped base region of one of the conductivity types in said first surface of said semiconductor body; said base region occupying a first area over said first surface and having a first depth beneath said first surface; forming a diffusion mask over the exposed surface area of said base region; said mask including a plurality of spaced mask islands which are closely spaced to one another in laterally central areas of said base region and define a relatively large peripheral open-mask area which at least partly encloses said base region first area; and diffusing a planar emitter region of the other of the conductivity types through said mask; the average doping concentration of said emitter region beneath said closely spaced islands being lower than the average doping concentration beneath said relatively large peripheral open-mask area.
Claim 2
Dependent Claim
166 words
The process of manufacture of a high speed, high power transistor comprising the steps of: forming a thin semiconductor body having flat, parallel first and second surfaces; forming a relatively highly doped base region of one of the conductivity types in said first surface of said semiconductor body; said base region occupying a first area over said first surface and having a first depth beneath said first surface; forming a diffusion mask over the exposed surface area of said base region; said mask including a plurality of spaced mask islands which are closely spaced to one another in laterally central areas of said base region and define a relatively large peripheral open-mask area which at least partly encloses said base region first area; and diffusing a planar emitter region of the other of the conductivity types through said mask; the average doping concentration of said emitter region beneath said closely spaced islands being lower than the average doping concentration beneath said relatively large peripheral open-mask area.
Claim 3
Dependent Claim
25 words
The process of claim 1 wherein said base region is of the P type conductivity and said emitter region is of the N type conductivity.
Claim 4
Dependent Claim
15 words
The process of claim 1 wherein said spaced mask islands are parallel, spaced, elongated stripes.
Claim 5
Dependent Claim
14 words
The process of claim 1 wherein said spaced mask islands are discrete, square regions.
Claim 6
Dependent Claim
32 words
The process of claim 1 wherein said closely spaced mask islands have a width which is less than approximately twice the diffusion depth of said emitter region beneath said closely spaced islands.
Claim 7
Dependent Claim
27 words
The process of claim 1 wherein said large peripheral open-mask area has a width of at least about twice the distance between said closely spaced mask islands.
Claim 8
Dependent Claim
44 words
The process of claim 1 wherein a shallow, lightly doped region of said first conductivity type is formed in said first surface prior to the formation therein of said base region; said lightly doped region extending laterally beyond said surface of said base region.
Claim 9
Dependent Claim
19 words
The process of claim 2, 5, 6 or 7 wherein said spaced mask islands are parallel, spaced elongated stripes.
Claim 10
Dependent Claim
18 words
The process of claim 2, 5, 6 or 7 wherein said spaced mask islands are discrete, square regions.
Claim 11
Dependent Claim
42 words
The process of claim 6 wherein a shallow, lightly doped region of said one conductivity type is formed in said first surface prior to the formation therein of said base region; said lightly doped region extending laterally beyond said base region area.
Claim 12
Dependent Claim
58 words
The process of claim 1 which further includes the steps of stripping said mask from at least first and second regions of said first surface and overlying said emitter region and portions of the base region which were masked to prevent emitter diffusion therein respectively, and applying emitter and base contacts to said base and emitter regions respectively.