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US4396929A Expired / Lapsed US ⏱️ 0.0 years remaining

Gallium nitride light-emitting element and method of manufacturing the same

Assignee: Panasonic Holdings Corp
•
Filing: 1980-10-20
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Granted: 1983-08-02
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Expires: 2000-10-20
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Abstract

Abstract The substrate of a gallium nitride light-emitting diode is made rough at given positions on the surface thereof, or an insulating film strip pattern is attached on the surface of the substrate prior to growing an n-type conductive gallium nitride layer and a semi-insulating gallium nitride layer thereon. As a result, high conductivity regions are formed in the semi-insulating layer at positions corresponding to the rough surfaces or the insulating film strip pattern in such a manner that each of the high conductivity region extends from the n-type conductive layer to the upper surface of the semi-insulating layer so as to function as a conductor to be connected to an electrode. In the same manner similar high conductive regions are made along kerf portions in a diode wafer, preventing each diode chip from being damaged on cutting.

Inventors

  • 👤 Yoshimasa Ohki
  • 👤 Yukio Toyoda
  • 👤 Hiroyuki Kobayashi
  • 👤 Isamu Akasaki

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-25 14:53
CPC Classifications
H; H10; H10H; H10H20/00; H10H20/80; H10H20/81; H10H20/8215; H10H20/817; H10H20/818; H10H20/01; H10H20/032; H10H20/83; H10H20/831; H10H20/8312; H10H20/85; H10H20/857; H10W; H10W90/00; H10W90/701; H10W90/721; H10W90/726

Claims Analysis

Total Claims: 22
Claim 1
Independent Claim 169 words
A light-emitting diode chip comprising: (a) a single crystal substrate having a rough area at a given position in one surface thereof; (b) a conductive gallium nitride layer formed on said surface of said substrate; (c) a semi-insulating galluim nitride layer formed on said conductive gallium nitride layer, said semi-insulating gallium nitride layer including an impurity; (d) a high conductivity gallium nitride region formed on said conductive gallium nitride layer, said high conductivity region being formed at a position corresponding to said rough area, and extending to the level of the upper surface of said semi-insulating gallium nitride layer, said high conductivity region being simultaneously formed when said semi-insulating gallium nitride layer is formed to include said impurity, and having a conductance greater than that of the conductive gallium nitride layer, both said conductive gallium nitride layer and said semi-insulating gallium nitride layer being formed by a single epitaxial growth; and (e) first and second electrodes respectively formed on said high conductivity region and said semi-insulating gallium nitride layer.
Claim 2
Dependent Claim 169 words
A light-emitting diode chip comprising: (a) a single crystal substrate having a rough area at a given position in one surface thereof; (b) a conductive gallium nitride layer formed on said surface of said substrate; (c) a semi-insulating galluim nitride layer formed on said conductive gallium nitride layer, said semi-insulating gallium nitride layer including an impurity; (d) a high conductivity gallium nitride region formed on said conductive gallium nitride layer, said high conductivity region being formed at a position corresponding to said rough area, and extending to the level of the upper surface of said semi-insulating gallium nitride layer, said high conductivity region being simultaneously formed when said semi-insulating gallium nitride layer is formed to include said impurity, and having a conductance greater than that of the conductive gallium nitride layer, both said conductive gallium nitride layer and said semi-insulating gallium nitride layer being formed by a single epitaxial growth; and (e) first and second electrodes respectively formed on said high conductivity region and said semi-insulating gallium nitride layer.
Claim 3
Dependent Claim 17 words
A light-emitting diode chip as claimed in claim 1, wherein said rough area is an undulatory portion.
Claim 4
Dependent Claim 25 words
A light-emitting diode chip as claimed in claim 1, wherein said rough area comprises one groove or more made on the surface of said substrate.
Claim 5
Dependent Claim 17 words
A light-emitting diode chip as claimed in claim 1, wherein said rough area has a strip-like shape.
Claim 6
Dependent Claim 167 words
A light-emitting diode chip comprising: (a) a single crystal substrate having an insulating film at a given position in one surface thereof; (b) a conductive gallium nitride layer formed on said surface of said substrate; (c) a semi-insulating gallium nitride layer formed on said conductive gallium nitride layer, said semi-insulating gallium nitride layer including an impurity; (d) a high conductivity region formed on said conductive gallium nitride layer, said high conductivity region being formed at a position corresponding to said insulating film, and extending to the level of the upper surface of said semi-insulating gallium nitride layer, said high conductivity region being simultaneously formed when said semi-insulating gallium nitride layer is formed to include said impurity, and having a conductance greater than that of the conductive gallium nitride layer, both said conconductive gallium nitride layer and said semi-insulating gallium nitride layer being formed by a single epitaxial growth; and (e) first and second electrodes respectively formed on said high conductivity region and said semi-insulating gallium nitride layer.
Claim 7
Dependent Claim 167 words
A light-emitting diode chip comprising: (a) a single crystal substrate having an insulating film at a given position in one surface thereof; (b) a conductive gallium nitride layer formed on said surface of said substrate; (c) a semi-insulating gallium nitride layer formed on said conductive gallium nitride layer, said semi-insulating gallium nitride layer including an impurity; (d) a high conductivity region formed on said conductive gallium nitride layer, said high conductivity region being formed at a position corresponding to said insulating film, and extending to the level of the upper surface of said semi-insulating gallium nitride layer, said high conductivity region being simultaneously formed when said semi-insulating gallium nitride layer is formed to include said impurity, and having a conductance greater than that of the conductive gallium nitride layer, both said conconductive gallium nitride layer and said semi-insulating gallium nitride layer being formed by a single epitaxial growth; and (e) first and second electrodes respectively formed on said high conductivity region and said semi-insulating gallium nitride layer.
Claim 8
Dependent Claim 27 words
A light-emitting diode chip as claimed in claim 1 or 5, wherein said high conductivity region is formed along the peripheral portion of said light-emitting diode chip.
Claim 9
Dependent Claim 26 words
A light-emitting diode chip as claimed in claim 1 or 5, wherein said high conductivity region is formed at a position surrounding by said semi-insulating layer.
Claim 10
Dependent Claim 24 words
A light-emitting diode chip as claimed in claim 1 or 5, wherein said high conductivity region is formed between portions of said semi-insulating layer.
Claim 11
Dependent Claim 40 words
A light-emitting diode chip as claimed in claim 1 or 5, further comprising another high conductivity region formed integrally with said conductive gallium nitride layer, said another conductivity region being formed along the peripheral portion of said light-emitting diode chip.
Claim 12
Dependent Claim 21 words
A light-emitting diode chip as claimed in claim 1 or 5, wherein said high conductivity region comprises an irregularly grown layer.
Claim 13
Dependent Claim 19 words
A light-emitting diode chip as claimed in claim 1 or 5, wherein said high conductivity region comprises a polycrystalline.
Claim 14
Dependent Claim 19 words
A light-emitting diode chip as claimed in claim 1 or 5, wherein said substrate is made of a semiconductor.
Claim 15
Dependent Claim 20 words
A light-emitting diode chip as claimed in claim 1 or 5, wherein said substrate is made of an insulating material.
Claim 16
Dependent Claim 16 words
A light-emitting diode chip as claimed in claim 1 or 5, wherein said substrate is transparent.
Claim 17
Dependent Claim 18 words
A light-emitting diode chip as claimed in claim 1 or 5, wherein said substrate is made of sapphire.
Claim 18
Dependent Claim 208 words
A light-emitting diode chip comprising: (a) a single crystal substrate having a rough area at a given position in one surface thereof; (b) a conductive gallium nitride layer formed on said surface of said substrate; (c) a semi-insulating gallium nitride layer formed on said conductive gallium nitride layer, said semi-insulating gallium nitride layer including an impurity; (d) a high conductivity gallium nitride region formed on said conductive gallium nitride layer, said high conductivity region being formed at a position corresponding to said rough area, and extending to the level of the upper surface of said semi-insulating gallium nitride layer, said high conductivity region being simultaneously formed when said semi-insulating gallium nitride layer is formed to include said impurity, and having a conductance greater than that of the conductive gallium nitride layer, both said conductive gallium nitride layer and said semi-insulating gallium nitride layer being formed by a single epitaxial growth; (e) first and second electrodes respectively formed on said high conductivity region and said semi-insulating gallium nitride layer; and (f) a stem assembly having first and second stem electrodes and an insulator for insulating said first and second stem electrodes from each other, said first and second electrodes being respectively mounted on said first and second stem electrode.
Claim 19
Dependent Claim 208 words
A light-emitting diode chip comprising: (a) a single crystal substrate having a rough area at a given position in one surface thereof; (b) a conductive gallium nitride layer formed on said surface of said substrate; (c) a semi-insulating gallium nitride layer formed on said conductive gallium nitride layer, said semi-insulating gallium nitride layer including an impurity; (d) a high conductivity gallium nitride region formed on said conductive gallium nitride layer, said high conductivity region being formed at a position corresponding to said rough area, and extending to the level of the upper surface of said semi-insulating gallium nitride layer, said high conductivity region being simultaneously formed when said semi-insulating gallium nitride layer is formed to include said impurity, and having a conductance greater than that of the conductive gallium nitride layer, both said conductive gallium nitride layer and said semi-insulating gallium nitride layer being formed by a single epitaxial growth; (e) first and second electrodes respectively formed on said high conductivity region and said semi-insulating gallium nitride layer; and (f) a stem assembly having first and second stem electrodes and an insulator for insulating said first and second stem electrodes from each other, said first and second electrodes being respectively mounted on said first and second stem electrode.
Claim 20
Dependent Claim 205 words
A light-emittng diode chip comprising: (a) a single crystal substrate having an insulating film at a given position in one surface thereof; (b) a conductive gallium nitride layer formed on said surface of said substrate; (c) a semi-insulating gallium nitride layer formed on said conductive gallium nitride layer, said semi-insulating gallium nitride layer including an impurity; (d) a high conductivity region formed on said conductive gallium nitride layer, said high conductivity region being formed at a position corresponding to said insulating film, and extending to the level of the upper surface of said semi-insulating gallium nitride layer, said high conductivity region being simultaneously formed when said semi-insulating gallium nitride layer is formed to include said impurity, and having a conductance greater than that of the conductive gallium nitride layer, both said conductive gallium nitride layer and said semi-insulating gallium layer being formed by a single epitaxial growth; (e) first and second electrodes respectively formed on said high conductivity region and said semi-insulating gallium nitride layer; and (f) a stem assembly having first and second stem electrodes and an insulator for insulating said first and second stem electrodes from each other, said first and second electrodes being respectively mounted on said first and second stem electrodes.
Claim 21
Dependent Claim 205 words
A light-emittng diode chip comprising: (a) a single crystal substrate having an insulating film at a given position in one surface thereof; (b) a conductive gallium nitride layer formed on said surface of said substrate; (c) a semi-insulating gallium nitride layer formed on said conductive gallium nitride layer, said semi-insulating gallium nitride layer including an impurity; (d) a high conductivity region formed on said conductive gallium nitride layer, said high conductivity region being formed at a position corresponding to said insulating film, and extending to the level of the upper surface of said semi-insulating gallium nitride layer, said high conductivity region being simultaneously formed when said semi-insulating gallium nitride layer is formed to include said impurity, and having a conductance greater than that of the conductive gallium nitride layer, both said conductive gallium nitride layer and said semi-insulating gallium layer being formed by a single epitaxial growth; (e) first and second electrodes respectively formed on said high conductivity region and said semi-insulating gallium nitride layer; and (f) a stem assembly having first and second stem electrodes and an insulator for insulating said first and second stem electrodes from each other, said first and second electrodes being respectively mounted on said first and second stem electrodes.
Claim 22
Dependent Claim 17 words
A light-emitting diode as claimed in claim 16 or 17, further comprising a packaging having a lens.

References Cited (Backward Citations)

US3852796A Cited
US3922703A Cited
US4316208A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1986-08-01 1987-01-31 1987-08-02 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1990-08-01 1991-01-31 1991-08-02 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1994-08-01 1995-01-31 1995-08-02 $7700.00 Window Closed / Lapsed

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