US4392013A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Fine-patterned thick film conductor structure and manufacturing method thereof
Assignee: Asahi Kasei Corp
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Filing: 1980-12-22
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Granted: 1983-07-05
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Expires: 2000-12-22
Abstract
Abstract In manufacturing a fine-patterned thick film conductor structure, a thin film conductor layer having a film thickness of 0.1-10 μm is formed on an insulating substrate and conductive material is then electroplated on the thin film conductor layer to the thickness of 34.9-190 μm under the condition of a cathode current density of no less than 5 A/dm 2 . In patterning the conductors, a film thickness-to-conductor interspacing ratio is selected to be no less than 1.4 to prevent widthwise thickening of the conductors in the electroplating process. Resulting conductor structure has a circuit density of no less than 5 lines/mm and a film thickness of 35-200 μm. It is useful for a high density printed circuit board and a miniature coil.
Inventors
- 👤 Kaoru Ohmura
- 👤 Takeo Kimura
- 👤 Tetsuhiro Kusunose
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 00:04
CPC Classifications
H; H10; H10D; H10D84/00; H10D84/01; H05; H05K; H05K1/00; H05K1/16; H05K1/165; H05K3/00; H05K3/10; H05K3/108; H05K3/22; H05K3/24; H05K3/241; H05K1/02; H05K1/03; H05K1/0393; H05K2203/00; H05K2203/07; H05K2203/0703; H05K2203/0723; H05K3/18; H05K3/181; H05K3/38; H05K3/388
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
32 words
A fine-patterned thick film conductor structure having conductors formed on an insulating substrate, said conductors having a film thickness of 35-200 μm and a circuit density of no less than 5 lines/mm.
Claim 2
Dependent Claim
32 words
A fine-patterned thick film conductor structure having conductors formed on an insulating substrate, said conductors having a film thickness of 35-200 μm and a circuit density of no less than 5 lines/mm.
Claim 3
Dependent Claim
27 words
A fine-patterned thick film conductor structure according to claim 1 wherein said conductors comprise electroplated layers of thin film conductors each having a thickness of 0.1-10 μm.
Claim 4
Dependent Claim
21 words
A fine-patterned thick film conductor structure according to claim 1 or 2 wherein said conductors have conductor-to-conductor spacing of 0.5-100 μm.
Claim 5
Dependent Claim
25 words
A fine-patterned thick film conductor structure according to claim 1 or 2, wherein said conductors have a film thickness-to-interspacing ratio of no less than 1.4.
Claim 6
Dependent Claim
20 words
A fine-patterned thick film conductor structure according to claim 1 or 2, wherein said conductors are formed in spiral pattern.
Claim 7
Dependent Claim
19 words
A fine-patterned thick film conductor structure according to claim 1 or 2, wherein said conductors are made of copper.
Claim 8
Dependent Claim
20 words
A fine-patterned thick film conductor structure according to claim 1 or 2, wherein said insulating substrate is a polymer film.
Claim 9
Dependent Claim
24 words
A fine-patterned thick film conductor structure according to claim 1 or 2, wherein said conductors are formed on both sides of said insulating substrate.
Claim 10
Dependent Claim
18 words
A fine-patterned thick film conductor structure according to claim 8, wherein said conductors are interconnected by thru-hole connections.
Claim 11
Dependent Claim
53 words
A fine-patterned thick film coil comprising: an insulating substrate and a coil conductor pattern formed on the insulating substrate said conductors pattern having a film thickness of 35-200 μm, conductor-to-conductor spacing of 0.5-100 μm, a film thickness-to-interspacing ratio of no less than 1.4 and a circuit density of no less than 5 lines/mm.
Claim 12
Dependent Claim
53 words
A fine-patterned thick film coil comprising: an insulating substrate and a coil conductor pattern formed on the insulating substrate said conductors pattern having a film thickness of 35-200 μm, conductor-to-conductor spacing of 0.5-100 μm, a film thickness-to-interspacing ratio of no less than 1.4 and a circuit density of no less than 5 lines/mm.
Claim 13
Dependent Claim
71 words
A fine-patterned thick film coil comprising: an insulating substrate and a coil conductor pattern formed on the insulating substrate by electroplating under a cathode current density of at least 3 A/dm 2 , the conductor pattern having a thickness of 35 to 200 μm and comprising electroplated layers of thin fim conductors each having a thickness of 0.1 to 10 μm and a circuit density of no less than 5 lines/mm.
Claim 14
Dependent Claim
71 words
A fine-patterned thick film coil comprising: an insulating substrate and a coil conductor pattern formed on the insulating substrate by electroplating under a cathode current density of at least 3 A/dm 2 , the conductor pattern having a thickness of 35 to 200 μm and comprising electroplated layers of thin fim conductors each having a thickness of 0.1 to 10 μm and a circuit density of no less than 5 lines/mm.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-07-04 | 1987-01-03 | 1987-07-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-07-04 | 1991-01-03 | 1991-07-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-07-04 | 1995-01-03 | 1995-07-05 | $7700.00 | Window Closed / Lapsed |