Abstract A pressure sensor comprises: a pressure sensor chip including a diaphragm, a stationary support supporting said diaphragm, and a bed supporting said stationary support, said diaphragm, said stationary support and said bed being made of a semiconductor material and defining a space which is evacuated; a holding box having at least its bottom made of metal and having a hole for internal wiring, said holding box accommodating and holding said pressure sensor chip such that the opposite side to the diaphragm of said pressure sensor chip is in contact with the inner side of said bottom and that said pressure sensor chip is restricted from movement; and a package placing and adhering said holding box in position.
A pressure sensor comprising: a pressure sensor chip including a diaphragm, a stationary support supporting said diaphragm, and a bed supporting said stationary support, said diaphragm, said stationary support and said bed being made of a semiconductor material and defining a space which is evacuated; a holding box having at least its bottom made of metal and having a hole for internal wiring, said holding box accommodating and holding said pressure sensor chip such that the opposite side to the diaphragm of said pressure sensor chip is in contact with the inner side of said bottom and that said pressure sensor chip is restricted from movement; and a package placing and adhering said holding box in position.
Claim 2
Dependent Claim
117 words
A pressure sensor comprising: a pressure sensor chip including a diaphragm, a stationary support supporting said diaphragm, and a bed supporting said stationary support, said diaphragm, said stationary support and said bed being made of a semiconductor material and defining a space which is evacuated; a holding box having at least its bottom made of metal and having a hole for internal wiring, said holding box accommodating and holding said pressure sensor chip such that the opposite side to the diaphragm of said pressure sensor chip is in contact with the inner side of said bottom and that said pressure sensor chip is restricted from movement; and a package placing and adhering said holding box in position.
Claim 3
Dependent Claim
15 words
A pressure sensor as set forth in claim 1, wherein said semiconductor material is silicon.