US4407627A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Automatic wafer orienting apparatus
Assignee: Canon Inc
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Filing: 1981-04-21
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Granted: 1983-10-04
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Expires: 2001-04-21
Abstract
Abstract An automatic wafer orienting apparatus comprising a first orienting device for driving and rotating a wafer thereby orienting the wafer while utilizing a peripheral edge and an orientation cut thereof as the guide, a device for disengaging the thus oriented wafer from the first wafer orienting device, and a second wafer orienting device for re-orienting the wafer by pressing a lateral edge and an orientation cut thereof against orienting members provided on a wafer chuck.
Inventors
- 👤 Hiroshi Sato
- 👤 Kei Takatsu
- 👤 Junji Isohata
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 06:55
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/70; G03F7/70691; G03F7/70733; G03F7/7075
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
135 words
An automatic wafer orienting apparatus for orienting a wafer with respect to a wafer chuck prior to alignment with a mask, comprising: a first automatic wafer orienting sub-apparatus comprising: a support plate for supporting a wafer having an orientation cut in a part of the peripheral edge thereof; and wafer position defining members comprising a drive member contacting the peripheral edge of the wafer for rotating said wafer on said support plate and defining members for contacting the peripheral edge of the wafer; a transport device for transporting the wafer oriented in said first automatic wafer orienting sub-apparatus to a second automatic wafer orienting sub-apparatus; and a second automatic wafer orienting sub-apparatus comprising: a wafer chuck; positioning members provided on said wafer chuck; and means for pressing the thus transported wafer against said positioning members.
Claim 2
Dependent Claim
135 words
An automatic wafer orienting apparatus for orienting a wafer with respect to a wafer chuck prior to alignment with a mask, comprising: a first automatic wafer orienting sub-apparatus comprising: a support plate for supporting a wafer having an orientation cut in a part of the peripheral edge thereof; and wafer position defining members comprising a drive member contacting the peripheral edge of the wafer for rotating said wafer on said support plate and defining members for contacting the peripheral edge of the wafer; a transport device for transporting the wafer oriented in said first automatic wafer orienting sub-apparatus to a second automatic wafer orienting sub-apparatus; and a second automatic wafer orienting sub-apparatus comprising: a wafer chuck; positioning members provided on said wafer chuck; and means for pressing the thus transported wafer against said positioning members.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-10-03 | 1987-04-04 | 1987-10-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-10-03 | 1991-04-04 | 1991-10-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-10-03 | 1995-04-04 | 1995-10-04 | $7700.00 | Window Closed / Lapsed |