Patent US4402135A successfully refreshed from Google Patents.
US4402135A
Expired / Lapsed
US
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Method of forming a circuit board
Assignee: Braun GmbH
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Filing: 1981-04-03
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Granted: 1983-09-06
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Expires: 2001-04-03
Abstract
Abstract A circuit board is fabricated by injection molding a support of an insulating material. The support is provided with channels in the pattern of conductive paths. The channels are filled by injection with electrically conductive plastic, and electrically conductive metal is precipitated galvanoplastically on the plastic.
Inventors
- 👤 Otto Schweingruber
- 👤 Werner Hafner
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 12:07
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/22; H05K3/24; H05K3/245; H05K3/246; H05K3/10; H05K3/101; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H05K1/095; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0347; H05K2201/09; H05K2201/09009; H05K2201/09036; H05K2201/09118; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0113; H05K2203/14; H05K2203/1461; H05K3/107; H05K3/30; H05K3/32; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49155; Y10T29/49158
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
110 words
A method of forming a circuit board comprising the steps of: fabricating by injection molding a support of an insulating material having channels in the pattern of one or more electrically conductive paths; injecting an electrically conductive plastic in the channels of the support through a form means having wall portions which cooperate with the channels, the wall portions of the form preventing the channels from being completely filled and thereby forming spaces between the sides of the electrically conductive plastic and the sides of the channels when the form means is removed; and precipitating an electrically conductive metal galvanoplastically on the electrically conductive plastic and in the formed spaces.
Claim 2
Independent Claim
110 words
A method of forming a circuit board comprising the steps of: fabricating by injection molding a support of an insulating material having channels in the pattern of one or more electrically conductive paths; injecting an electrically conductive plastic in the channels of the support through a form means having wall portions which cooperate with the channels, the wall portions of the form preventing the channels from being completely filled and thereby forming spaces between the sides of the electrically conductive plastic and the sides of the channels when the form means is removed; and precipitating an electrically conductive metal galvanoplastically on the electrically conductive plastic and in the formed spaces.
Claim 3
Dependent Claim
23 words
The method as in claim 1 further including the step of affixing pins to the electrically conductive plastic before the step of precipating.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-09-05 | 1987-03-07 | 1987-09-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-09-05 | 1991-03-07 | 1991-09-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-09-05 | 1995-03-07 | 1995-09-06 | $7700.00 | Window Closed / Lapsed |