Microcircuit flat pack with integral shell

Claim 1

Apparatus for forming a microcircuit flat package comprising: an integral and elongated metal tubular shell subassembly having four walls closed on themselves to define two open ends, said walls consisting of first and second broad walls which are joined by respective third and fourth side walls to form said open ends, one of said broad walls having an opening formed therein to provide a continuous and surrounding surface which is peripheral to said opening formed in said broad wall; an elongated integral insulator subassembly having an array of electrical leads extending through and sealed within an insulative glass body, the insulative glass body of the integral insulator subassembly being dimensioned to be received in each said open end of said tubular shell and to align the leads in substantially parallel alignment with the longitudinal axis of said tubular shell, with the peripheral surface of the insulative body in glass-to-metal non-sealing engagement with the surrounding surfaces of said first, second, third, and fourth walls of said integral shell, with each of the leads terminating at an inner end within said tubular shell and with each of the leads terminating at an outer end exteriorly of said tubular shell, said peripheral surface of the insulative body in glass-to-metal non-sealing engagement with the surrounding surfaces of said first, second, third, and fourth walls of said integral shell providing opposed, touching surfaces that can be subsequently sealed together; said continuous peripheral surface surrounding said opening in said one of said broad walls of said tubular shell providing a sealing surface to which a cover can be hermetically sealed.

Claim 7

A method for fabricating a microcircuit flat package comprising the steps of: cutting a tube having first and second broad walls joined by respective third and fourth side walls to form at least one tubular shell of intended length having open ends; forming an opening in one of said broad walls of said at least one tubular shell; inserting a lead frame subassembly having an array of electrical leads extending through and sealed within an elongated insulative body into each of said open ends of said at least one tubular shell, the elongated insulator body adapted to fit within respective open ends of the at least one tubular shell and to align the leads in parallel alignment with the long axis of the at least one tubular shell; and forming a glass-to-metal seal between the elongated insulator body and the surrounding surface of the tubular shell.

Claim 8

A method for fabricating a microcircuit flat package comprising the steps of: cutting a tube having first and second broad walls joined by respective third and fourth side walls to form at least one tubular shell of intended length having open ends; forming an opening in one of said broad walls of said at least one tubular shell; inserting a lead frame subassembly having an array of electrical leads extending through and sealed within an elongated insulative body into each of said open ends of said at least one tubular shell, the elongated insulator body adapted to fit within respective open ends of the at least one tubular shell and to align the leads in parallel alignment with the long axis of the at least one tubular shell; and forming a glass-to-metal seal between the elongated insulator body and the surrounding surface of the tubular shell.