US4410126A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Mass soldering system
Assignee: HOLLIS AUTOMATION Co A Corp OF
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Filing: 1982-08-20
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Granted: 1983-10-18
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Expires: 2002-08-20
Abstract
Abstract A soldering system is described in which a fluid stream is directed onto a soldered board substantially immediately following deposition of molten solder onto the board. Preferably, but not necessarily, the fluid, which may comprise a gas or mixture of gases, is heated prior to contacting the board. The impinging fluid stream relocates solder on, and/or blasts excess solder from the bottom of the board, and any interconnections, component leads and/or component bodies carried thereon before the solder solidifies as shorts, icicles or bridges. If desired, liquid droplets such as soldering oil may be included in the fluid stream.
Inventors
- 👤 Harold T. O'Rourke
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 22:17
CPC Classifications
B; B23; B23K; B23K1/00; B23K1/08; B23K1/085; G; G21; G21F; G21F9/00; G21F9/28; G21F9/30; G21F9/32; H; H05; H05K; H05K2203/00; H05K2203/07; H05K2203/0756; H05K2203/0776; H05K2203/08; H05K2203/081; H05K2203/11; H05K2203/1105
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
146 words
A method of mass joining with solder printed circuit boards having mounted thereon components with leads protruding downward through holes in said board, said method comprising the steps of: depositing a quantity of molten solder onto the underside of said board and said downward protruding leads by passing the bottom surface of the board over a solder wave and substantially immediately following said depositing impinging a stream of heated air directly into the molten solder deposited on the underside of said board and said protruding leads by means of an air knife blast directed towards the solder wave and impinging on the bottom surface of the board sufficiently soon after it leaves the solder wave so that the solder is still molten, the air knife blast having sufficient velocity to remove essentially all bridges and shorts but not sufficient velocity to adversely affect properly wetted joints.
Claim 2
Independent Claim
146 words
A method of mass joining with solder printed circuit boards having mounted thereon components with leads protruding downward through holes in said board, said method comprising the steps of: depositing a quantity of molten solder onto the underside of said board and said downward protruding leads by passing the bottom surface of the board over a solder wave and substantially immediately following said depositing impinging a stream of heated air directly into the molten solder deposited on the underside of said board and said protruding leads by means of an air knife blast directed towards the solder wave and impinging on the bottom surface of the board sufficiently soon after it leaves the solder wave so that the solder is still molten, the air knife blast having sufficient velocity to remove essentially all bridges and shorts but not sufficient velocity to adversely affect properly wetted joints.
Claim 3
Dependent Claim
24 words
A method according to claim 1, wherein said air stream is heated to a temperature in the range of 93° C. to 350° C.
Claim 4
Dependent Claim
25 words
A method according to claim 2, wherein said air stream is heated to a temperature in the range of about 290° C. to 300° C.
Claim 5
Dependent Claim
28 words
A method according to claim 1, further including the step of dispersing liquid droplets in said air stream, and directing the resultant dispersion onto said board and leads.
Claim 6
Dependent Claim
13 words
A method according to claim 4, wherein said liquid droplets comprise soldering oil.
Claim 7
Dependent Claim
14 words
A method according to claim 4, wherein said liquid droplets comprise a wetting agent.
Claim 8
Dependent Claim
14 words
A method according to claim 4, wherein said liquid droplets comprise a flux agent.
Claim 9
Independent Claim
210 words
A method of reducing the incidence of solder shorts, icicling and/or bridging in a mass soldering process in which a quantity of molten solder is deposited onto the underside of a component-carrying printed circuit board and onto those parts of said components which extend below said board underside and at least partially fill with molten solder any holes in said board, said method comprising the steps of: depositing a quantity of molten solder onto the underside of said board and said component parts by passing the bottom surface of said board over a solder wave and substantially immediately following said depositing impinging a stream of heated air directly onto the molten solder deposited on the underside of said board and said component parts by means of an air knife blast directed towards the solder wave and impinging on the bottom surface of said board sufficiently soon after it leaves the solder wave so that the solder thereon is still molten, the air blast having sufficiently low velocity to leave a solder coating in said holes and sufficiently high velocity to remove solder shorts, bridges and icicles remaining on said board as it leaves the solder wave, the air blast increasing forces tending to remove the solder shorts, bridges and icicles.
Claim 10
Independent Claim
210 words
A method of reducing the incidence of solder shorts, icicling and/or bridging in a mass soldering process in which a quantity of molten solder is deposited onto the underside of a component-carrying printed circuit board and onto those parts of said components which extend below said board underside and at least partially fill with molten solder any holes in said board, said method comprising the steps of: depositing a quantity of molten solder onto the underside of said board and said component parts by passing the bottom surface of said board over a solder wave and substantially immediately following said depositing impinging a stream of heated air directly onto the molten solder deposited on the underside of said board and said component parts by means of an air knife blast directed towards the solder wave and impinging on the bottom surface of said board sufficiently soon after it leaves the solder wave so that the solder thereon is still molten, the air blast having sufficiently low velocity to leave a solder coating in said holes and sufficiently high velocity to remove solder shorts, bridges and icicles remaining on said board as it leaves the solder wave, the air blast increasing forces tending to remove the solder shorts, bridges and icicles.
Claim 11
Dependent Claim
24 words
A method according to claim 8 wherein said air stream is heated in a temperature in the range of 93° C. to 350° C.
Claim 12
Dependent Claim
25 words
A method according to claim 9, wherein said air stream is heated to a temperature in the range of about 290° C. to 300° C.
Claim 13
Dependent Claim
28 words
A method according to claim 8, further including the step of dispersing liquid droplets in said air stream, and directing the resultant dispersion onto said board and leads.
Claim 14
Dependent Claim
13 words
A method according to claim 11, wherein said liquid droplets comprise soldering oil.
Claim 15
Dependent Claim
14 words
A method according to claim 11, wherein said liquid droplets comprise a wetting agent.
Claim 16
Dependent Claim
14 words
A method according to claim 11, wherein said liquid droplets comprise a flux agent.
Claim 17
Dependent Claim
210 words
Apparatus for mass joining with solder electrical and electronic components assembled in a circuit board wherein said components have leads which protrude downward through apertures in the board, and comprising in combination: a wave soldering station adapted to provide a wave of molten solder; means for transporting said circuit board across said solder whereby a quantity of molten solder may be deposited onto said circuit board underside and said protruding leads; and an excess solder removal station adjacent said wave soldering station, said excess solder removal station comprising at least one hot air knife disposed below the travel path of said board and adapted to direct a blast of heated air directly onto the molten solder deposited on said board underside, a source of pressurized air, means connecting said source and said hot air knife, and means for heating said air knife blast prior to directing the latter onto said board underside, the air knife blast being directed towards the solder wave and impinging on the bottom surface of the board sufficiently soon after it leaves the solder wave so that the solder is still molten, the air knife blast having sufficient velocity to remove essentially all bridges and shorts but not sufficient velocity to adversely affect properly wetted joints.
Claim 18
Dependent Claim
210 words
Apparatus for mass joining with solder electrical and electronic components assembled in a circuit board wherein said components have leads which protrude downward through apertures in the board, and comprising in combination: a wave soldering station adapted to provide a wave of molten solder; means for transporting said circuit board across said solder whereby a quantity of molten solder may be deposited onto said circuit board underside and said protruding leads; and an excess solder removal station adjacent said wave soldering station, said excess solder removal station comprising at least one hot air knife disposed below the travel path of said board and adapted to direct a blast of heated air directly onto the molten solder deposited on said board underside, a source of pressurized air, means connecting said source and said hot air knife, and means for heating said air knife blast prior to directing the latter onto said board underside, the air knife blast being directed towards the solder wave and impinging on the bottom surface of the board sufficiently soon after it leaves the solder wave so that the solder is still molten, the air knife blast having sufficient velocity to remove essentially all bridges and shorts but not sufficient velocity to adversely affect properly wetted joints.
Claim 19
Dependent Claim
17 words
Apparatus according to claim 15, and further including means for introducing liquid droplets into said air stream.
Claim 20
Dependent Claim
29 words
Apparatus according to claim 16, including a source of said liquid, and wherein said means for introducing comprises at least one aspirator connected to said source of said liquid.
Claim 21
Dependent Claim
30 words
Apparatus according to claim 16, including a source of said liquid, and wherein said means for introducing comprises at least one atomizing nozzle connected to said source of said liquid.
Claim 22
Dependent Claim
56 words
The apparatus of claim 15, wherein said air knife is provided with valve means to give a continuous small flow of air through the knife; and means for detecting the presence of a board over the solder wave to open the valve and provide a full air blast to the board as it leaves the wave.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-10-17 | 1987-04-18 | 1987-10-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-10-17 | 1991-04-18 | 1991-10-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-10-17 | 1995-04-18 | 1995-10-18 | $7700.00 | Window Closed / Lapsed |