Patent US4407860A successfully refreshed from Google Patents.
← Back to Patent Explorer
US4407860A Expired / Lapsed US ⏱️ 0.0 years remaining

Process for producing an improved quality electrolessly deposited nickel layer

Assignee: International Business Machines Corp
•
Filing: 1981-06-30
•
Granted: 1983-10-04
•
Expires: 2001-06-30
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract A method of providing a stress-free metal layer by electroless plating techniques, including the steps of (1) providing a substrate that includes some glass material in at least the surface areas to receive a metal layer, (2) depositing a layer of metal-boron by electroless plating techniques, and (3) heating the resultant metal-boron layer in a non-reacting and/or H 2 environment at a temperature of at least 750° C. for a time sufficient to diffuse the boron to the glass material in the substrate.

Inventors

  • 👤 Rebecca P. Fleming
  • 👤 Samuel Lawhorne, Jr.
  • 👤 John J. Mele
  • 👤 Chandrika Prasad

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-31 17:24
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/38; C; C23; C23C; C23C18/00; C23C18/16; C23C18/1601; C23C18/1603; C23C18/1607; C23C18/1608; C23C18/1633; C23C18/1646; C23C18/165; C23C18/1689; C23C18/1692; C23C18/1696; C23C18/31; C23C18/32; C23C18/34

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 156 words
A process for providing a stress-free pure nickel layer on a ceramic substrate comprising screening on said ceramic substrate selected metallized surface areas formed of a particulate paste mixture that includes a refractory metal selected from the group consisting of Mo, Ta, W and Mn and mixtures thereof, and a particulate glass material in an amount in the range of 0.5 to 15% by weight, and sintering the surface areas, selectively depositing a layer of nickel-boron on said metallized surface areas of said substrate by electroless plating techniques, wherein said boron content is in the range of 0.1 to 3% by weight, and heating the resultant substrate and nickel-boron layer in a non-reacting environment at a temperature of at least 750° C. for a time sufficient to diffuse the boron from the nickel-boron layer to said glass in said metallized surface areas of the substrate, leaving essentially a pure stress-free nickel layer bonded to said substrate.
Claim 2
Dependent Claim 156 words
A process for providing a stress-free pure nickel layer on a ceramic substrate comprising screening on said ceramic substrate selected metallized surface areas formed of a particulate paste mixture that includes a refractory metal selected from the group consisting of Mo, Ta, W and Mn and mixtures thereof, and a particulate glass material in an amount in the range of 0.5 to 15% by weight, and sintering the surface areas, selectively depositing a layer of nickel-boron on said metallized surface areas of said substrate by electroless plating techniques, wherein said boron content is in the range of 0.1 to 3% by weight, and heating the resultant substrate and nickel-boron layer in a non-reacting environment at a temperature of at least 750° C. for a time sufficient to diffuse the boron from the nickel-boron layer to said glass in said metallized surface areas of the substrate, leaving essentially a pure stress-free nickel layer bonded to said substrate.
Claim 3
Dependent Claim 31 words
The process of claim 1 wherein said substrate is heated in a wet or dry hydrogen environment at atmospheric pressure to a temperature in the range of 800° to 900° C.
Claim 4
Dependent Claim 40 words
The process of claim 1 wherein said substrate is heated in an inert environment of a gas selected from the group consisting of argon, helium, nitrogen, and mixtures thereof to a temperature in the range of 750° to 1200° C.
Claim 5
Dependent Claim 21 words
The process of claim 1 wherein said surface layer areas have a thickness in the range of 5 to 50 microns.

References Cited (Backward Citations)

US3579375A Cited
US3632436A Cited
US3539391A Cited
JPS4861976A Cited
US3962143A Cited
US4055706A Cited
JPS5534692A Cited
US4349585A Cited
US4245273A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1986-10-03 1987-04-04 1987-10-04 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1990-10-03 1991-04-04 1991-10-04 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1994-10-03 1995-04-04 1995-10-04 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag